Patents by Inventor Scott Steven Waxler

Scott Steven Waxler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM FOR FORMING BUMPS ON WAFERS
    Publication number: 20020096555
    Abstract: A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portions of the substrate, a developer developing said photosensitive layer to form apertures in the photosensitive layer at the defined regions, and a solder applicator applying a solder composition to the apertures to define solder bumps on the integrated circuit at selected portions thereof.
    Type: Application
    Filed: January 23, 2001
    Publication date: July 25, 2002
    Applicant: ORBOTECH LTD.
    Inventors: Scott Steven Waxler, Dan Zemer
  • System for forming bumps on wafers
    Patent number: 6419148
    Abstract: A system and method for forming bumps on an integrated circuit including a scanning direct laser imager employed to selectably expose a photosensitive layer deposited on an integrated circuit substrate, thereby to define regions overlying selected portions of the substrate, a developer developing said photosensitive layer to form apertures in the photosensitive layer at the defined regions, and a solder applicator applying a solder composition to the apertures to define solder bumps on the integrated circuit at selected portions thereof.
    Type: Grant
    Filed: January 23, 2001
    Date of Patent: July 16, 2002
    Assignee: Orbotech Ltd.
    Inventors: Scott Steven Waxler, Dan Zemer