Abstract: A micro-extrusion printhead assembly utilized in a micro-extrusion system to form parallel extruded lines of material on a substrate includes a material feed system for pushing/drawing materials out of extrusion nozzles defined in the printhead assembly, a Z-axis positioning mechanism, and a base. The micro-extrusion printhead includes a layered nozzle structure sandwiched between back and front plate structures. The layered nozzle structure includes stacked plates including top and bottom nozzle plates sandwiching a nozzle outlet plate. According to various embodiments, at least one of the nozzle structure materials of the printhead assembly, the output geometry of the printhead assembly, and the internal conduit geometry of the printhead assembly are modified to cause the bead traveling through the extrusion nozzle to be reliably directed (biased) toward the target substrate as it leaves the printhead nozzle orifice.

Abstract: A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.

Abstract: An H-pattern solar cell structure includes at least one busbar disposed in a first direction on an upper surface of a semiconductor substrate, and parallel gridlines formed on the semiconductor substrate such that each gridline extends over and contacts each busbar, wherein each gridline includes a central gridline portion and at least one endpoint structure disposed on at least one end thereof, the endpoint structure having a nominal width that is at least 1.5 times the width of the central gridline portion. The gridlines are co-extruded with a sacrificial material such that a base portion of each gridline forms a flattened structure with sacrificial material formed thereon. The endpoint structures are formed such that Each central gridline portion forms a raised vertex portion extending upward from the upper surface of each busbar.

Abstract: A air jet source is used in conjunction with a micro-extrusion printhead assembly in a micro-extrusion system to bias extruded material onto a target substrate. The printhead assembly utilizes paste valves or other feed system to push/draw an extrusion material through dispensing orifices defined on an extrusion needle, nozzle or stacked plate printhead as the printhead assembly is moved over the substrate. The air jet source is positioned near the dispensing outlets, and directs a gas jet against the extruded material such that the extruded material is reliably biased against the target substrate. Multiple dispensing orifices are defined in a paste dispensing needle to improve starts and stops, as well as improving overall ink distribution. Two independently activated air sources and multiple air jet outlets are utilized to improve control over the quality of bus bars formed by the extruded material.

Abstract: A gas jet source is used in conjunction with a micro-extrusion printhead assembly in a micro-extrusion system to bias extruded material onto a target substrate. The micro-extrusion system includes a material feed system for pushing/drawing materials out of extrusion nozzles defined in the printhead assembly as the printhead assembly is moved over the substrate. The gas jet source is positioned near the nozzle outlets, and directs a gas jet against the extruded material as it exits the extrusion nozzles such that the extruded material is reliably directed (biased) toward the target substrate. In some embodiments the gas jet causes slumping (flattening) of the extruded material against the substrate, producing low aspect ratio lines that may be merged to form a connected structure.

Abstract: A solar cell includes two backside metallization materials that are simultaneously extrusion deposited on a semiconductor substrate such that both a back surface field (BSF) metal layer (e.g., Al) and a solder pad metal structure (e.g., AgAl) are coplanar and non-overlapping, and the two metals abut each other to form a continuous metal layer that extends over the backside surface of the substrate. In one embodiment, the solder pad metal is formed directly on the backside surface of the substrate, either by co-extruding the two materials in the form of a continuous sheet, or by depositing spaced apart structures that are then flattened to contact each other by way of an air jet device. In another embodiment, the solder pad metal is disposed over a thin layer of the BSF metal (i.e., either disposed directly on the BSF metal, or disposed on an intervening barrier layer) using a co-extrusion head.

Abstract: This disclosure is generally directed to inks used to create fine features for electrodes, batteries, solar cells, etc. More particularly, in embodiments, this disclosure is directed to compositions of easily flowable inks that result in reduced clogging when applying the ink to a substrate to create fine features. The inks are characterized by their rheological properties, particularly with respect to viscosity and flowability. Flowability is measured by measuring the quantity of ink which will flow through a 400 mesh screen. Also disclosed are methods of applying the easily flowable inks. The inks are applied using extrusion processes, particularly coextrusion. Coextrusion of the inks allows fine features having high aspect ratios to be formed without clogging of the coextrusion printhead.

