Abstract: In accordance with an embodiment, a method of operating a radar system includes receiving radar configuration data from a host, and receiving a start command from the host after receiving the radar configuration data. The radar configuration data includes chirp parameters and frame sequence settings. After receiving the start command, configuring a frequency generation circuit is configured with the chirp parameters and radar frames are triggered at a preselected rate.

Abstract: A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.

Abstract: A semiconductor device includes a substrate comprising an antenna and a conductive feature; an integrated circuit (IC) die attached to the substrate and comprising a radio frequency (RF) circuit; and a flexible circuit integrated with the substrate, where the flexible circuit is electrically coupled to the IC die and the substrate, a first portion of the flexible circuit being disposed between opposing sidewalls of the substrate, a second portion of the flexible circuit extending beyond the opposing sidewalls of the substrate, the second portion of the flexible circuit comprising an electrical connector at a distal end.

Abstract: A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled to the RF circuit through the feedline structure.

Abstract: In an embodiment, a method includes: receiving a global trigger with a first millimeter-wave radar; receiving the global trigger with a second millimeter-wave radar; generating a first internal trigger of the first millimeter-wave radar after a first offset duration from the global trigger; generating a second internal trigger of the second millimeter-wave radar after a second offset duration from the global trigger; start transmitting first millimeter-wave radar signals with the first millimeter-wave radar based on the first internal trigger; and start transmitting second millimeter-wave radar signals with the second millimeter-wave radar based on the second internal trigger, where the second offset duration is different from the first offset duration, and where the first and second millimeter-wave radar signals are transmitted sequentially so as to exhibit no temporal overlap.

Abstract: A semiconductor device includes a semiconductor die comprising a radio frequency (RF) circuit, a first dielectric layer disposed over a first surface of the semiconductor die, an antenna layer disposed over a surface of the first dielectric layer, and an antenna feeding structure coupling the antenna layer to the RF circuit of the semiconductor die, wherein the semiconductor die comprises a via, and the antenna feeding structure comprises a first portion arranged within the opening of the semiconductor die and extending to the first surface of the semiconductor die, and a second portion arranged through the first dielectric layer.

Abstract: A radio frequency (RF) device includes a display screen and a flexible substrate. The display screen is configured to transmit visible light at a first side of the display screen. The flexible substrate includes a first portion overlapping the first side, and a second portion overlapping an opposite second side of the display screen. The RF device further includes a plurality of antennas disposed over the first portion of the flexible substrate and the first side, and a transmission line disposed on a bent region of the flexible substrate between the first and second portions. The plurality of antennas is configured to transmit/receive RF signals on the first side of the display screen. The display screen is opaque to the RF signals. The transmission line is configured to propagate the RF signals between the first portion and the second portion on the opposite second side of the display screen.

Abstract: A semiconductor device comprises a semiconductor chip comprising a radio frequency (RF) circuit, a feedline structure coupled to the RF circuit, and an antenna structure comprising a main body stretching along a direction orthogonal to at least one side of a front side and a backside of the semiconductor device, wherein the antenna structure is coupled to the RF circuit through the feedline structure.

Abstract: In an embodiment, a method includes: receiving a global trigger with a first millimeter-wave radar; receiving the global trigger with a second millimeter-wave radar; generating a first internal trigger of the first millimeter-wave radar after a first offset duration from the global trigger; generating a second internal trigger of the second millimeter-wave radar after a second offset duration from the global trigger; start transmitting first millimeter-wave radar signals with the first millimeter-wave radar based on the first internal trigger; and start transmitting second millimeter-wave radar signals with the second millimeter-wave radar based on the second internal trigger, where the second offset duration is different from the first offset duration, and where the first and second millimeter-wave radar signals are transmitted sequentially so as to exhibit no temporal overlap.

Abstract: In an embodiment, a device includes: a first support structure having a main surface and an edge surface; a screen covering the first support structure and having a main surface and an edge surface; a glass covering the screen; a frame; and a package electrically coupled to the first support structure via a connector, the package including a radio-frequency integrated circuit (RFIC) and a laminate that has a plurality of interconnect levels including an end-fire antenna configured to direct a first millimeter-wave radiation beam through the glass, and a patch antenna configured to direct a second millimeter-wave radiation beam through the frame, where the screen partially covers the laminate.

