Abstract: Disclosed herein is a lubrication device comprising a solid lubricant disposed between and in contact with a first electrode and a second electrode dimensioned and arranged such that application of an electric potential between the first electrode and the second electrode sufficient to produce an electric arc between the first electrode and the second electrode to produce a plasma in an ambient atmosphere at an ambient pressure which vaporizes at least a portion of the solid lubricant to produce a vapor stream comprising the solid lubricant. Methods to lubricate a surface utilizing the lubrication device in-situ are also disclosed.

Abstract: Disclosed herein is a lubrication device comprising a solid lubricant disposed between and in contact with a first electrode and a second electrode dimensioned and arranged such that application of an electric potential between the first electrode and the second electrode sufficient to produce an electric arc between the first electrode and the second electrode to produce a plasma in an ambient atmosphere at an ambient pressure which vaporizes at least a portion of the solid lubricant to produce a vapor stream comprising the solid lubricant. Methods to lubricate a surface utilizing the lubrication device in-situ are also disclosed.

Abstract: Method for improving particular interconnect pads for microcircuitry so that they provide more compliant interconnections between opposed pairs of contacts of the microchips in a hybrid detector array assembly. The individual tubes of prior art interconnect pads are filled with indium and are then etched away to leave indium columns of increased height, relative to the indium bumps that have heretofore been used in the contact connections of hybrid detector array assemblies. Other materials may be substituted for the indium and a number of variants of the process are also disclosed.

Abstract: A detector array assembly which provides for the closing at operating temperature of normally open contacts between individual sensor contact mesas and readout pads of the respective detector and readout chips comprising a detector array assembly. One or more shape memory separator elements are used in conjunction with one or more biasing springs to control the spacing of the contacts. The force of the biasing spring becomes the dominant force as the apparatus is cooled down to near operating temperature, thus moving the chips closer together and establishing reliable electrical connection between the opposed sets of contacts. At temperatures near and above the normal operating temperature of 77 degrees K., the shape memory separator element provides the dominant force and drives the chips apart to open the contacts.

Abstract: A configuration of an electronics unit is disclosed wherein a plurality of circular circuit cards are arranged in an aligned, parallel relationship. Each card has a central circular inner opening formed therein. A plurality of inner and outer spacer elements support the respective inner and outer peripheries of the cards. The conductive patterns on the cards include a plurality of conductive pads arranged around the inner and outer peripheries of the cards. Circular metal-on-elastomer inner and outer connectors engage respective one of the inner and outer spacers, and the metal traces of the connectors make electrical contact with aligned conductive pads of adjacent cards. The unit includes a cover structure which envelopes the circuit card configuration to form a sealed unit, and an electrically insulating coolant liquid is disposed in the sealed unit in direct contact with the circuit cards and electrical components mounted thereon to absorb heat generated by electrical power dissipation.

Abstract: A configuration of an electronics unit is disclosed wherein a plurality of circular circuit cards are arranged in an aligned, parallel relationship. Each card has a central circular inner opening formed therein. A plurality of inner and outer spacer elements support the respective inner and outer peripheries of the cards. The conductive patterns on the cards include a plurality of conductive pads arranged around the inner and outer peripheries of the cards. Circular metal-on-elastomer inner and outer connectors engage respective one of the inner and outer spacers, and the metal traces of the connectors make electrical contact with aligned conductive pads of adjacent cards. The unit includes a cover structure which envelopes the circuit card configuration to form a sealed unit, and an electrically insulating coolant liquid is disposed in the sealed unit in direct contact with the circuit cards and electrical components mounted thereon to absorb heat generated by electrical power dissipation.

Abstract: A configuration of an electronics unit is disclosed wherein a plurality of circular circuit cards are arranged in an aligned, parallel relationship. Each card has a central circular inner opening formed therein. A plurality of inner and outer spacer elements support the respective inner and outer peripheries of the cards. The conductive patterns on the cards include a plurality of conductive pads arranged around the inner and outer peripheries of the cards. Circular metal-on-elastomer inner and outer connectors engage respective one of the inner and outer spacers, and the metal traces of the connectors make electrical contact with aligned conductive pads of adjacent cards. The unit includes a cover structure which envelopes the circuit card configuration to form a sealed unit, and an electrically insulating coolant liquid is disposed in the sealed unit in direct contact with the circuit cards and electrical components mounted thereon to absorb heat generated by electrical power dissipation.