Abstract: A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.

Abstract: Approaches for aiding in recovery of lost articles are disclosed. A computing arrangement is configured with a database that contains article identifiers of a plurality of articles and associated data that identify owners of the articles. A handheld computing device reads an article identifier from an identification tag attached to an article and transmits the article identifier to the computing arrangement. The computing arrangement reads the data associated with the identifier that identifies the owner of the article in response to the identifier received from the handheld computing device and outputs the data that identifies the owner of the device.

Abstract: An LED lighting arrangement on a flexible substrate. The flexible substrate has an adhesive on a first surface. Straps are attached to the first surface of the flexible substrate by the adhesive. Each strap has a first surface, a second surface, and first and second terminals exposed on the first surface. The attachment of each strap to the substrate is with the second surface of the strap adhered to the substrate. LEDs are attached to the straps and coupled to the terminals on the straps. An arrangement of one or more wires is attached to the first surface of the flexible substrate by the adhesive. The wires are connected to the first and second terminals on the first surfaces of the plurality of straps to provide power to the LEDs.

Abstract: A process for preparation of electronic packages including printed circuits wherein the circuit portions of the package are formed from a web including a plurality of circuits maintained in an array during processing. Holding tabs are provided to maintain the integrity of the array, with the holding tabs being in the form of releasable retention tabs for temporarily holding the array together and accommodating multiple-up processing of the electronic package. For certain portions of the process, the web is separated into multiple-up circuit packages wherein the circuits are disposed within the central portion of the panel, and with the lateral edges and ends collectively defining an annular circuit-free zone. Multiple fiducial points are located within or around the circuit patterns, thereby eliminating or reducing the requirement for circuit-specific tooling and permitting multiple-up handling of the circuits in each array.