Patents by Inventor Satowaka Kuroda

Satowaka Kuroda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for testing semiconductor integrated circuits and method of testing the same
    Patent number: 5089772
    Abstract: Tests of a semiconductor IC is conducted first by bringing a plurality of conductive pattern circuits formed on an insulator sheet into contact with a plurality of bump electrodes formed on a substrate of the semiconductor, second by connecting a plurality of signal transmission pattern circuits formed on a transmission circuit substrate with each conductive pattern circuit of the insulator sheet, and then by connecting the transmission circuit substrate with a body of the testing device. A probing test can be simplified since there is no need to manually adjust positions of conventional probe needles. Further, semiconductor ICs having a lot of bump electrodes can be test without being damaged.
    Type: Grant
    Filed: March 9, 1990
    Date of Patent: February 18, 1992
    Assignees: Matsushita Electric Industrial Co. Ltd., Martec Corporation
    Inventors: Kenzo Hatada, Takeshi Ishihara, Nobuaki Suzuki, Satowaka Kuroda