Patents by Inventor Satoshi USUDA

Satoshi USUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11911341
    Abstract: Provided is a multilayer vessel excellent in gas barrier performance and transparency and its application. The multilayer vessel contains a layer (X) that contains at least one type of polyolefin resin as the major ingredient; and a layer (Y) that contains a polyamide resin (A) as the major ingredient, the polyamide resin (A) being composed of a structural unit derived from diamine, and a structural unit derived from dicarboxylic acid, 70 mol % or more of the structural unit derived from diamine being derived from metaxylylenediamine, meanwhile 30 to 60 mol % of the structural unit derived from dicarboxylic acid being derived from straight chain aliphatic ?,?-dicarboxylic acid having 4 to 20 carbon atoms, and 70 to 40 mol % being derived from isophthalic acid.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: February 27, 2024
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shota Arakawa, Toshiya Naito, Satoshi Okada, Kenichiro Usuda, Takumi Toida, Haruka Okazaki, Fumihiro Ito
  • Patent number: 8536486
    Abstract: A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: September 17, 2013
    Assignee: Disco Corporation
    Inventors: Kenji Furuta, Satoshi Usuda
  • Patent number: 8476553
    Abstract: A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: July 2, 2013
    Assignee: Disco Corporation
    Inventors: Satoshi Usuda, Kiyoshi Ohsuga, Masaru Nakamura
  • Publication number: 20120061361
    Abstract: A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region on through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 15, 2012
    Applicant: DISCO CORPORATION
    Inventors: Satoshi Usuda, Kiyoshi Ohsuga, Masaru Nakamura
  • Publication number: 20110290769
    Abstract: A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.
    Type: Application
    Filed: May 23, 2011
    Publication date: December 1, 2011
    Applicant: DISCO CORPORATION
    Inventors: Kenji FURUTA, Satoshi USUDA