Patents by Inventor Se Hee OH

Se Hee OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240181846
    Abstract: A refrigerant module includes a compressor configured to discharge the refrigerant after compressing the refrigerant, a condensation core configured to discharge the refrigerant discharged from the compressor after the refrigerant exchanges heat with a coolant, an evaporation core configured to discharge the refrigerant discharged from an expansion valve after the refrigerant exchanges heat with a coolant, and a refrigerant multi-channel plate formed to have a plate shape.
    Type: Application
    Filed: July 27, 2023
    Publication date: June 6, 2024
    Inventors: Sang Shin Lee, Ki Mok Kim, Man Ju Oh, Je Min Yeon, Man Hee Kim, Se Min Lee
  • Patent number: 11993134
    Abstract: A refrigerant module of an integrated thermal management system of a vehicle is provided in which components of the module may be compactified by modularizing the components related to a refrigerant. In the refrigerant module of the integrated thermal management system for the vehicle in which the refrigerant module is configured such that a refrigerant circulates through a compressor, a condenser, an expansion valve, an evaporator, and an accumulator, the refrigerant module includes the compressor having a first suction port and a first discharge port, the condenser having a second suction port and a second discharge port, the expansion valve having a third suction port and a third discharge port, the evaporator having a fourth suction port and a fourth discharge port, the accumulator having a fifth suction port and a fifth discharge port, and a connection passage enabling the refrigerant discharged from the accumulator to flow to the compressor.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: May 28, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Wia Corporation
    Inventors: Man Ju Oh, Sang Shin Lee, Ki Mok Kim, Man Hee Kim, Se Min Lee, Bong Jun Park
  • Patent number: 11981185
    Abstract: An integrated thermal management system for a vehicle may make refrigerant-related components compact by modularizing the refrigerant-related components.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: May 14, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Wia Corporation
    Inventors: Man Ju Oh, Sang Shin Lee, Ki Mok Kim, Man Hee Kim, Se Min Lee, Bong Jun Park
  • Patent number: 11955648
    Abstract: A pouch-type battery case includes a cup portion, which accommodates therein an electrode assembly formed by stacking an electrode and a separator, and a plurality of die edges connecting an outer wall of the cup portion to a side extending from the outer wall. The die edges include a first region, which is rounded at a first radius (r1) of curvature and at which an electrode tab extending from the electrode is positioned, and a second region which is other than the first region and rounded at one or more second radii (r2, r3, r4) of curvature less than or equal to the first radius (r1) of curvature. The second region is divided into an inner region and an outer region with respect to the first region, and the radius (r2) of curvature in the inner region differs from the radii (r3, r4) of curvature in the outer region.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: April 9, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Se Young Oh, Jeong Min Ha, Sang Hun Kim, Sin Woong Kim, Geun Hee Kim, Hyun Beom Kim, Hyung Ho Kwon
  • Patent number: 11955157
    Abstract: A PUF apparatus comprises: a PUF cell array in which a plurality of PUF cells are arranged each including a FeFET pair whose gates are commonly connected to a corresponding word line among a plurality of word lines, and whose drains and sources are connected to a corresponding bit line pair and a corresponding source line pair among a plurality of bit line pairs and a plurality of source line pairs running in a direction crossing the plurality of word lines; and a read-write-back block which is activated according to a read enable signal, and senses and amplifies a voltage difference occurring in a corresponding bit line pair among the plurality of bit line pairs according to the difference in driving strength due to a deviation in a manufacturing process of the FeFET pair in the PUF cell selected by a selected word line among the plurality of word lines.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: April 9, 2024
