Patents by Inventor Satoshi Yonemoto

Satoshi Yonemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11920076
    Abstract: A fire retardant material comprising a carbon fiber which tensile elasticity is 700 GPa or more, and a fire retardant resin such as polycarbonate.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: March 5, 2024
    Assignee: TOKYO UNIVERSITY OF SCIENCE FOUNDATION
    Inventors: Koichi Yonemoto, Kiyoto Murakami, Satoshi Nonaka
  • Patent number: 10663928
    Abstract: According to one embodiment, an electronic device comprises an integrated circuit and a processor. The processor is configured to: determine whether there is an abnormality occurring in the integrated circuit; and stop power supply to the integrated circuit if there is an abnormality occurring in the integrated circuit, and supply power to the integrated circuit after stopping the power supply for a predetermined time.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: May 26, 2020
    Assignees: KABUSHIKI KAISHA TOSHIBA, Toshiba Infrastructure Systems & Solutions Corporation
    Inventor: Satoshi Yonemoto
  • Publication number: 20180181084
    Abstract: According to one embodiment, an electronic device comprises an integrated circuit and a processor. The processor is configured to: determine whether there is an abnormality occurring in the integrated circuit; and stop power supply to the integrated circuit if there is an abnormality occurring in the integrated circuit, and supply power to the integrated circuit after stopping the power supply for a predetermined time.
    Type: Application
    Filed: February 22, 2018
    Publication date: June 28, 2018
    Inventor: Satoshi Yonemoto
  • Publication number: 20130186192
    Abstract: A wind tunnel test model (1) includes a half model portion (3) that simulates a fuselage portion of an airframe with a single wing and a supporting apparatus (5) that supports the half model portion rotatably about a central axis. The supporting apparatus has a horizontal cross-sectional shape that is approximately the same as or similar to that of the fuselage portion (7) and extends rearward of the fuselage portion, includes, toward its rear end, a fixing portion (11) that fixes the half model portion to a wind tunnel test apparatus side, and includes, within a housing, a torsional rigidity imparting unit.
    Type: Application
    Filed: September 30, 2011
    Publication date: July 25, 2013
    Inventors: Motohide Uehara, Satoshi Yonemoto, Hidehiko Kato, Takayuki Nomura, Masashi Nagahata
  • Patent number: 8121243
    Abstract: Monitor-guide-tube fixing sections are fixed to portions on a core support plate side of a plurality of in-core monitor guide tubes disposed in a reactor vessel. The monitor-guide-tube fixing sections are fixed to the core support plate disposed in the reactor vessel to fix the in-core monitor guide tubes to the core support plate. This makes it possible to realize improvement of rigidity of the fixed sections of the in-core monitor guide tubes. A tie plate is fixed to the in-core monitor guide tubes. The in-core monitor guide tubes are coupled by the tie plate. This makes it possible to realize improvement of rigidity of the entire in-core monitor guide tubes. As a result, it is possible to realize vibration damping for the in-core monitor guide tubes.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: February 21, 2012
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Satoshi Yonemoto, Shigeyuki Watanabe, Makoto Nakajima
  • Publication number: 20070019774
    Abstract: Monitor-guide-tube fixing sections are fixed to portions on a core support plate side of a plurality of in-core monitor guide tubes disposed in a reactor vessel. The monitor-guide-tube fixing sections are fixed to the core support plate disposed in the reactor vessel to fix the in-core monitor guide tubes to the core support plate. This makes it possible to realize improvement of rigidity of the fixed sections of the in-core monitor guide tubes. A tie plate is fixed to the in-core monitor guide tubes. The in-core monitor guide tubes are coupled by the tie plate. This makes it possible to realize improvement of rigidity of the entire in-core monitor guide tubes. As a result, it is possible to realize vibration damping for the in-core monitor guide tubes.
    Type: Application
    Filed: June 27, 2006
    Publication date: January 25, 2007
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Satoshi Yonemoto, Shigeyuki Watanabe, Makoto Nakajima
  • Patent number: 5291788
    Abstract: A semiconductor pressure sensor according to the invention comprises a first semiconductor substrate and a second semiconductor substrate, disposed around the first substrate, so that signals obtained by the semiconductor pressure sensor under static or differential pressure conditions can be properly corrected and both static and differential pressures can be detected accurately and reliably measured on the same semiconductor substrates. Another object of the invention is provide a semiconductor pressure sensor which utilizes a single substrate with an aperture, which acts as a pressure overload stop mechanism, and which does not suffer from any effects of diaphragm deformation as a result of possible pressure overload.
    Type: Grant
    Filed: September 24, 1992
    Date of Patent: March 8, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Satoshi Oohata, Satoshi Yonemoto, Wataru Fukai