Abstract: A gas jet source is used in conjunction with a micro-extrusion printhead assembly in a micro-extrusion system to bias extruded material onto a target substrate. The micro-extrusion system includes a material feed system for pushing/drawing materials out of extrusion nozzles defined in the printhead assembly as the printhead assembly is moved over the substrate. The gas jet source is positioned near the nozzle outlets, and directs a gas jet against the extruded material as it exits the extrusion nozzles such that the extruded material is reliably directed (biased) toward the target substrate. In some embodiments the gas jet causes slumping (flattening) of the extruded material against the substrate, producing low aspect ratio lines that may be merged to form a connected structure.

Abstract: A micro-extrusion printhead assembly utilized in a micro-extrusion system to form parallel extruded lines of material on a substrate includes a material feed system for pushing/drawing materials out of extrusion nozzles defined in the printhead assembly, a Z-axis positioning mechanism, and a base. The micro-extrusion printhead includes a layered nozzle structure sandwiched between back and front plate structures. The layered nozzle structure includes stacked plates including top and bottom nozzle plates sandwiching a nozzle outlet plate. According to various embodiments, at least one of the nozzle structure materials of the printhead assembly, the output geometry of the printhead assembly, and the internal conduit geometry of the printhead assembly are modified to cause the bead traveling through the extrusion nozzle to be reliably directed (biased) toward the target substrate as it leaves the printhead nozzle orifice.

Abstract: Various traveling wave grid configurations are disclosed. The grids and systems are well suited for transporting, separating, and classifying small particles dispersed in liquid or gaseous media. Also disclosed are various separation strategies and purification cells utilizing such traveling wave arrays and strategies.

Abstract: A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.

Abstract: A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics. In another embodiment, a material for a thick film element is deposited onto a surface of a first substrate to form a thick film element structure having a thickness of between greater than 10 ?m to 100 ?m.

Abstract: A liquid drop ejector comprising a jet stack, thin film or thick film heaters formed on the surface of the jet stack, and at least one thin film or thick film temperature sensor operative to provide feedback temperature control for the thin film or thick film heater elements is provided. In one form, the liquid drop ejector also has the thin film or thick film heater elements grouped in segments that are operative to be individually controlled. In addition, in another form, the signal lines provided to the liquid drop ejector are patterned to allow for more uniform resistance over the span of the liquid drop ejector.

Abstract: A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.

Abstract: A method of producing at least one thick film element, including depositing a material on a surface of at least one first substrate to form at least one thick film element structure having a thickness of approximately greater than 10 ?m to 100 ?m. Then, then the at least one thick film element structure is bonded to a second substrate, and the at least one first substrate is removed from the at least one thick film element structure using a lift-off process employing radiation energy. The lift-off process including emitting, from a radiation source, a radiation beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the first surface of the first substrate. The first substrate being substantially transparent at the wavelength of the radiation beam, permitting the radiation beam to generate sufficient energy at the interface to break the attachment.

Abstract: A method for producing a detection/test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.

Abstract: A piezoelectric thick film element array includes at least one piezoelectric element structure having a thickness between 10 ?m to 100 ?m formed by a deposition process. The at least one piezoelectric element is patterned during the deposition process, and includes a first electrode deposited on a first surface of the piezoelectric elements structure, and a second electrode deposited on a second surface of the piezoelectric element structure. In a further embodiment, several devices are provided using a piezoelectric element or an array having a piezoelectric element structure with a thickness of between 10 ?m to 100 ?m formed by a deposition process. These devices include microfluidic ejectors, transducer arrays and catheters.

Abstract: A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.

Abstract: A thin film device comprises: a substrate and a thin film having a thickness formed on the substrate, wherein the thickness of the thin film is at least 1 micrometer, a crystal structure having crystals with a grain size formed within the thin film, wherein the grain size of a majority of the crystals includes a height to width ratio greater than three to two.

Abstract: A flexible detection/test tape includes a first flexible conductive layer, and a second flexible conductive layer positioned opposite the first conductive layer. A plurality of at least one of sensors, actuators or transducers are positioned between and are bonded to the first flexible conductive layer and the second flexible conductive layer. An insulative material is inserted around the plurality of at least one of the sensors, actuators or transducers. An electrical contact network connects to the first flexible conductive layer and the second flexible conductive layer, whereby power and control signals are provided to the flexible detection/test tape.