Patents by Inventor Scott Preston Moore

Scott Preston Moore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6259037
    Abstract: The present invention provides an organic chip carrier particularly useful with flip chips. The chip carrier comprises an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry. The fine line circuitry has a line width of about 2.0 mil or less, preferably about 1.0 mil or less, and more preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 30%. The invention also relates to methods of making the dielectric coated chip carrier.
    Type: Grant
    Filed: October 4, 1999
    Date of Patent: July 10, 2001
    Assignee: International Business Machines Corporation
    Inventors: Natalie Barbara Feilchenfeld, John Steven Kresge, Scott Preston Moore, Ronald Peter Nowak, James Warren Wilson
  • Patent number: 6006428
    Abstract: The present invention provides an organic chip carrier particularly useful with flip chips, comprising an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry having line width of about 2.0 mil or less, preferably about 1.0 mil or less, preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less, disposed on the conformational layer. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 30%. The invention also relates to methods of making the dielectric coated chip carrier.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: December 28, 1999
    Assignee: International Business Machines Corporation
    Inventors: Natalie Barbara Feilchenfeld, John Steven Kresge, Scott Preston Moore, Ronald Peter Nowak, James Warren Wilson
  • Patent number: 5798563
    Abstract: The present invention provides an organic chip carrier particularly useful with flip chips, comprising an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry having line width of about 2.0 mil or less, preferably about 1.0 mil or less, preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less, disposed on the conformational layer. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 3.5% The invention also relates to methods of making the dielectric coated chip carrier.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: August 25, 1998
    Assignee: International Business Machines Corporation
    Inventors: Natalie Barbara Feilchenfeld, John Steven Kresge, Scott Preston Moore, Ronald Peter Nowak, James Warren Wilson
  • Patent number: 5768774
    Abstract: A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.
    Type: Grant
    Filed: November 4, 1996
    Date of Patent: June 23, 1998
    Assignee: International Business Machines
    Inventors: James Warren Wilson, Stephen Robert Engle, Scott Preston Moore