Abstract: Thin film based fan out wafer level packaging and a method of manufacturing the same are disclosed. Embodiments include a method including forming tapered via holes in a first surface of a polymer film; forming a conductive pillar on the first surface of a semiconductor device; bonding a solderable surface of the conductive copper pillars to metallization on the second side of the polymer film; bonding the semiconductor device to the first surface of the polymer film over the conductive pillars with an underfill material; and depositing an encapsulant material over the semiconductor device and polymer film.

Abstract: Thin film based fan out wafer level packaging and a method of manufacturing the same are disclosed. Embodiments include a method including forming tapered via holes in a first surface of a polymer film; forming a conductive pillar on the first surface of a semiconductor device; bonding a solderable surface of the conductive copper pillars to metallization on the second side of the polymer film; bonding the semiconductor device to the first surface of the polymer film over the conductive pillars with an underfill material; and depositing an encapsulant material over the semiconductor device and polymer film.

Abstract: Thin film based fan out wafer level packaging and a method of manufacturing the same are disclosed. Embodiments include a method including forming tapered via holes in a first surface of a polymer film; forming a conductive pillar on the first surface of a semiconductor device; bonding a solderable surface of the conductive copper pillars to metallization on the second side of the polymer film; bonding the semiconductor device to the first surface of the polymer film over the conductive pillars with an underfill material; and depositing an encapsulant material over the semiconductor device and polymer film.

Abstract: Thin film based fan out wafer level packaging and a method of manufacturing the same are disclosed. Embodiments include a method including forming tapered via holes in a first surface of a polymer film; forming a conductive pillar on the first surface of a semiconductor device; bonding a solderable surface of the conductive copper pillars to metallization on the second side of the polymer film; bonding the semiconductor device to the first surface of the polymer film over the conductive pillars with an underfill material; and depositing an encapsulant material over the semiconductor device and polymer film.

Abstract: SIP or ZIP packages are provided with locking elements of snap fasteners, or have package alignment tabs to combine several IC packages into an IC package assembly. Using a DIP printed circuit board socket, a high density DIP module, for example, a high capacity memory chip, is assembled. The leads of the module are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly, and soldered to the motherboard. To make the IC package assembly compatible with a conventional DIP socket, a plastic spacer can be provided between the IC packages. A retaining clip may be used to allow the IC package assembly to be repeatedly inserted and removed to and from the socket without the risk of falling apart.

Abstract: SIP or ZIP packages are provided with locking elements of snap fasteners that allow several packages to be attached to each other to produce an IC package assembly. Using a DIP printed circuit board socket, a high density DIP module, for example, a high capacity memory chip, is assembled. The leads of the module are inserted into a motherboard that carries the external conductors to be connected with the inner circuits of the package assembly, and soldered to the motherboard. To make the IC package assembly compatible with a conventional DIP socket, a plastic spacer can be provided between the IC packages. A retaining clip may be used to allow the IC package assembly to be repeatedly inserted and removed to and from the socket without the risk of falling apart.