Abstract: A teaching device includes an image acquisition unit which acquires an image including a manipulation target object which is linked to operations of an arm of a robot and a teaching position of the manipulation target object, a movement control unit which controls the arm to move the manipulation target object in the image to the teaching position, and a teaching information acquisition unit which acquires a state of the arm in a state in which the manipulation target object in the image is present at the teaching position as teaching information.

Abstract: A teaching device includes an image acquisition unit which acquires an image including a manipulation target object which is linked to operations of an arm of a robot and a teaching position of the manipulation target object, a movement control unit which controls the arm to move the manipulation target object in the image to the teaching position, and a teaching information acquisition unit which acquires a state of the arm in a state in which the manipulation target object in the image is present at the teaching position as teaching information.

Abstract: A method for manufacturing a camera module includes preparing an image capturing unit, preparing a lens unit, detecting the center of a light receiving surface of an image capturing element arranged in the image capturing unit, detecting the center of an opening of a diaphragm arranged in the lens unit, aligning the lens unit and the image capturing unit so that the center of the opening of the diaphragm coincides with the center of the light receiving surface of the image capturing element, and joining the lens unit and the image capturing unit after the aligning the lens unit and the image capturing unit.

Abstract: A camera module of the present invention includes a wiring substrate having a connection pad, and on which an imaging device is mounted, on an upper surface side thereof, and a lens unit provided on the wiring substrate and equipped with a lens portion arranged over the imaging device, an actuator (voice coil motor) for driving the lens portion, and projected connection terminal protruding downward and connected to the actuator. The projected connection terminal of the lens unit is arranged on the connection pad of the wiring substrate, and the connection pad and the projected connection terminal are joined mutually by a conductive adhesive agent.

Abstract: A camera module of the present invention includes a wiring substrate having a connection pad, and on which an imaging device is mounted, on an upper surface side thereof, and a lens unit provided on the wiring substrate and equipped with a lens portion arranged over the imaging device, an actuator (voice coil motor) for driving the lens portion, and projected connection terminal protruding downward and connected to the actuator. The projected connection terminal of the lens unit is arranged on the connection pad of the wiring substrate, and the connection pad and the projected connection terminal are joined mutually by a conductive adhesive agent.

Abstract: A camera module includes: a case including a first surface formed with a first opening for entering incident light, and a second surface opposite to the first surface, the second surface being formed with a second opening; a lens unit mounted in the case; a first substrate including a front surface and a back surface, wherein the case is bonded to the front surface of the first substrate to seal the second opening; a filter supported by the first substrate to face the lens unit; a circuit component disposed on the front surface of the first substrate; a second substrate including a front face and a back face, wherein the front face of the second substrate is bonded to the back surface of the first substrate; and an image pickup device disposed on the front face of the second substrate to face the filer.

Abstract: A camera module includes: a case including a first surface formed with a first opening for entering incident light, and a second surface opposite to the first surface, the second surface being formed with a second opening; a lens unit mounted in the case; a first substrate including a front surface and a back surface, wherein the case is bonded to the front surface of the first substrate to seal the second opening; a filter supported by the first substrate to face the lens unit; a circuit component disposed on the front surface of the first substrate; a second substrate including a front face and a back face, wherein the front face of the second substrate is bonded to the back surface of the first substrate; and an image pickup device disposed on the front face of the second substrate to face the filer.

Abstract: A camera module is provided wherein an image pickup device, a camera optical system and a driver, for aligning and focusing the camera optical system, are mounted on a board; wherein a connection terminal, to be electrically connected to the driver, is formed on a mounting face of the board; and wherein the connection terminal formed on the board is connected to the driver via a flexible wiring board.

Abstract: A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the substrate; and an adhesive for bonding the sealing structure and the substrate, wherein the sealing structure has a groove for storing the adhesive.

