Abstract: An improved circuit module construction for mounting and interconnecting electronic components to substrates, which is applicable to mounting a wide variety of electronic components and conductors, including inverted or `flip chip` mounted integrated circuits. The components are mounted to the substrate with a sandwiched non-conductive polymer layer which acts as the bonding agent and underfill. The substrate and underfill have apertures aligned with signal traces on the substrate and the contacts of the component and conductive polymer is injected through the apertures to fill the area between the substrate contacts and the component contacts, to secure good electrical connection. In one embodiment the non-conductive polymer is printed on the contact side of the substrate with gaps for the contacts. In another embodiment B-staged non-conductive polymer is coated on the non-contact side of the substrate, prior to forming contact apertures and mounting of components.

Abstract: Improved edge terminals for electronic circuit modules such as single- or multi-chip modules and hybrid circuits, and methods of making the edge terminals are disclosed. The improved edge terminals are formed on the edges of the modules, where they do not take up appreciable surface area from the module, and are formed of heat resisting metal and are of larger size as compared to conventional surface terminal pads which simplifies making connections to the module. In one embodiment, ends of pins are inserted in holes in a substrate along lines which will be the edges of the finished modules. After encapsulating in epoxy, the substrate is cut along the lines to bisect the pins, leaving the halves of the pins as embedded terminals flush with the edge of the module. In another embodiment, terminals are formed by attaching the terminal pieces to pads on the substrate, either in the form of widened zones in a grid structure, or an array of terminal plates.