Abstract: The disclosed technology relates to a method of analyzing a tissue sample. In one aspect, the method comprises obtaining a formalin-fixed paraffin-embedded (FFPE) tissue sample; contacting the tissue sample with Mung Bean Nuclease to cleave mismatched DNA pairs when isolating DNA from the tissue sample; and performing an analysis on the non-digested DNA. In one embodiment, the tissue sample is obtained from a patient having a refractory disease or a cancer during biopsy, and the analysis comprises performing next-generation DNA sequencing to evaluate genomic DNA mutations. In another embodiment, the method further comprises using a computer to screen for one or more therapies according to the cancer diagnosis; and producing a computer-generated report of possible therapies.

Abstract: The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.

Abstract: A method of making an article of footwear is disclosed. The method includes the steps of providing a customer with a pre-selected set of graphics, allowing a customer to choose a set of input graphics, and generating a set of morphed graphics based on a set of input graphics. The user can select a morphed graphic and apply it to an article. The method may further include the step of limiting the number of times a customized graphic may be selected and applied to an article.

Abstract: Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.

Abstract: The present disclosure relates to a shielded electronic module, which includes a module substrate, an electronic component attached to a top surface of the module substrate and encapsulated by a first mold compound, a second mold compound over a bottom surface of the module substrate, and a shielding structure. The second mold compound includes a recess extending inwardly from a bottom periphery of the second mold compound. The shielding structure completely covers a top surface of the module and extends over the side surface of the module until reaching the recess. Herein, the shielding structure is electrically grounded.

Abstract: Systems and methods are disclosed that overcome problems with conventional filters for high temperature casting materials. According to embodiments, uniform, engineered filters enable consistent and repeatable metal flow rates without becoming a secondary source of contamination. Proven Additive Manufacturing (AM) methods generate engineered filters that achieve consistent filtration efficiency and predictable metal flow into a casting mold. Through this application of AM for ceramics, the resulting filter incorporates features that can be adjusted on-demand to address the needs of specific alloys and geometries applied in the production of castings. According to an embodiment, the method includes generating, using an additive manufacturing apparatus, a plurality of layers, wherein each layer includes individual ceramic ligaments arranged in a grid pattern having a two-dimensional rotational orientation. The method further includes stacking the layers along a thickness direction to form the filter.

Abstract: A semiconductor die, which includes a first semiconductor device, a first passivation layer, and a first interconnect bump, is disclosed. The first passivation layer is over the first semiconductor device, which includes a first group of device fingers. The first interconnect bump is thermally and electrically connected to each of the first group of device fingers. Additionally, the first interconnect bump protrudes through a first opening in the first passivation layer.

Abstract: Described herein are technologies pertaining to automatic generation of an executive summary (explanation) of a medical event in an electronic medical record (EMR) of a patient. A medical event in the EMR is automatically identified, and a search is conducted over a document corpus based upon the identified medical event. A document retrieved as a result of the search is analyzed for a portion of text to act as an executive summary for the medical event. Each portion of text in the document is assigned a score, and the portion of text assigned the highest score is utilized as the executive summary for the medical event.

Abstract: A method of making an article of footwear is disclosed. The method may include the steps of selecting a family of article types, selecting a customized article type, manufacturing an article of footwear with the customized article type and shipping the article of footwear to a pre-designated shipping address. The customized article type can be configured with a user selected characteristic. The method can also include limiting the number of article types displayed to a user at any time.

Abstract: A method of making an article of footwear is disclosed. The method includes the steps of providing a customer with a pre-selected set of graphics, allowing a customer to choose a set of input graphics, and generating a set of morphed graphics based on a set of input graphics. The user can select a morphed graphic and apply it to an article. The method may further include the step of limiting the number of times a customized graphic may be selected and applied to an article.