Abstract: In an embodiment, a device includes: a first support structure having a main surface and an edge surface; a screen covering the first support structure and having a main surface and an edge surface; a glass covering the screen; a frame; and a package electrically coupled to the first support structure via a connector, the package including a radio-frequency integrated circuit (RFIC) and a laminate that has a plurality of interconnect levels including an end-fire antenna configured to direct a first millimeter-wave radiation beam through the glass, and a patch antenna configured to direct a second millimeter-wave radiation beam through the frame, where the screen partially covers the laminate.

Abstract: A method of forming a radar system includes forming a first receive antenna and a first ground plane region by patterning a first conductive layer on a first surface of a first laminate layer of a radar package, forming a transmit antenna and a second ground plane region by patterning a second conductive layer on a second surface of the first laminate layer, forming a second laminate layer of the radar package over the second conductive layer, forming a third conductive layer over the second laminate layer, forming a second receive antenna by patterning the third conductive layer, and attaching a radio frequency integrated circuit chip to the radar package. The radio frequency integrated circuit chip is coupled to the transmit antenna, the first receive antenna, and the second receive antenna. The second surface is opposite the first surface.

Abstract: In an embodiment, a method for testing a millimeter-wave radar module includes: providing power to the millimeter-wave radar module; performing a plurality of tests indicative of a performance level of the millimeter-wave radar module; comparing respective results from the plurality of tests with corresponding test limits; and generating a flag when a result from a test of the plurality of test is outside the corresponding test limits, where performing the plurality of tests includes: transmitting a signal with a transmitting antenna coupled to a millimeter-wave radar sensor, modulating the transmitted signal with a test signal, and capturing first data from a first receiving antenna using an analog-to-digital converter of the millimeter-wave radar sensor, where generating the flag includes generating the flag based on the captured first data.

Abstract: In an embodiment, a method for testing a millimeter-wave radar module includes: providing power to the millimeter-wave radar module; performing a plurality of tests indicative of a performance level of the millimeter-wave radar module; comparing respective results from the plurality of tests with corresponding test limits; and generating a flag when a result from a test of the plurality of test is outside the corresponding test limits, where performing the plurality of tests includes: transmitting a signal with a transmitting antenna coupled to a millimeter-wave radar sensor, modulating the transmitted signal with a test signal, and capturing first data from a first receiving antenna using an analog-to-digital converter of the millimeter-wave radar sensor, where generating the flag includes generating the flag based on the captured first data.

Abstract: In accordance with an embodiment, a method of recognizing a biological target includes performing radar measurements for a plurality of sites on the biological target using a millimeter-wave radar sensor, producing a target data set for the plurality of sites based on the radar measurements, extracting features from the target data set, comparing the extracted features to stored features, and determining whether the extracted features match the stored features based on the comparing.

Abstract: A method for testing a radar device including a master radar device and a slave radar device includes: moving a test target through a field of view of the radar device; measuring an angle of the test target with respect to the radar device at a plurality of positions; evaluating the reliability of the measured angles; and specifying at least one of a usable field of view of the radar device or a number of required repetitions for a reliable measurement based on the evaluating.

Abstract: A semiconductor device includes: a dielectric substrate; an integrated circuit (IC) die disposed inside an opening of the dielectric substrate, where the IC die is configured to transmit or receive radio frequency (RF) signals; a dielectric material in the opening of the dielectric substrate and around the IC die; a redistribution structure along a first side of the dielectric substrate, where a first conductive feature of the redistribution structure is electrically coupled to the IC die; a second conductive feature along a second side of the dielectric substrate opposing the first side; a via extending through the dielectric substrate, where the via electrically couples the first conductive feature and the second conductive feature; and an antenna at the second side of the dielectric substrate, where the second conductive feature is electrically or electromagnetically coupled to the antenna.

Abstract: A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

Abstract: An earphone device includes a housing comprising a top region and a bottom region, an acoustic transducer disposed in the bottom region of the housing, and a radar system disposed in the top region of the housing. The radar system includes a first side and an opposite second side. The radar system is configured to detect a first object located on the first side of the radar system, and detect biometric data from a second object located on the second side of the radar system.

Abstract: In an embodiment, a method includes receiving radar signals and detecting motion based on time-domain processing of the received radar signals.