Patents by Inventor Schuichi Murakami

Schuichi Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for soldering printed circuit boards
    Patent number: 4824010
    Abstract: At least one chip type component is soldered to a printed circuit board by independent first and second nozzles which spout molten solder so as to form respective first and second solder waves, with the printed circuit board sequentially passed through the first and second nozzles. The first and second solder waves define therebetween a space and flow at least in a direction of movement of the printed circuit board and in a direction counter to the direction of movement of the printed circuit board, respectively. The second nozzle is disposed at a level higher than the first nozzle such that the printed circuit board is moved obliquely upwardly.
    Type: Grant
    Filed: October 17, 1986
    Date of Patent: April 25, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takao Inoue, Keiji Saeki, Chuichi Matsuda, Schuichi Murakami