Abstract: A camera module of the present invention includes a wiring substrate having a connection pad, and on which an imaging device is mounted, on an upper surface side thereof, and a lens unit provided on the wiring substrate and equipped with a lens portion arranged over the imaging device, an actuator (voice coil motor) for driving the lens portion, and projected connection terminal protruding downward and connected to the actuator. The projected connection terminal of the lens unit is arranged on the connection pad of the wiring substrate, and the connection pad and the projected connection terminal are joined mutually by a conductive adhesive agent.

Abstract: A flexible substrate is connectable to electrodes of an external member. The flexible substrate includes a base material having flexibility and including an insulative base film and a conductive film. Lead parts are arranged on an end of the base material. Slits are formed between the lead parts.

Abstract: A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the substrate; and an adhesive for bonding the sealing structure and the substrate, wherein the sealing structure has a groove for storing the adhesive.

Abstract: A camera module is provided wherein an image pickup device, a camera optical system and a driver, for aligning and focusing the camera optical system, are mounted on a board; wherein a connection terminal, to be electrically connected to the driver, is formed on a mounting face of the board; and wherein the connection terminal formed on the board is connected to the driver via a flexible wiring board.

Abstract: In an image pickup module, a substrate, on which an image pickup element is mounted, is mounted-in a-casing portion of a holder, which includes a barrel portion supporting a light receiving lens and also includes the casing portion, by aligning a light receiving surface of the image pickup element with the light receiving lens. The holder is provided with a partitioning wall adapted to partition off a region, on which the image pickup element is mounted, on the substrate from outer regions.

Abstract: A manufacturing method of a semiconductor device that is sealed by bonding a sealing member to a substrate mounting a semiconductor element thereon includes the steps of: forming an opening in the sealing member; and closing the opening after the sealing member is bonded to the substrate.

Abstract: A manufacturing method of a semiconductor device that is sealed by bonding a sealing member to a substrate mounting a semiconductor element thereon includes the steps of: forming an opening in the sealing member; and closing the opening after the sealing member is bonded to the substrate.

Abstract: A flexible substrate is connectable to electrodes of an external member. The flexible substrate includes a base material having flexibility and including an insulative base film and a conductive film. Lead parts are arranged on an end of the base material. Slits are formed between the lead parts.

Abstract: A process for producing an optical transmission fiber is provided which comprises feeding highly pure halides, hydrides or organic compounds of Si and B by way of carrier gas on the outer surface of a fused silica rod or a fused silica pipe, or inner surface of a fused silica pipe, oxidizing them and depositing the products to form a pure fused silica layer or a doped fused silica layer containing B.sub.2 O.sub.3, melting the pipe and the deposited layer followed by a spinning. The SiO.sub.2 layer can alternatively contain fluorine instead of B.sub.2 O.sub.3. A further SiO.sub.2 layer can be deposited thereon to improve the spinning processability and lower the index of refraction of the B.sub.2 O.sub.3 containing layer.

Abstract: A process for producing an optical transmission fiber is provided which comprises feeding highly pure halides, hydrides or organic compounds of Si and B by way of carrier gas on the outer surface of a fused silica rod or a fused silica pipe, or inner surface of a fused silica pipe, oxidizing them and depositing the products to form a pure fused silica layer or a doped fused silica layer containing B.sub.2 O.sub.3, melting the pipe and the deposited layer followed by a spinning. The SiO.sub.2 layer can alternatively contain fluorine instead of B.sub.2 O.sub.3. A further SiO.sub.2 layer can be deposited thereon to improve the spinning processability and lower the index of refraction of the B.sub.2 O.sub.3 containing layer.

Abstract: A process for producing an optical transmission fiber is provided which comprises feeding highly pure halides, hydrides or organic compounds of Si and B by way of carrier gas on the outer surface of a fused silica rod or a fused silica pipe, or inner surface of a fused silica pipe, oxidizing them and depositing the products to form a pure fused silica layer or a doped fused silica layer containing B.sub.2 O.sub.3, melting the pipe and the deposited layer followed by a spinning. The SiO.sub.2 layer can alternatively contain fluorine instead of B.sub.2 O.sub.3. A further SiO.sub.2 layer can be deposited thereon to improve the spinning processability and lower the index of refraction of the B.sub.2 O.sub.3 containing layer.