Abstract: Dielectric oxide materials prepared by producing a sol from a mixture of a metal oxide precursor, a solvent, and an epoxide, and preparing a metal oxide material from the sol. In various versions, the mixture can also include a cosolvent, one or more additional metal oxide precursors, water, or a precursor to a glassforming oxide, or any combination thereof. The prepared dielectric oxide materials can be in the form of thin films having high ? values, low electrical leakage, and low dielectric loss tangent values.

Abstract: A method of embedding thick-film fired-on-foil capacitors includes entirely covering the dielectric with an encapsulating electrode to avoid cracking in the dielectric due to shrinkage and temperature coefficient of expansion differences between the electrode and dielectric.

Abstract: A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the outer layer of the power core with both first and second electrodes of the capacitor on the outer layer of the power core so that at least one Vcc (power) terminal and at least one Vss (ground) terminal of a semiconductor device can be directly connected to at least one first and at least one second electrode, respectively.

Abstract: Making process test capacitors simultaneously with circuit capacitors that are to be embedded into a printed wiring board and firing the test capacitors to result in fired-on-foil test capacitors for the purpose of using the test capacitors as test substitutes for the embedded circuit capacitors to predict whether capacitance, dissipation factor or insulation resistance of the circuit capacitors will fall within acceptable specified ranges prior to and after embedment.

Abstract: Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials.

Abstract: Making process test capacitors simultaneously with circuit capacitors that are to be embedded into a printed wiring board and firing the test capacitors to result in fired-on-foil test capacitors for the purpose of using the test capacitors as test substitutes for the embedded circuit capacitors to predict whether capacitance, dissipation factor or insulation resistance of the circuit capacitors will fall within acceptable specified ranges prior to and after embedment.

Abstract: A device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor wherein said embedded singulated capacitor comprises at least a first electrode and a second electrode and wherein said embedded singulated capacitor is positioned on the outer layer of the power core with both first and second electrodes of the capacitor on the outer layer of the power core so that at least one Vcc (power) terminal and at least one Vss (ground) terminal of a semiconductor device can be directly connected to at least one first and at least one second electrode, respectively.

Abstract: Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials.

Abstract: Disclosed is an improved method of embedding capacitors in printed wiring boards (PWB) made from thick film dielectrics and electrodes.

Abstract: A method of embedding thick-film fired-on-foil capacitors includes entirely covering the dielectric with an encapsulating electrode to avoid cracking in the dielectric due to shrinkage and temperature coefficient of expansion differences between the electrode and dielectric.

Abstract: A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry.

Abstract: A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry.

Abstract: Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials.

Abstract: A method of embedding thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from coming in contact with and damaging the capacitor layers.

Abstract: Innerlayer panels are provided with high density fiducials during manufacture. The fiducials can be identified using X-rays without etching away portions of the innerlayer panel to expose the fiducials.

Abstract: In a printed wiring board, a plurality of stacked innerlayer panels have capacitors connected in parallel by connecting a first electrode of a first panel with a first electrode of a second panel, and similarly connecting second electrodes of the first and second panels. The innerlayer panel having capacitors connected in parallel provides a high capacitance in a small x-y area. An alternate printed wiring board has a capacitor having a first foil electrode, and second and third electrodes located on opposite sides of the first foil electrode. Yet another printed wiring board has capacitors formed as an array of discrete foil electrodes spaced from an array of discrete printed electrodes. Forming discrete interconnected electrodes allows the electrodes to be fired without excessive thermal coefficient of expansion stresses damaging the electrodes.

Abstract: A printed wiring board (PWB) has stacked innerlayer panels comprised of passive circuit elements. The passive elements can include capacitors with electrode terminations located within the footprints of the capacitor electrodes. The capacitor terminations are therefore closely spaced, reducing the capacitors' contributions to loop inductance in the innerlayer. Capacitor terminations within the electrode footprints also reduce the PWB board surface area used in forming the capacitors.