Abstract: A lighting device is provided with an illumination unit including two or less LED light sources. The illumination unit uses the two or less LED light sources to emit light of a short wavelength band and light of a long wavelength band. An output varying unit functions to vary an output of at least the long wavelength band light. When the output varying unit receives a varying signal, the output varying unit functions to decrease the output of at least the long wavelength band light.

Abstract: A lighting device is provided with a lighting unit including a light emitting element and fluorescent bodies, which emit light of different wavelengths when excited by light from the light emitting element. When a peak output value of emitted light is 100% in a range of 440-465 nm, the lighting unit emits light having an output value at 500 nm that is 35%-55%, an output value at 550 nm that is 45%-80%, an output value at 600 nm that is 45%-75%, and an output value at 640 nm that is 50%-80%. The lighting unit emits light having a color temperature of 4500-5500 K and with the output value at 640 nm in a range of 100%-120% relative to the output value at 600 nm and in a range of 85%-130% relative to the output value at 550 nm.

Abstract: A lighting device includes an LED light source that emits light having a first peak wavelength at 430 to 460 nm and a second peak wavelength at 530 to 570 nm.

Abstract: A lighting device is provided with a lighting unit including a light emitting element and fluorescent bodies, which emit light of different wavelengths when excited by light from the light emitting element. When a peak output value of emitted light is 100% in a range of 440-465 nm, the lighting unit emits light having an output value at 500 nm that is 35%-55%, an output value at 550 nm that is 45%-80%, an output value at 600 nm that is 45%-75%, and an output value at 640 nm that is 50%-80%. The lighting unit emits light having a color temperature of 4500-5500 K and with the output value at 640 nm in a range of 100%-120% relative to the output value at 600 nm and in a range of 85%-130% relative to the output value at 550 nm.

Abstract: A lighting device is provided with an illumination unit including two or less LED light sources. The illumination unit uses the two or less LED light sources to emit light of a short wavelength band and light of a long wavelength band. An output varying unit functions to vary an output of at least the long wavelength band light. When the output varying unit receives a varying signal, the output varying unit functions to decrease the output of at least the long wavelength band light.

Abstract: A lighting device includes an LED light source that emits light having a first peak wavelength at 430 to 460 nm and a second peak wavelength at 530 to 570 nm.

Abstract: This invention relates to ejecting an underfill resin at multiple semiconductor die edges such that vacuum suction provided at a laminate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids. The excess underfill resin intentionally suctioned through the through hole air vent on the underside of the laminate is attracted to re-usable tape. The attracted underfill resin is cleaned from a rotating head mechanism by a cleaning pad positioned beneath a lower surface of the head.

Abstract: This invention relates to ejecting an underfill resin at multiple semiconductor die edges such that vacuum suction provided at a laminate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids. The excess underfill resin intentionally suctioned through the through hole air vent on the underside of the laminate is attracted to re-usable tape. The attracted underfill resin is cleaned from a rotating head mechanism by a cleaning pad positioned beneath a lower surface of the head.

Abstract: The invention relates to a system for assembling a flip chip assembly. An underfill resin is dispensed at multiple semiconductor die edges such that vacuum suction provided at a substrate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids. The excess underfill resin suctioned through the through hole on the underside of the semiconductor die is attracted to reusable tape. The attracted underfill resin is cleaned from a rotating head mechanism by a cleaning pad positioned beneath a lower surface of the head.

Abstract: An exemplary ball grid array package for a semiconductor device includes an integrated circuit on a substrate, and a first bus on the substrate, the first bus including first portions that extend substantially parallel to the integrated circuit, interleaved with second portions that extend substantially toward the integrated circuit, each second portion having an end contiguous with a first portion and another end contiguous with a another first portion. A first set of wires connects the first bus with a first plurality of nodes on the integrated circuit. The package also includes a second bus and a second set of wires.