Abstract: A probe card for testing of semiconductor dice is provided. The probe card includes a mounting plate and a plurality of substrate segments supported by the mounting plate.

Abstract: A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.

Abstract: A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.

Abstract: A probe card is provided including a first substrate, a second substrate, and a plurality of conductive wires extending between the first substrate and the second substrate. The conductive wires are fixed (a) at a first end to a contact of the first substrate, and (b) at a second end to a contact of the second substrate.

Abstract: A probe card for testing of semiconductor dice is provided. The probe card includes a mounting plate and a plurality of substrate segments supported by the mounting plate.

Abstract: A probe card is provided including a first substrate, a second substrate, and a plurality of conductive wires extending between the first substrate and the second substrate. The conductive wires are fixed (a) at a first end to a contact of the first substrate, and (b) at a second end to a contact of the second substrate.

Abstract: A probe for a probe card assembly is provided. The probe includes a beam element having a tip end portion. The probe also includes a tip structure on the tip end portion of the beam element. The tip structure includes a plurality of conductive bumps arranged in a stacked configuration.

Abstract: A sample collection device for collecting a sample of drill cuttings from a hole being drilled as the hole is being drilled includes a stem collector surrounding the drill pipe. Pressurized air is injected through the drill pipe into the hole being drilled. The air forms a stream of air-entrained drill cuttings traveling up the drill hole during drilling. This stream of air-entrained drill cuttings is directed by the stem collector into a conduit which directs the stream of cuttings to a sampling device. The sampling device samples the stream of cuttings and creates a stream of sample cuttings which is directed to a diffuser which separates the sample cuttings from the air stream. The sample cuttings are collected in a sample container or in a sample collector from which they are transferred to a sample container or bag.

Abstract: A sample collection device for collecting a sample of drill cuttings from a hole being drilled as the hole is being drilled includes a stem collector surrounding the drill pipe. Pressurized air is injected through the drill pipe into the hole being drilled. The air forms a stream of air-entrained drill cuttings traveling up the drill hole during drilling. This stream of air-entrained drill cuttings is directed by the stem collector into a conduit which directs the stream of cuttings to a sampling device. The sampling device samples the stream of cuttings and creates a stream of sample cuttings which is directed to a diffuser which separates the sample cuttings from the air stream. The sample cuttings are collected in a sample container or in a sample collector from which they are transferred to a sample container or bag.

Abstract: Probe testing of an integrated circuit so as to achieve low probe needle contact resistance without probe needles “scrubbing” against bonding pads is achieved at high test signal frequencies by a probe needle assembly (14) including a plurality of probe needles (13) each having a shank portion (13A), a curved flex portion (13B), and a contact tip (13C) on a free end of the flex portion, the shank portion (13A) being electrically coupled to an electrical test system. The shank portion (13A) of each probe needle is attached to a surface (16A) of an insulative layer (16). The insulative layer is supported on a ground plane conductor 25. The flex portions (13B) of the probe needles (13) extend beyond an edge of the insulative layer. A portion (24) of the ground plane conductor (25) extends beyond the insulator (16) and is adjacent to all but an extending tip portion (30) of the flex portion (13B) of each probe needle (13).

Abstract: A system for interfacing between a semiconductor wafer, an automatic wafer probe machine, and an automatic IC test system includes an insert ring adapted for attachment to a support of the wafer probe machines. A lock ring assembly includes a lock ring rotatably disposed in the insert ring. A cam element having a sloped camming surface is attached to the lock ring. A retaining element attached to the insert ring retains the lock ring in the insert ring. A lid hingeably attached to the insert ring supports a POGO tower assembly including an adapter ring for attachment to a POGO tower and a z-axis ring attached to the adapter ring, and a mounting assembly connecting the z-axis ring in spring-loaded relationship to the lid. A cam follower attached to the z-axis ring engages the sloped camming surface when the lid is lowered to position a bottom surface of the POGO tower slightly above the probe card.