Abstract: A method of making an article of footwear is disclosed. The method may include the steps of selecting a family of article types, selecting a customized article type, manufacturing an article of footwear with the customized article type and shipping the article of footwear to a pre-designated shipping address. The customized article type can be configured with a user selected characteristic. The method can also include limiting the number of article types displayed to a user at any time.

Abstract: A process for molding a back side wafer singulation guide is disclosed. Structures for heat mitigation include an overmold formed over a contact surface of a device layer of a wafer, covering bump structures. The overmold and bump structures are thinned and planarized, and the overmold provides an underfill to increase interconnect reliability of a semiconductor die in a flip chip bonded package. However, visibility of singulation guides on the contact surface is obstructed. A channel is formed extending through the device layer and into the handle layer, and is filled with the overmold. The handle layer is replaced with a thermally-conductive molding layer formed on the back side for dissipating heat generated by semiconductor devices. The thermally-conductive handle is thinned until the overmold in the channel beneath the device layer is exposed. The exposed overmold provides a visible back side singulation guide for singulating the wafer.

Abstract: The present disclosure relates to a substrate structure with selective surface finishes used in flip chip assembly, and a process for making the same. The disclosed substrate structure includes a substrate body, a metal structure with a first finish area and a second finish area, a first surface finish, and a second surface finish. The metal structure is formed on a top surface of the substrate body, the first surface finish is formed over the first finish area of the metal structure, and the second surface finish is formed over the second finish area of the metal structure. The first surface finish is different from the second surface finish.

Abstract: A system includes wireless access points operable to communicate with a communication network and electronic tracking devices that each include an electronic-ink display. The electronic tracking devices are operable to communicate wirelessly with the wireless access points. The system also includes manufacturing system operator computer systems operable to communicate with the communication network. The system further includes a server operable to execute instructions to update at least one entry in a manufacturing system database based on receiving an operation notification from one of the manufacturing system operator computer systems. The server can transmit a display update for the electronic-ink display of an identified electronic tracking device through at least one of the wireless access points based on determining that the operation notification includes a transition from a current manufacturing process step to a next manufacturing process step.

Abstract: A method of making an article of footwear is disclosed. The method includes the steps of providing a customer with a pre-selected set of graphics, allowing a customer to choose a set of input graphics, and generating a set of morphed graphics based on a set of input graphics. The user can select a morphed graphic and apply it to an article. The method may further include the step of limiting the number of times a customized graphic may be selected and applied to an article.

Abstract: Provided herein are nanoparticles comprising a polyplex core comprising one or more pH-responsive polymers and one or more anionic immune adjuvants, wherein each pH-responsive polymer comprises ionizable amine groups; and a shell of bacterial cell membrane components at least partially coating the polyplex core, wherein the bacterial cell membrane components comprise TLR 2 and/or TLR 4 agonists. Also provided are methods of stimulating an immune response in a mammal using the nanoparticle.

Abstract: The present disclosure provides electromagnetic shielding for integrated circuit modules with a module-bottom sealing procedure. First a precursor package with a number of integrated modules is provided. Each integrated module includes a module substrate having a number of module contacts at a bottom surface of the module substrate. A combination of a shielding protective material and a chemical resistant tape is then applied over the bottom surface of the module substrate, such that each module contact is sealed. Next, the precursor package is singulated at each inter-module area to form a number of individual integrated modules. A shielding structure is applied completely over a side surface of each individual integrated module. Herein, the shielding structure is electrically coupled to a ground plane within the module substrate.

Abstract: Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.

Abstract: The present disclosure relates to segmented shielding using wirebonds. In an exemplary aspect, a shield is formed from a series of wires (e.g., wirebonds) to create a wall and/or shielded compartment in an integrated circuit (IC) module. The wires can be located in any area within the IC module. The IC module may be overmolded with an insulating mold compound, and a top surface of the insulating mold can be ground or otherwise removed to expose ends of the wires to a shield layer which surrounds the insulating mold. Some examples may further laser ablate or otherwise form cavities around the ends of the wires to create stronger bonding between the wires of the shield and the shield layer.