Patents by Inventor Scott Matteucci

Scott Matteucci has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140255790
    Abstract: A polymeric porous substrate is described. The substrate may be used as battery separator or in other industrial applications. The polymeric porous substrate is formed from a polymer such as a polyimide or polyetherimide that, in the absence of porous particles, forms a skin when cast into a substrate. The polymeric porous substrate also includes porous particles.
    Type: Application
    Filed: November 9, 2012
    Publication date: September 11, 2014
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Scott Matteucci, Brian Nickless, Beata Kilos, Hao Ju
  • Patent number: 7510595
    Abstract: The present invention includes a method, composition and apparatus for forming a nanoparticle filled polymer having similar gas selectivity and greater gas permeability than the native polymer. The nanoparticle filled polymer includes one or more polymeric materials and one or more nanoparticles dispersed within the one or more polymeric materials that increasing the permeability of the nanoparticle filled polymers relative to the permeability of the native polymer membrane.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: March 31, 2009
    Assignee: Board of Regents, The University of Texas System
    Inventors: Benny D. Freeman, Scott Matteucci, Haiqing Lin
  • Publication number: 20070137477
    Abstract: The present invention includes a method, composition and apparatus for forming a nanoparticle filled polymer having similar gas selectivity and greater gas permeability than the native polymer. The nanoparticle filled polymer includes one or more polymeric materials and one or more nanoparticles dispersed within the one or more polymeric materials that increasing the permeability of the nanoparticle filled polymers relative to the permeability of the native polymer membrane.
    Type: Application
    Filed: April 20, 2006
    Publication date: June 21, 2007
    Applicant: Board of Regents, The University Of Texas System
    Inventors: Benny Freeman, Scott Matteucci, Haiqing Lin
  • Patent number: 6824889
    Abstract: This invention relates to polyolefin alloys that are receptive to metal plating. These compositions also have enhanced properties and are easily processed into articles by various molding methods. The blends of the invention preferably include a polyethylene component, acrylonitrile-butadiene-styrene polymer(s), and at least one styrene monoolefin copolymer. The invention also relates to articles containing such alloys, and to methods of forming such blends and articles containing the same. These blends have excellent platability and superior physical properties including enhanced stiffness and toughness.
    Type: Grant
    Filed: July 3, 2002
    Date of Patent: November 30, 2004
    Assignee: Solvay Engineered Polymers, Inc.
    Inventors: Scott Matteucci, Satchit Srinivasan, Ruidong Ding
  • Publication number: 20040005473
    Abstract: This invention relates to polyolefin alloys that are receptive to metal plating. These compositions also have enhanced properties and are easily processed into articles by various molding methods. The blends of the invention preferably include a polyethylene component, acrylonitrile-butadiene-styrene polymer(s), and at least one styrene monoolefin copolymer. The invention also relates to articles containing such alloys, and to methods of forming such blends and articles containing the same. These blends have excellent platability and superior physical properties including enhanced stiffness and toughness.
    Type: Application
    Filed: July 3, 2002
    Publication date: January 8, 2004
    Inventors: Scott Matteucci, Satchit Srinivasan, Ruidong Ding
  • Patent number: 6509107
    Abstract: This invention relates to polyolefin alloys that are receptive to metal plating. These compositions also have enhanced properties and are easily processed into articles by various molding methods. The blends of the invention preferably include polyolefin homopolymers or copolymers, acrylonitrile-butadiene-styrene polymers, and a blend of at least one styrene monoolefin copolymer and at least one styrene diolefin copolymer. These blends have excellent platability and superior physical properties including enhanced rigidity, toughness, and dimensional stability.
    Type: Grant
    Filed: September 18, 2001
    Date of Patent: January 21, 2003
    Assignee: Solvay Engineered Polymers
    Inventors: Ruidong Ding, Satchit Srinivasan, Scott Matteucci
  • Patent number: 6413652
    Abstract: This invention relates to polyolefin alloys that are receptive to metal plating. These compositions also have enhanced properties and are easily processed into articles by various molding methods. The blends of the invention preferably include polyolefin homopolymers or copolymers, acrylonitrile-butadiene-styrene polymers, and styrenic block copolymers. These blends have excellent platability and superior physical properties including enhanced rigidity, thoughness, and dimensional stability.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: July 2, 2002
    Assignee: Solvay Engineered Polymers
    Inventors: Ruidong Ding, Satchit Srinivasan, Scott Matteucci
  • Publication number: 20020023845
    Abstract: This invention relates to polyolefin alloys that are receptive to metal plating. These compositions also have enhanced properties and are easily processed into articles by various molding methods. The blends of the invention preferably include polyolefin homopolymers or copolymers, acrylonitrile-butadiene-styrene polymers, and a blend of at least one styrene monoolefin copolymer and at least one styrene diolefin copolymer. These blends have excellent platability and superior physical properties including enhanced rigidity, toughness, and dimensional stability.
    Type: Application
    Filed: September 18, 2001
    Publication date: February 28, 2002
    Inventors: Ruidong Ding, Satchit Srinivasan, Scott Matteucci