    Assignee: INDUSTRY-ACADEMIC CORPORATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Seong Ook Jung, Se Hee Lim, Tae Woo Oh, Se Keon Kim, Dong Han Ko
  • Patent number: 11955155
    Abstract: A nonvolatile memory device according to the embodiment includes: a first inverter; and a second inverter cross-coupled to the first inverter, wherein the second inverter includes a pull-up transistor, a pull-down transistor, and a ferroelectric field effect transistor having gate nodes connected to each other, and a restore transistor having one electrode connected to the ferroelectric field effect transistor, and the second inverter stores data in a nonvolatile manner.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: April 9, 2024
    Assignee: UIF (UNIVERSITY INDUSTRY FOUNDATION), YONSEI UNIVERSITY
    Inventors: Seong Ook Jung, Se Keon Kim, Tae Woo Oh, Se Hee Lim, Dong Han Ko
  • Publication number: 20240108762
    Abstract: The present invention relates to a method for culturing a 3-dimensional lung cancer organoid and a method for preparing a patient-derived xenograft animal model using the same. More specifically, the present invention relates to a method for culturing a 3-dimensional lung cancer organoid, a lung cancer organoid prepared by the method, a medium composition for culturing the lung cancer organoid, a method for preparing a xenograft animal model using the lung cancer organoid, a patient-derived lung cancer organoid xenograft animal model prepared by the method, and a method for analyzing therapeutic efficacy of an anticancer agent and a method for screening an anticancer agent, using the animal model.
    Type: Application
    Filed: December 8, 2023
    Publication date: April 4, 2024
    Applicant: ONCOCLEW CO., LTD.
    Inventors: Se Jin JANG, Min Suh KIM, Young Ah SUH, Hye Min MUN, Ju Hee OH
  • Publication number: 20240073416
    Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, Universily-lndustry Cooperation Group of Kyung Hee University
    Inventors: Sung Chang LIM, Ha Hyun LEE, Se Yoon JEONG, Hui Yong KIM, Suk Hee CHO, Jong Ho KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Dong Gyu SIM, Seoung Jun OH, Gwang Hoon PARK, Sea Nae PARK, Chan Woong JEON
  • Publication number: 20240055563
    Abstract: A chip-scale package type light emitting diode includes a first conductivity type semiconductor layer, a mesa, a second conductivity type semiconductor layer, a transparent conductive oxide layer, a dielectric layer, a lower insulation layer, a first pad metal layer, and a second pad metal layer, an upper insulation layer. The upper insulation layer covers the first pad metal layer and the second pad metal layer, and includes a first opening exposing the first pad metal layer and a second opening exposing the second pad metal layer. The openings of the dielectric layer include openings that have different sizes from one another.
    Type: Application
    Filed: August 14, 2023
    Publication date: February 15, 2024
    Inventors: Jong Kyu KIM, Min Woo KANG, Se Hee OH, Hyoung Jin LIM
  • Patent number: 11862455
    Abstract: A chip-scale package type light emitting diode includes a first conductivity type semiconductor layer, a mesa, a second conductivity type semiconductor layer, a transparent conductive oxide layer, a dielectric layer, a lower insulation layer, a first pad metal layer, and a second pad metal layer, an upper insulation layer. The upper insulation layer covers the first pad metal layer and the second pad metal layer, and includes a first opening exposing the first pad metal layer and a second opening exposing the second pad metal layer. The openings of the dielectric layer include openings that have different sizes from one another.
    Type: Grant
    Filed: January 11, 2023
    Date of Patent: January 2, 2024
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Kyu Kim, Min Woo Kang, Se Hee Oh, Hyoung Jin Lim
  • Publication number: 20230411436
    Abstract: A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflection layer.
    Type: Application
    Filed: August 1, 2023
    Publication date: December 21, 2023
    Inventors: Se Hee OH, Jong Kyu Kim, Joon Sub Lee
  • Publication number: 20230317763
    Abstract: A light emitting diode having a plurality of light emitting cells is provided. A light emitting diode according to an embodiment includes a reflection metal layer covering a region between light emitting cells, in which the reflection metal layer is disposed between connectors electrically connecting adjacent light emitting cells, and electrically insulated from a bump pad.
