Abstract: The present disclosure relates to a nozzle system for use in a microfluidic production application for producing at least one of particles, capsules or fibers. The system has a main body portion having a compressed fluid inlet and a core fluid inlet, and a plurality of parallel arranged core fluid nozzles that receive the core fluid and create a plurality of core fluid streams. At least one compressed fluid inlet associated with the main body channels compressed fluid to areas adjacent ends of the core fluid nozzles. An apertured plate having a plurality of apertures is arranged near the ends of the core fluid nozzles, with each aperture being uniquely associated with a single one of the core fluid nozzles. The compressed fluid acts on the core fluid streams exiting the core fluid nozzles to help create, with the apertures, at least one of core fluid droplets or core fluid fibers from the core fluid streams.

Abstract: The present disclosure relates to a nozzle system for use in a microfluidic production application for producing at least one of particles, capsules or fibers. The system has a main body portion having a compressed fluid inlet and a core fluid inlet, and a plurality of parallel arranged core fluid nozzles that receive the core fluid and create a plurality of core fluid streams. At least one compressed fluid inlet associated with the main body channels compressed fluid to areas adjacent ends of the core fluid nozzles. An apertured plate having a plurality of apertures is arranged near the ends of the core fluid nozzles, with each aperture being uniquely associated with a single one of the core fluid nozzles. The compressed fluid acts on the core fluid streams exiting the core fluid nozzles to help create, with the apertures, at least one of core fluid droplets or core fluid fibers from the core fluid streams.

Abstract: An embodiment semiconductor structure includes a metal layer. The semiconductor structure also includes a redistribution layer (RDL) structure including an RDL platform and a plurality of RDL pillars disposed between the RDL platform and the metal layer. Additionally, the semiconductor structure includes an under-bump metal (UBM) layer disposed on the RDL platform and a solder bump disposed on the UBM layer, where the UBM layer, the RDL platform, and the RDL pillars form an electrical connection between the solder bump and the metal layer.

Abstract: A system for use in securing an attachment to a driver having an attachment mounting area includes an attachment mount configured for releasable engagement with an attachment as well as a driver mount interconnected with the attachment mount. The driver mount includes a removable mounting member configured for engagement with the attachment mounting area of the driver.

Abstract: A system for use in securing an attachment to a driver having an attachment mounting area includes an attachment mount configured for releasable engagement with an attachment as well as a driver mount interconnected with the attachment mount. The driver mount includes a removable mounting member configured for engagement with the attachment mounting area of the driver.

Abstract: A mounting arrangement for securing a functional tool to a power unit having a reciprocating output. The mounting arrangement includes an adapter that is engageable with a clamp-type mounting mechanism associated with the output of the power unit. The adapter remains in place in engagement with the power unit, and includes an outer releasable engagement arrangement which is adapted to releasably secure the inner end of a functional tool, such as a file or brush, to the power unit through the adapter. The outer releasable engagement arrangement of the adapter includes a passage within which the inner mounting portion of the functional tool is received. The inner mounting portion of the functional tool further includes a groove, and the releasable engagement arrangement includes a retainer member selectively movably into and out of the groove for maintaining the functional tool in engagement with the adapter and for releasing engagement between the functional tool and the adapter.