Patents by Inventor Satoshi Tazaki

Satoshi Tazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11322269
    Abstract: An electroconductive film including a resin layer and an electroconductive layer, wherein the resin layer has a storage elastic modulus at 25° C. of more than 10 MPa and less than 1,000 MPa, and the electroconductive layer has a surface resistance value of 1,000 ?/sq. or less.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: May 3, 2022
    Assignee: ZEON CORPORATION
    Inventors: Kenichi Harai, Satoshi Tazaki, Kazuyuki Obuchi
  • Patent number: 10374190
    Abstract: A sealing film including a substrate film, a sealing layer, and an adhesive layer in this order, wherein the sealing film has a tensile elastic modulus of equal to or higher than 1,000 MPa, and retardation of a layer portion provided at the sealing layer side relative to the substrate film in the sealing film after sealing is equal to or smaller than 20 nm.
    Type: Grant
    Filed: December 25, 2014
    Date of Patent: August 6, 2019
    Assignee: ZEON CORPORATION
    Inventors: Satoshi Tazaki, Hiroyasu Inoue, Atsushi Ishiguro, Yohei Koide
  • Publication number: 20190139673
    Abstract: An electroconductive film including a resin layer and an electroconductive layer, wherein the resin layer has a storage elastic modulus at 25° C. of more than 10 MPa and less than 1,000 MPa, and the electroconductive layer has a surface resistance value of 1,000 ?/sq. or less.
    Type: Application
    Filed: June 23, 2017
    Publication date: May 9, 2019
    Applicant: ZEON CORPORATION
    Inventors: Kenichi HARAI, Satoshi TAZAKI, Kazuyuki OBUCHI
  • Publication number: 20160343970
    Abstract: A sealing film including a substrate film, a sealing layer, and an adhesive layer in this order, wherein the sealing film has a tensile elastic modulus of equal to or higher than 1,000 MPa, and retardation of a layer portion provided at the sealing layer side relative to the substrate film in the sealing film after sealing is equal to or smaller than 20 nm.
    Type: Application
    Filed: December 25, 2014
    Publication date: November 24, 2016
    Applicant: ZEON CORPORATION
    Inventors: Satoshi TAZAKI, Hiroyasu INOUE, Atsushi ISHIGURO, Yohei KOIDE
  • Publication number: 20150307758
    Abstract: An organic electronic device sealing resin composition including a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds of a block copolymer, wherein the block copolymer includes: two or more polymer blocks [A] per one molecule of the copolymer, the block having an aromatic vinyl compound unit as a main component; and one or more polymer blocks [B] per one molecule of the copolymer, the block having a linear conjugated diene compound unit as a main component, and a ratio between a weight fraction wA of all the polymer blocks [A] in the entire block copolymer and a weight fraction wB of all the polymer blocks [B] in the entire block copolymer (wA:wB) is 20:80 to 60:40.
    Type: Application
    Filed: November 28, 2013
    Publication date: October 29, 2015
    Inventors: Satoshi TAZAKI, Motofumi KASHIWAGI, Atsushi ISHIGURO, Yohei KOIDE
  • Publication number: 20080153008
    Abstract: The present invention is to provide an optical element in which both a good light diffusion performance and a good light transmittance are achieved and which is less subject to environmental influence, a method for production thereof and a display device using the optical element. An optical element including a molded body containing a resin having an alicyclic structure, wherein a fine hologram surface diffusion pattern has been precisely formed is provided. It is preferable that the optical element is a light diffusion plate or a light diffusion sheet. Further, it is preferable that the optical element is a molded body made by injection-molding.
    Type: Application
    Filed: February 17, 2005
    Publication date: June 26, 2008
    Inventors: Masahiko Hayashi, Toshiaki Suzuki, Keisuke Tsukada, Akiyoshi Shibuya, Satoshi Tazaki, Kazuyuki Obuchi
  • Publication number: 20070222092
    Abstract: Molds for injection molding a light guide plate in which a plurality of pin gates and/or film gates for injecting a melted resin material for molding into the cavity portion are formed at portions corresponding to the side portions of the product, a room for balancing flow having an ear shaped portion to which the material is supplied is disposed between each gate and a sprue or a runner, and the area of each gate is set so that the temperature of the material introduced into the cavity is higher than that supplied to each room by at least 5° C. due to heat generated from shearing when the material passes through the gate; and a process for producing a light guide plate using the molds. Formation of weld lines, sink marks, flow marks and warp is suppressed, and a product exhibiting excellent quality without the necessity of steps of gate cutting and finishing can be obtained.
    Type: Application
    Filed: March 28, 2005
    Publication date: September 27, 2007
    Inventors: Masahiko Hayashi, Kazunori Ueki, Satoshi Tazaki, Kazuyuki Obuchi
  • Publication number: 20070200263
    Abstract: A light diffusion plate obtained by injection molding of a thermoplastic resin and having an approximately rectangular shape having a length of a diagonal line of 400 mm or longer, wherein the fluctuation in the thickness is 200 ?m or smaller, the warp is 2 mm or smaller, the fluctuation in the transmittance is 8% or smaller and the dispersion in the y-value of the reflected light is 0.004 or smaller, and a process for producing the light diffusion plate are provided. The light diffusion plate exhibits the high luminance and the small unevenness in the luminance and provides a display of images having an excellent quality on liquid display devices.
    Type: Application
    Filed: March 10, 2005
    Publication date: August 30, 2007
    Inventors: Satoshi Tazaki, Kohei Arakawa, Kazuyuki Obuchi, Keisuke Tsukada, Naoki Murata
  • Patent number: 6964806
    Abstract: A molding having an ink layer, wherein the molding is formed from an alicyclic structure-containing polymer, the ink layer is provided after a pattern on the surface of the molding, and the retention of the ink layer when a 1-cm2 portion arbitrarily selected from the surface of the molding containing the patterned ink layer is subjected to a tape peeling adhesion test is at least 80%. A molding having an ink layer, wherein the molding is formed from an alicyclic structure-containing polymer, and the ink layer is provided after a pattern on the surface of the molding and has an index of wetting of at most 42 dyn/cm.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: November 15, 2005
    Assignee: Zeon Corporation
    Inventor: Satoshi Tazaki
  • Patent number: 6743851
    Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: June 1, 2004
    Assignees: Nippon Zeon Co., Ltd., Fujitsu Limited
    Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
  • Patent number: 6734248
    Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: May 11, 2004
    Assignees: Nippon Zeon Co., Ltd., Fujitsu Limited
    Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
  • Publication number: 20020035196
    Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
    Type: Application
    Filed: September 25, 2001
    Publication date: March 21, 2002
    Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
  • Publication number: 20020032273
    Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
    Type: Application
    Filed: September 25, 2001
    Publication date: March 14, 2002
    Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
  • Patent number: 6310135
    Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
    Type: Grant
    Filed: February 20, 1998
    Date of Patent: October 30, 2001
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
  • Patent number: 5777068
    Abstract: Provided are photosensitive resin compositions comprising a polyamic compound having, at each terminal thereof, a specific actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group and a solvent. The photosensitive resin compositions of the invention are excellent in resist properties such as sensitivity and good in storage stability and can provide a film small in residual stress.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: July 7, 1998
    Assignees: Nippon Zeon Co., Ltd., Fujitsu Limited
    Inventors: Akira Tanaka, Satoshi Tazaki, Kei Sakamoto, Yasuhiro Yoneda, Kishio Yokouchi, Daisuke Mizutani, Yoshikatsu Ishizuki