Patents by Inventor Schelto Van Doorn
Schelto Van Doorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6969265Abstract: Apparatus and methods of electrically connecting integrated circuits and transducers are described. In particular, a transducer includes a base mountable on a substrate (e.g., a printed circuit board), and an input/output (I/O) lead configured to contact an I/O lead of an integrated circuit mounted on the substrate. The transducer may be mounted on the substrate to contact the transducer I/O lead to the integrated circuit I/O lead. The transducer I/O lead is configured to electrically connect to the integrated circuit I/O lead independently of any electrically conductive path of the substrate. The direct electrical connection between the transducer and the integrated circuit provides a high-speed communication channel that avoids the parasitic and high-inductance limitations generally associated with conventional metallic printed circuit board traces.Type: GrantFiled: May 18, 2000Date of Patent: November 29, 2005Assignee: Infineon Technologies AGInventor: Schelto van Doorn
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Patent number: 6926551Abstract: The invention features novel systems and methods for latching a pluggable transceiver to and unlatching the pluggable transceiver from a cage. In one aspect, a pluggable transceiver includes a housing and a cam. The housing has a front end configured to couple to a transmission cable and a back end configured to be inserted into a cage. The cam is disposed on an exposed outer surface of the transceiver housing and is configured to displace a cage latch and engage a cage slot upon insertion of the transceiver housing into the cage. In another aspect, a cage includes a housing and a latch. The housing has a front end for receiving a pluggable transceiver and defines a slot for engaging a transceiver cam. The latch is disposed at the front end of the cage housing.Type: GrantFiled: September 27, 2000Date of Patent: August 9, 2005Assignee: Infineon Technologies AGInventors: Klaus Schulz, Schelto Van Doorn
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Patent number: 6748153Abstract: An optical fiber system that enables direct board-to-board optical communication is described. The optical fiber system does not require data transmission through the backplane and, consequently, avoids the complexity and possible communication delays that would be required if data transmissions had to go through the backplane. The optical fiber system includes a positioner that is configured to urge opposite ends of two or more optical fibers respectively toward opposed optical devices that are coupled to facing sides of adjacent printed circuit boards coupled to a common backplane. The optical fiber system may be installed and removed quickly and easily, and may be readily retrofitted into existing computer systems.Type: GrantFiled: April 3, 2003Date of Patent: June 8, 2004Assignee: Infineon Technologies North America Corp.Inventor: Schelto Van Doorn
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Publication number: 20030210869Abstract: An optical fiber system that enables direct board-to-board optical communication is described. The optical fiber system does not require data transmission through the backplane and, consequently, avoids the complexity and possible communication delays that would be required if data transmissions had to go through the backplane. The optical fiber system includes a positioner that is configured to urge opposite ends of two or more optical fibers respectively toward opposed optical devices that are coupled to facing sides of adjacent printed circuit boards coupled to a common backplane. The optical fiber system may be installed and removed quickly and easily, and may be readily retrofitted into existing computer systems.Type: ApplicationFiled: April 3, 2003Publication date: November 13, 2003Applicant: Infineon Technologies North America Corp., a Delaware corporationInventor: Schelto Van Doorn
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Patent number: 6628860Abstract: A fiber optic connector system that includes a fiber optic plug and a fiber optic socket (or input) is described. The fiber optic input includes mechanisms for mounting the fiber optic input to a printed circuit board, an optical component, and an optical fiber receiving surface. The fiber-receiving surface has two or more alignment grooves configured to receive two or more optical fibers of a multi-fiber fiber optic cable and to guide the received fibers into optical contact with the optical component. The fiber optic plug includes a body configured to hold two or more optical fibers, a cap having a front face through which the optical fibers are extendable, and a biasing member coupled between the body and cap. The fiber optic input includes an alignment rail and the plug includes a slot configured to slide along the alignment rail and thereby guide the plug into alignment with the optical fiber receiving surface.Type: GrantFiled: June 5, 2000Date of Patent: September 30, 2003Assignee: Infineon Technologies North America Corp.Inventor: Schelto Van Doorn
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Patent number: 6580865Abstract: An optical fiber system that enables direct board-to-board optical communication is described. The optical fiber system does not require data transmission through the backplane and, consequently, avoids the complexity and possible communication delays that would be required if data transmissions had to go through the backplane. The optical fiber system includes a positioner that is configured to urge opposite ends of two or more optical fibers respectively toward opposed optical devices that are coupled to facing sides of adjacent printed circuit boards coupled to a common backplane. The optical fiber system may be installed and removed quickly and easily, and may be readily retrofitted into existing computer systems.Type: GrantFiled: June 5, 2000Date of Patent: June 17, 2003Assignee: Infineon Technologies North America Corp.Inventor: Schelto Van Doorn
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Publication number: 20020177333Abstract: Apparatus and methods of electrically connecting integrated circuits and transducers are described. In particular, a transducer includes a base mountable on a substrate (e.g., a printed circuit board), and an input/output (I/O) lead configured to contact an I/O lead of an integrated circuit mounted on the substrate. The transducer may be mounted on the substrate to contact the transducer I/O lead to the integrated circuit I/O lead. The transducer I/O lead is configured to electrically connect to the integrated circuit I/O lead independently of any electrically conductive path of the substrate. The direct electrical connection between the transducer and the integrated circuit provides a high-speed communication channel that avoids the parasitic and high-inductance limitations generally associated with conventional metallic printed circuit board traces.Type: ApplicationFiled: May 18, 2000Publication date: November 28, 2002Inventor: Schelto van Doorn
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Patent number: 6482017Abstract: EMI-shielding strain relief boots and dust covers and methods of using these boots and dust covers are described. An inventive EMI-shielding strain relief boot includes a flexible elongated boot body and an EMI shield. The boot body has a proximal end, a distal end, and an inner surface defining a bore sized and arranged to contain an end portion of a transmission cable and an associated cable connector. The EMI shield extends along a substantial length of the boot body and is configured to shield a region of the bore from interfering electromagnetic radiation. The distal end of the boot body is slidable over the cable connector and is conformable to and envelopable about at least a portion of a pluggable transceiver connector. The dust cover has a flexible elongated dust cover body and an EMI shield.Type: GrantFiled: May 22, 2000Date of Patent: November 19, 2002Assignee: Infineon Technologies North America Corp.Inventor: Schelto Van Doorn
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Patent number: 6379053Abstract: Multi-fiber fiber optic connectors (22-26, 40) are described. The fiber optic connectors (22-26) enable direct board-to-board optical communication but do not require data transmission through a backplane (12). In one aspect, a fiber optic connector (40) includes a plurality of optical fibers (42) terminating at proximal and distal ends, and a flexible support (44) configured to hold the optical fibers (42) in an elongated spaced-apart three-dimensional array characterized by insignificant optical coupling between the optical fibers (42). The support (44) has a proximal end terminating at a proximal end face (46) at which the proximal ends of the optical fibers (42) terminate. The proximal end face (46) of the support (44) is sized and arranged to contact a port (88, 90, 112, 114, 134, 136, 164, 166) of an optical device (68, 102, 128, 158) whereupon one or more of the optical fibers (42) couple to the optical device (68, 102, 128, 158) through the port (88, 90, 112, 114, 134, 136, 164, 166).Type: GrantFiled: May 30, 2000Date of Patent: April 30, 2002Assignee: Infineon Technologies North America Corp.Inventor: Schelto van Doorn