Patents by Inventor Satoshi Shida

Satoshi Shida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080163481
    Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.
    Type: Application
    Filed: March 6, 2008
    Publication date: July 10, 2008
    Inventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
  • Patent number: 7353596
    Abstract: In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: April 8, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Shida, Shinji Kanayama, Shunji Onobori, Shuichi Hirata, Mamoru Nakao, Kunio Oe, Akira Kugihara, Shoriki Narita, Yoshitaka Etoh, Hiroshi Haji
  • Patent number: D565752
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: April 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D565754
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: April 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D565755
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: April 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D565756
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: April 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D566303
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: April 8, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D568500
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: May 6, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D569529
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: May 20, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D570003
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: May 27, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D570506
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: June 3, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D571938
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: June 24, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D572387
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: July 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D572388
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: July 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D573553
    Type: Grant
    Filed: August 8, 2007
    Date of Patent: July 22, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Satoshi Shida, Hiroyuki Naito
  • Patent number: D573730
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: July 22, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D573731
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: July 22, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Yasuharu Ueno, Satoshi Shida, Yuji Omata
  • Patent number: D576576
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: September 9, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Shida, Nobuyuki Matsui, Yoshihiko Kanayama, Makoto Morikawa
  • Patent number: D576970
    Type: Grant
    Filed: April 25, 2008
    Date of Patent: September 16, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaari Uemoto, Keiji Nishimoto, Satoshi Shida, Hiroyuki Naito
  • Patent number: D577690
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: September 30, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Satoshi Shida, Nobuyuki Matsui, Yoshihiko Kanayama, Makoto Morikawa