Abstract: A printed circuit board (PCB) assembly comprising a PCB having a top circuitry layer and a bottom layer with a hole through the PCB, a component, and a pallet. The printed circuit board manufactured by a method including forming a hole through the top circuitry layer and the bottom layer, attaching the bottom layer to a pallet, placing the component in the hole, and soldering the component to the top circuitry layer and to the pallet.

Abstract: A method for supporting a wall-like structure by forming a serpentine shaped slot on a substantially planar surface. The serpentine slot includes an area of central clearance such that a wall-like structure having a width narrower than the width of the serpentine slot can be inserted into the area of central clearance and be supported by the inner sides of the serpentine slot.

Abstract: A apparatus and a method of isolating two cavities within an electrical equipment by using a S-shaped plate having fingers on opposite sides such that the S-shaped plate may be installed between two open ended inner walls.

Abstract: A method for supporting a wall-like structure by forming a serpentine shaped slot on a substantially planar surface. The serpentine slot includes an area of central clearance such that a wall-like structure having a width narrower than the width of the serpentine slot can be inserted into the area of central clearance and be supported by the inner sides of the serpentine slot.

Abstract: A heat sink assembly for an electronics assembly, such as an RF power amplifier, includes a pallet, a fin structure, and a hollow base separate from the fin structure. The fin structure may be an integral curved sheet or a modular apparatus comprising a plurality of inverted U-shaped fin modules. Top horizontal walls of the fin structure directly contact a bottom surface of the pallet. Vertical fins of the fin structure are inserted through the slots of the base. The pallet, fin structure and base are coupled together such that the upper surface of the base applies load to the contact portions of the fin structure sandwiched between the base and the pallet. Methods for assembling a power amplifier and manufacturing a heat sink assembly are also provided.

Abstract: An amplifier assembly having a grounded mode wall is disclosed. The mode wall is supported in a substantially serpentine slot in an amplifier substrate. The serpentine slot supports and grounds the mode wall at a plurality of points of contact. The points of contact are spaced apart at roughly ¼ the wavelength or less of EMI emissions of the amplifier circuitry.

Abstract: A heat sink assembly for an electronics assembly, such as an RF power amplifier, includes a pallet, a fin structure, and a hollow base separate from the fin structure. The fin structure may be an integral curved sheet or a modular apparatus comprising a plurality of inverted U-shaped fin modules. Top horizontal walls of the fin structure directly contact a bottom surface of the pallet. Vertical fins of the fin structure are inserted through the slots of the base. The pallet, fin structure and base are coupled together such that the upper surface of the base applies load to the contact portions of the fin structure sandwiched between the base and the pallet. Methods for assembling a power amplifier and manufacturing a heat sink assembly are also provided.

Abstract: A heat sink assembly for an electronics assembly, such as an RF power amplifier, includes a pallet, a fin structure, and a hollow base separate from the fin structure. The fin structure may be an integral curved sheet or a modular apparatus comprising a plurality of inverted U-shaped fin modules. Top horizontal walls of the fin structure directly contact a bottom surface of the pallet. Vertical fins of the fin structure are inserted through the slots of the base. The pallet, fin structure and base are coupled together such that the upper surface of the base applies load to the contact portions of the fin structure sandwiched between the base and the pallet. Methods for assembling a power amplifier and manufacturing a heat sink assembly are also provided.

Abstract: A self-contained portable copy serializer for use with photocopy machines which have a transparent copy window upon which an original document is placed for copying and a copy light which traverses the copy window during copying includes a shallow housing with a variable and incrementable display which may be disposed at the copy window in association with an original document, which may be provided, for example, with a notched out corner or cut out window in which serialization characters are to appear on the copies. The display of the serializer presents to the copy machine window an image of serialization characters which are copied onto the copies along with the image of the document original. The serializer increments the display characters in response to a preselected number of copy machine cycles as indicated by passage of the copy machine light to serialize both single page and multi-page forms, for example.