Patents by Inventor Scott Y. Oshita

Scott Y. Oshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11985462
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Grant
    Filed: August 1, 2022
    Date of Patent: May 14, 2024
    Assignee: APPLE INC.
    Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
  • Publication number: 20220369015
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Application
    Filed: August 1, 2022
    Publication date: November 17, 2022
    Applicant: APPLE INC.
    Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
  • Patent number: 11477558
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: October 18, 2022
    Assignee: Apple Inc.
    Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
  • Patent number: 11137612
    Abstract: A head-mounted device may include a housing structure, a display module mounted in the housing structure, and adjustable support structures coupled to the housing structure. The adjustable support structures may include a first portion that rests against a user's forehead and second and third portions that rest against the user's cheeks or temples. In some arrangements, the adjustable support structures include posts with adjustable lengths, telescoping layers of material, inflatable structures, and/or elastomeric materials that expand and retract to accommodate different face shapes and sizes. In some arrangements, the adjustable support structures include a cable located in a flexible member. When pressure is applied to a forehead portion of the flexible member, the cable pulls the temple portions of the flexible member towards each other. In some arrangements, the adjustable support structures include a movable member that pivots about a pivot axis.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: October 5, 2021
    Assignee: Apple Inc.
    Inventors: Yoonhoo Jo, Thomas E. Degen, Julian Hoenig, Julian Jaede, Aiden D. Mossop, Atif H. Naqvi, Scott Y. Oshita, Heidi Williamson, Edward W. Wong, Timon A. Wright
  • Publication number: 20210029435
    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
    Type: Application
    Filed: October 1, 2020
    Publication date: January 28, 2021
    Applicant: Apple Inc.
    Inventors: Edward Siahaan, Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer, Eugene A. Whang, David H. Narajowski, Scott Y. Oshita, Dustin A. Hatfield, Zachary G. Segraves, Sean J. Docherty
  • Publication number: 20200081259
    Abstract: A head-mounted device may include a housing structure, a display module mounted in the housing structure, and adjustable support structures coupled to the housing structure. The adjustable support structures may include a first portion that rests against a user's forehead and second and third portions that rest against the user's cheeks or temples. In some arrangements, the adjustable support structures include posts with adjustable lengths, telescoping layers of material, inflatable structures, and/or elastomeric materials that expand and retract to accommodate different face shapes and sizes. In some arrangements, the adjustable support structures include a cable located in a flexible member. When pressure is applied to a forehead portion of the flexible member, the cable pulls the temple portions of the flexible member towards each other. In some arrangements, the adjustable support structures include a movable member that pivots about a pivot axis.
    Type: Application
    Filed: September 5, 2019
    Publication date: March 12, 2020
    Inventors: Yoonhoo Jo, Thomas E. Degen, Julian Hoenig, Julian Jaede, Aiden D. Mossop, Atif H. Naqvi, Scott Y. Oshita, Heidi Williamson, Edward W. Wong, Timon A. Wright