Abstract: An electronic device may include a processor and a network interface that may include a first radio and a second radio. The processor may be configured to perform wireless communication jamming attack detection by occasionally performing clear channel verification utilizing the network interface to determine whether a threshold number of devices' channels are incapacitated in a wireless network within a threshold amount of time and/or by sending a heartbeat signal from the first radio and determining whether the second radio received the heartbeat signal.

Abstract: An electronic device may include a processor and a network interface that may include a first radio and a second radio. The processor may be configured to perform wireless communication jamming attack detection by occasionally performing clear channel verification utilizing the network interface to determine whether a threshold number of devices' channels are incapacitated in a wireless network within a threshold amount of time and/or by sending a heartbeat signal from the first radio and determining whether the second radio received the heartbeat signal.

Abstract: A power-management unit is described. This power-management unit allows a common signal line to communicate data between an integrated circuit (which may be external to the power-management unit) and a battery-monitoring mechanism in a battery pack, and to convey a signal that represents a temperature state of the battery pack to a temperature-monitoring circuit or mechanism that monitors the temperature state of the battery pack. In particular, the power-management unit may include a single-wire interface or a multiplexer that, at a given time, selectively couples the signal line from the battery pack either to the integrated circuit or the temperature-monitoring circuit based on a control signal provided by the integrated circuit (for example, via an I2C bus or interface). In this way, the power-management unit may reduce the number of signal lines needed to communicate with the battery-monitoring mechanism and to convey the signal.

Abstract: An electronic device may include a processor and a network interface that may include a first radio and a second radio. The processor may be configured to perform wireless communication jamming attack detection by occasionally performing clear channel verification utilizing the network interface to determine whether a threshold number of devices' channels are incapacitated in a wireless network within a threshold amount of time and/or by sending a heartbeat signal from the first radio and determining whether the second radio received the heartbeat signal.

Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

Abstract: The described embodiments include a power-management unit that receives and stores a representation of a temperature state of a battery pack from a battery-monitoring mechanism in a battery pack. For example, an interface circuit (such as a single-wire-interface or SWI circuit) may receive the information from the battery-monitoring mechanism via a signal line, and the information may be stored in a memory (such as a non-transitory computer-readable memory). This stored information is then used by a temperature-monitoring mechanism or circuit to determine the temperature state of the battery pack, which may be used to control or gate charging of a battery in the battery pack.

Abstract: A power-management unit is described. This power-management unit allows a common signal line to communicate data between an integrated circuit (which may be external to the power-management unit) and a battery-monitoring mechanism in a battery pack, and to convey a signal that represents a temperature state of the battery pack to a temperature-monitoring circuit or mechanism that monitors the temperature state of the battery pack. In particular, the power-management unit may include a single-wire interface or a multiplexer that, at a given time, selectively couples the signal line from the battery pack either to the integrated circuit or the temperature-monitoring circuit based on a control signal provided by the integrated circuit (for example, via an I2C bus or interface). In this way, the power-management unit may reduce the number of signal lines needed to communicate with the battery-monitoring mechanism and to convey the signal.

Abstract: An electronic device may include a processor and a network interface that may include a first radio and a second radio. The processor may be configured to perform wireless communication jamming attack detection by occasionally performing clear channel verification utilizing the network interface to determine whether a threshold number of devices' channels are incapacitated in a wireless network within a threshold amount of time and/or by sending a heartbeat signal from the first radio and determining whether the second radio received the heartbeat signal.

Abstract: An electronic device may be provided with antenna structures. Circuitry such as radio-frequency transceiver circuitry and impedance matching and filter circuitry may be implemented using one or more circuit components and embedded within an insulator to form packaged circuitry. The insulator may be formed from multiple layers of printed circuit board material or from plastic molded onto a printed circuit board substrate over the circuitry. A metal shield layer may be interposed between the packaged circuitry and the antenna structures. The metal shield layer may be mounted on the surface of the packaged circuitry using a layer of adhesive. A layer of polymer may be interposed between the layer of adhesive and the metal shielding layer. The metal shield layer may have an opening through which conductive paths may pass to couple the packaged circuitry to antenna terminals on the antenna structures.

Abstract: A low profile, space efficient circuit shield is disclosed. The shield includes top and bottom metal layers disposed on the top of and below an integrated circuit. In one embodiment the shield can include edge plating arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In another embodiment, the shield can include through vias arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In yet another embodiment, passive components can be disposed adjacent to the integrated circuit within the shield.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.

Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

Abstract: An electronic device may be provided with antenna structures. Circuitry such as radio-frequency transceiver circuitry and impedance matching and filter circuitry may be implemented using one or more circuit components and embedded within an insulator to form packaged circuitry. The insulator may be formed from multiple layers of printed circuit board material or from plastic molded onto a printed circuit board substrate over the circuitry. A metal shield layer may be interposed between the packaged circuitry and the antenna structures. The metal shield layer may be mounted on the surface of the packaged circuitry using a layer of adhesive. A layer of polymer may be interposed between the layer of adhesive and the metal shielding layer. The metal shield layer may have an opening through which conductive paths may pass to couple the packaged circuitry to antenna terminals on the antenna structures.

Abstract: A passive filter circuit filters an input signal to attenuate an undesired frequency. The passive filter circuit includes a first stage and a second stage. The input to the first stage is the input signal. The first stage includes a first inductor and a first branch coupled to the output of the first inductor. The first branch includes a first capacitor and a second inductor. The first stage is coupled to the second stage. The second stage includes a third inductor and a second branch coupled to the output of the third inductor. The second branch includes a second capacitor. Other embodiments are also described and claimed.

Abstract: A power-management unit is described. This power-management unit allows a common signal line to communicate data between an integrated circuit (which may be external to the power-management unit) and a battery-monitoring mechanism in a battery pack, and to convey a signal that represents a temperature state of the battery pack to a temperature-monitoring circuit or mechanism that monitors the temperature state of the battery pack. In particular, the power-management unit may include a single-wire interface or a multiplexer that, at a given time, selectively couples the signal line from the battery pack either to the integrated circuit or the temperature-monitoring circuit based on a control signal provided by the integrated circuit (for example, via an I2C bus or interface). In this way, the power-management unit may reduce the number of signal lines needed to communicate with the battery-monitoring mechanism and to convey the signal.

Abstract: The described embodiments include a power-management unit that receives and stores a representation of a temperature state of a battery pack from a battery-monitoring mechanism in a battery pack. For example, an interface circuit (such as a single-wire-interface or SWI circuit) may receive the information from the battery-monitoring mechanism via a signal line, and the information may be stored in a memory (such as a non-transitory computer-readable memory). This stored information is then used by a temperature-monitoring mechanism or circuit to determine the temperature state of the battery pack, which may be used to control or gate charging of a battery in the battery pack.

Abstract: A low profile, space efficient circuit shield is disclosed. The shield includes top and bottom metal layers disposed on the top of and below an integrated circuit. In one embodiment the shield can include edge plating arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In another embodiment, the shield can include through vias arranged to encircle the edges of the integrated circuit and couple the top and bottom metal layers together. In yet another embodiment, passive components can be disposed adjacent to the integrated circuit within the shield.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.