Patents by Inventor Say Yeow Lee

Say Yeow Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple row exposed leads for MLP high density packages
    Patent number: 7846774
    Abstract: A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: December 7, 2010
    Assignee: Carsem (M) SDN. BHD.
    Inventors: Mow Lum Yee, Chee Heng Wong, Shang Yan Choong, Kam Chuan Lau, Kok Siang Goh, Voon Joon Liew, Chee Sang Yip, Say Yeow Lee
  • MULTIPLE ROW EXPOSED LEADS FOR MLP HIGH DENSITY PACKAGES
    Publication number: 20070281392
    Abstract: A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.
    Type: Application
    Filed: August 18, 2006
    Publication date: December 6, 2007
    Applicant: CARSEM (M) SDN. BHD.
    Inventors: Mow Lum Yee, Chee Heng Wong, Shang Yan Choong, Kam Chuan Lau, Kok Siang Goh, Voon Joon Liew, Chee Sang Yip, Say Yeow Lee