Abstract: A light emitting device including: a light emitting element, a phosphor plate, and a light guiding part. The lower face of the light emitting element has a rectangular shape. The light guiding part covers lateral faces of the light emitting element and the lower face of the phosphor plate that is exposed from the light emitting element. The light guiding part has one or more lateral faces having at least one of structures below: a height at both ends being different from the height at a central area; outer lateral faces being parallel to the lateral faces of the light emitting element.

Abstract: A semiconductor device includes an insulating substrate,a semiconductor element disposed on an upper surface of the substrate, a heat dissipation member, and a metal bonding layer that bonds the lower surface of the substrate to the upper surface of the heat dissipation member, and the area of the upper surface of the heat dissipation member is larger than the area of the lower surface of the substrate, and the metal bonding layer contacts the whole of the lower surface of the substrate and has an area larger than the area of the lower surface of the substrate, and the heat conductivity of the metal bonding layer is higher than the heat conductivity of the heat dissipation member.

Abstract: A semiconductor light emitting device includes a lead frame 1 covered by a resin package 2. The lead frame 1 includes first and second leads 1A and 1B facing each other. The first and second leads 1A and 1B include inner lead sections 11 and 12 covered with the package 2, respectively. The first and second leads 1A and 1B include outer lead sections 13 protruding from package 2 ends. First and second exposed surfaces 51 and 52 are exposed from the package 2 in the first and second lead lower surfaces, respectively. The first lead 1A is longer than the second lead 1B. An LED 3 is mounted on the first lead upper surface. The second lead 1B includes second end portions 15 extending in the second exposed surface 52 from the both ends of the facing surface toward the first lead 1A.

Abstract: A light emitting device includes a light emitting element, a first light transmissive member, a second light transmissive member, and a light reflective member. The first light transmissive member contains a first phosphor. The first light transmissive member is in contact with an upper surface of the light emitting element, and has an area smaller than the light emitting element in a plan view. The second light transmissive member contains a second phosphor. The second light transmissive member covers lateral surfaces of the first light transmissive member and a part of the upper surface of the light emitting element that is exposed from the first light transmissive member, with an upper surface of the first light transmissive member being not covered by the second light transmissive member. The light reflective member covers lateral surfaces of the second light transmissive member and lateral surfaces of the light emitting element.

Abstract: A light emitting device includes a base member; a light emitting element mounted on the base member; a light-transmissive member that covers an upper surface of the light emitting element, and is substantially rectangular in a plan view; and a light reflecting member that covers a lateral surface of the light-transmissive member, the light reflecting member having a substantially rectangular frame shape in a plan view. A width of the light reflecting member is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member. A height of the light reflecting member is smaller along the short side of the light-transmissive member than along the long side of the light-transmissive member at a position separated from an outer edge of the light reflecting member by a predetermined distance.

Abstract: A light emitting device includes a mounting board including: a base part, and one or more wiring structures, each of which includes one or more first wiring parts, and one or more second wiring parts, in that order, from a base part side, wherein, in a plan view, an area of each of the one or more second wiring parts is smaller than an area of each of the one or more first wiring parts; one or more light emitting elements bonded to the second wiring parts via bonding members; and a reflective member covering at least a portion of the bonding members and at least a portion of the one or more wiring structures. A reflectance of the one or more first wiring parts is higher than a reflectance of the bonding members. The one or more second wiring parts and the bonding members comprise the same material at their outermost surfaces.

Abstract: A light emitting device includes a base member; a light emitting element mounted on the base member; a light-transmissive member that covers an upper surface of the light emitting element, and is substantially rectangular in a plan view; and a light reflecting member that covers a lateral surface of the light-transmissive member, the light reflecting member having a substantially rectangular frame shape in a plan view. A width of the light reflecting member is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member. A height of the light reflecting member is smaller along the short side of the light-transmissive member than along the long side of the light-transmissive member at a position separated from an outer edge of the light reflecting member by a predetermined distance.

Abstract: A light-emitting device includes a light-emitting element; a first light transmissive member that is disposed over the light-emitting element and that includes a first upper surface, a lower surface, a first lateral surface; and a second lateral surface positioned outside the first lateral surface, a second light transmissive member that covers at least a part of the first lateral surface; and a light reflective member that is disposed on a lateral surface of the second light transmissive member, the second lateral surface of the first light transmissive member, and a lateral surface of the light-emitting element.

Abstract: A light-emitting device includes a light-emitting element; a first light transmissive member that is disposed over the light-emitting element and that includes a first upper surface, a lower surface, a first lateral surface; and a second lateral surface positioned outside the first lateral surface, a second light transmissive member that covers at least a part of the first lateral surface; and a light reflective member that is disposed on a lateral surface of the second light transmissive member, the second lateral surface of the first light transmissive member, and a lateral surface of the light-emitting element.

Abstract: A light emitting device includes a base member; a light emitting element mounted on the base member; a light-transmissive member that covers an upper surface of the light emitting element, and is substantially rectangular in a plan view; and a light reflecting member that covers a lateral surface of the light-transmissive member, the light reflecting member having a substantially rectangular frame shape in a plan view. A width of the light reflecting member is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member. A height of the light reflecting member is smaller along the short side of the light-transmissive member than along the long side of the light-transmissive member at a position separated from an outer edge of the light reflecting member by a predetermined distance.

Abstract: A semiconductor device includes an insulating substrate,a semiconductor element disposed on an upper surface of the substrate, a heat dissipation member, and a metal bonding layer that bonds the lower surface of the substrate to the upper surface of the heat dissipation member, and the area of the upper surface of the heat dissipation member is larger than the area of the lower surface of the substrate, and the metal bonding layer contacts the whole of the lower surface of the substrate and has an area larger than the area of the lower surface of the substrate, and the heat conductivity of the metal bonding layer is higher than the heat conductivity of the heat dissipation member.

Abstract: A semiconductor light emitting device includes a lead frame 1 covered by a resin package 2. The lead frame 1 includes first and second leads 1A and 1B facing each other. The first and second leads 1A and 1B include inner lead sections 11 and 12 covered with the package 2, respectively. The first and second leads 1A and 1B include outer lead sections 13 protruding from package 2 ends. First and second exposed surfaces 51 and 52 are exposed from the package 2 in the first and second lead lower surfaces, respectively. The first lead 1A is longer than the second lead 1B. An LED 3 is mounted on the first lead upper surface. The second lead 1B includes second end portions 15 extending in the second exposed surface 52 from the both ends of the facing surface toward the first lead 1A.