Abstract: Methods of laminating a multilayer substrate may utilize particular lamination systems to perform the methods. The methods may include providing the multilayer substrate, which may include a base, in a feed direction through a laminating system. The base may support segments of a material, each segment characterized by a height past the base in a direction normal to the feed direction. Each segment may define a leading edge at an intersection of a second surface and a third surface, and the segments may be separated from one another along the base by a spacing length. The methods may include contacting a first segment with a set of pinch rollers. The contacting may limit interaction with the third surface at the leading edge of the first segment. The methods may include compressing the first segment against the base in a direction normal to the feed direction.

Abstract: Methods of laminating a multilayer substrate may utilize particular lamination systems to perform the methods. The methods may include providing the multilayer substrate, which may include a base, in a feed direction through a laminating system. The base may support segments of a material, each segment characterized by a height past the base in a direction normal to the feed direction. Each segment may define a leading edge at an intersection of a second surface and a third surface, and the segments may be separated from one another along the base by a spacing length. The methods may include contacting a first segment with a set of pinch rollers. The contacting may limit interaction with the third surface at the leading edge of the first segment. The methods may include compressing the first segment against the base in a direction normal to the feed direction.

Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

Abstract: Methods and devices for forming a composite carrier frame assembly used in an injection molding process are described. Methods and devices described herein are well suited for insert molding multiple small pieces into a single injection molded part. The composite carrier frame assembly can include a number of insert attached thereto that are positioned in a pre-determined arrangement such during an injection molding process the inserts are molded in a molded part in the pre-determined arrangement. Each insert can include an anchor portion arranged to be molded in the single injection molded part and an exterior portion arranged to be positioned exterior to the single injection molded part.

Abstract: Methods and devices for forming a composite carrier frame assembly used in an injection molding process are described. Methods and devices described herein are well suited for insert molding multiple small pieces into a single injection molded part. The composite carrier frame assembly can include a number of insert attached thereto that are positioned in a pre-determined arrangement such during an injection molding process the inserts are molded in a molded part in the pre-determined arrangement. Each insert can include an anchor portion arranged to be molded in the single injection molded part and an exterior portion arranged to be positioned exterior to the single injection molded part.

Abstract: A sliding plate supports a heel (or toe or both) binding member on a ski. By depressing a remote switch the skier activates a linear actuator on the ski, thereby releasing a latch which allows a stored energy source to force a rear lock arm assembly to pivot upward. By the pivoting upward of the central pivot joint between the forward and rear lock arms, the overall length of the lock arm assembly is reduced. The sliding plate is attached to one end of the lock arm assembly. Thus, when the lock arm assembly is remotely actuated into the release mode, and shortened, the sliding plate pulls its ski binding member and increases the distance between the ski binding members, thereby releasing the boot from the ski binding members even in a backward fall. Other spring activated embodiments include a piston release assembly.