Abstract: A microwave packaging material including a plurality of susceptors is disclosed. Each susceptor includes a plastic film or polymer with a metal layer on one surface of the plastic film and a paper adhered to the plastic film opposite the metal layer. A patterned adhesive is bonded between a first susceptor layer and a second susceptor layer in a pattern bond creating sealed air pockets. A paper board substrate is adhered using an adhesive in a bond pattern to one of the susceptor layers facing the metal of the respective susceptor layer to provide the microwave packing material rigidity. Upon exposure to microwave energy in a microwave oven, moisture is trapped between the paper board substrate and the susceptor layer creating a vapor pressure that causes the sealed air pockets to form expanded air pockets.