Abstract: A communication device includes: a transmission unit configured to transmit a connection request to a first communication device; a reception unit configured to receive connection permission from the first communication device; and a control unit configured to establish a first connection to the first communication device. The control unit controls a communication of a second communication device, and the transmission unit transmits information related to control of the second communication device to the first communication device in a case where the connection to the first communication device is established.

Abstract: A communication device includes: a transmission unit configured to transmit a connection request to a first communication device; a reception unit configured to receive a connection permission from the first communication device; and a control unit configured to establish a first connection to the first communication device. The control unit controls a communication of a second communication device and performs a communication with the second communication device, and the second communication device performs a communication with a third communication device that includes: a transmission unit that transmits a connection request to the first communication device; a reception unit that receives a connection permission from the first communication device; and a control unit that establishes a first connection with the first communication device.

Abstract: A communication device includes: a control unit configured to autonomously determine a resource to be used for transmission; a reception unit configured to execute an LBT (Listen before talk) before transmitting a signal by using the resource; and a transmission unit configured to transmit the signal to another communication device by using the resource in a case where the reception unit succeeds in the LBT, wherein the transmission unit determines transmission beamforming to be applied upon transmitting the signal, based on reception beamforming applied to the LBT by the reception unit.

Abstract: A communication device includes: a control unit configured to determine a priority to apply to a data signal; and a transmitting unit configured to transmit information that indicates the determined priority, and the data signal to which the determined priority is applied, in autonomously selected resources, to another communication device.

Abstract: A communication device has: a receiving unit configured to receive information from another communication device; a control unit configured to determine an MCS (Modulation and Coding Scheme) based on the information; and a transmitting unit configured to transmit a signal, to which the MCS is applied, in autonomously selected resources, to the another communication device.

Abstract: To appropriately control communication even when a reference signal is dynamically triggered, a user terminal according to one aspect of the present disclosure includes: a receiving section that receives a downlink shared channel and a Channel State Information (CSI) reference signal; and a control section that, when first downlink control information used to schedule the downlink shared channel and second downlink control information used to trigger the CSI reference signal are transmitted by different cells, and resources respectively indicated by the first downlink control information and the second downlink control information overlap, performs control not to perform at least one of reception of the downlink shared channel and measurement that uses the CSI reference signal.

Abstract: A user equipment includes a transmitting unit configured to transmit a groupcast to a group including a plurality of user equipments, a receiving unit configured to receive a response related to a retransmission control for the groupcast, and a control unit configured to control a leakage power to another channel arranged by frequency division with a channel via which a response related to the retransmission control for the groupcast is received.

Abstract: A transmission node includes: a reception unit configured to execute an LBT (Listen before talk) in a time interval immediately before transmitting a signal; a transmission unit configured to transmit a signal in a case where reception power is less than a threshold value in the time interval; and a control unit configured to, in a case where multiple signals are to be transmitted, change control related to the LBT for a signal to be transmitted for a first time and change control related to the LBT for a signal to be transmitted other than for the first time.

Abstract: A communication apparatus includes a receiving unit configured to receive, from another communication apparatus, a plurality of requests to transmit a signal in a resource autonomously selected by the another communication apparatus; a control unit configured to control the transmitting of a plurality of the signals respectively corresponding to the plurality of the requests, based on a condition; and a transmitting unit configured to transmit, to the another communication apparatus, at least a predetermined number of signals among the plurality of signals.

Abstract: A liquid ejecting apparatus includes an ejection portion and a circuit. The ejection portion has a plurality of ejection ports configured to eject liquid supplied from a liquid storage portion defining a liquid storage space configured to store liquid. The circuit is electrically connected to at least one of a bottom electrode and a side electrode. The circuit is configured to detect a capacitance between the bottom electrode and the side electrode. The bottom electrode is provided at a bottom surface of the liquid storage portion. The side electrode is provided at one side surface of the liquid storage portion and electrically isolated from the bottom electrode.

Abstract: In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.

Abstract: A liquid ejecting apparatus includes an ejection portion and a circuit. The ejection portion has a plurality of ejection ports configured to eject liquid supplied from a liquid storage portion defining a liquid storage space configured to store liquid. The circuit is electrically connected to at least one of a bottom electrode and a side electrode. The circuit is configured to detect a capacitance between the bottom electrode and the side electrode. The bottom electrode is provided at a bottom surface of the liquid storage portion. The side electrode is provided at one side surface of the liquid storage portion and electrically isolated from the bottom electrode.

Abstract: The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

Abstract: A liquid ejecting apparatus includes an ejection portion and a circuit. The ejection portion has a plurality of ejection ports configured to eject liquid supplied from a liquid storage portion defining a liquid storage space configured to store liquid. The circuit is electrically connected to at least one of a bottom electrode and a side electrode. The circuit is configured to detect a capacitance between the bottom electrode and the side electrode. The bottom electrode is provided at a bottom surface of the liquid storage portion. The side electrode is provided at one side surface of the liquid storage portion and electrically isolated from the bottom electrode.

Abstract: A die mounting system in which die supply device is set on component mounter and dies supplied from die supply device are mounted on circuit board by mounting head of component mounter, determines the next die transfer position is determined such that the longer of time required for die transfer preparation operation (die imaging and image processing, die pickup operation, and movement and vertical inverting operation of a supply head) of die supply device and time required for die mounting operation (movement and vertical motion at the mounting position of mounting head) of component mounter is made shorter, and the difference (which corresponds to the waiting time at the die transfer position) between the two times decreased, such that the cycle time is shortened.

Abstract: A liquid ejecting apparatus includes an ejection portion and a circuit. The ejection portion has a plurality of ejection ports configured to eject liquid supplied from a liquid storage portion defining a liquid storage space configured to store liquid. The circuit is electrically connected to at least one of a bottom electrode and a side electrode. The circuit is configured to detect a capacitance between the bottom electrode and the side electrode. The bottom electrode is provided at a bottom surface of the liquid storage portion. The side electrode is provided at one side surface of the liquid storage portion and electrically isolated from the bottom electrode.

Abstract: In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.

Abstract: The inspection support device is provided with a camera provided on a moving body so as to be capable of imaging a circuit board, and an imaging control section configured to control imaging processing of the camera and acquire image data of an inspection component, which is a component that is a target for inspection among electronic components mounted by the component mounter, when the inspection component is mounted on the circuit board. The imaging control section optimizes the performance sequence of multiple of the mounting operations and multiple of the imaging operations based on a moving distance of the moving body during the performance sequence or based on a time required for the mounting operation and the imaging operation during the performance sequence.

Abstract: In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.

Abstract: In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.