    Type: Application
    Filed: August 9, 2021
    Publication date: October 5, 2023
    Inventors: Se Hee OH, Wan Tae LIM, Sang Won WOO
  • Publication number: 20230299240
    Abstract: A chip-scale package type light emitting diode includes a first conductivity type semiconductor layer, a mesa, a second conductivity type semiconductor layer, a transparent conductive oxide layer, a dielectric layer, a lower insulation layer, a first pad metal layer, and a second pad metal layer, an upper insulation layer. The upper insulation layer covers the first pad metal layer and the second pad metal layer, and includes a first opening exposing the first pad metal layer and a second opening exposing the second pad metal layer. The openings of the dielectric layer include openings that have different sizes from one another.
    Type: Application
    Filed: January 11, 2023
    Publication date: September 21, 2023
    Inventors: Jong Kyu KIM, Min Woo Kang, Se Hee Oh, Hyoung Jin Lim
  • Patent number: 11749707
    Abstract: A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflection layer.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: September 5, 2023
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Se Hee Oh, Jong Kyu Kim, Joon Sub Lee
  • Publication number: 20230215990
    Abstract: A light emitting diode is provided to include a substrate; a light emitting structure disposed on the substrate, and including first and second semiconductor layers; a transparent electrode in ohmic contact with the second semiconductor layer; a contact electrode disposed on the first semiconductor layer; a current spreader disposed on the transparent electrode; a first insulation reflection layer covering the substrate, the light emitting structure, the transparent electrode, the contact electrode, and the current spreader, having openings exposing portions of the contact electrode and the current spreader, and including a distributed Bragg reflector; first and second pad electrodes disposed on the first insulation reflection layer and connected to the contact electrode and the current spreader through the openings; and a second insulation reflection layer disposed under the substrate and including a distributed Bragg reflector.
    Type: Application
    Filed: February 15, 2023
    Publication date: July 6, 2023
    Inventors: Se Hee OH, Sang Won WOO, Wan Tae LIM
  • Publication number: 20230079200
    Abstract: A light emitting diode chip having improved light extraction efficiency is provided. The light emitting diode chip includes a substrate, a first conductivity type semiconductor layer, a mesa, a side coating layer, and a reflection structure. The first conductivity type semiconductor layer is disposed on the substrate. The mesa includes an active layer and a second conductivity type semiconductor layer. The mesa is disposed on a partial region of the first conductivity type semiconductor layer to expose an upper surface of the first conductivity type semiconductor layer along an edge of the first conductivity type semiconductor layer. The side coating layer(s) covers a side surface of the mesa. The reflection structure is spaced apart from the side coating layer(s) and disposed on the exposed first conductivity type semiconductor layer.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 16, 2023
    Inventors: Se Hee OH, Jae Kwon KIM, Jong Kyu KIM, Hyun A KIM, Joon Sup LEE
  • Patent number: 11557696
    Abstract: A chip-scale package type light emitting diode includes a first conductivity type semiconductor layer, a mesa, a second conductivity type semiconductor layer, a transparent conductive oxide layer, a dielectric layer, a lower insulation layer, a first pad metal layer, and a second pad metal layer, an upper insulation layer. The upper insulation layer covers the first pad metal layer and the second pad metal layer, and includes a first opening exposing the first pad metal layer and a second opening exposing the second pad metal layer. The openings of the dielectric layer include openings that have different sizes from one another.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: January 17, 2023
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Kyu Kim, Min Woo Kang, Se Hee Oh, Hyoung Jin Lim
  • Patent number: 11515451
    Abstract: A light emitting diode chip having improved light extraction efficiency is provided. The light emitting diode chip includes a substrate, a first conductivity type semiconductor layer, a mesa, a side coating layer, and a reflection structure. The first conductivity type semiconductor layer is disposed on the substrate. The mesa includes an active layer and a second conductivity type semiconductor layer. The mesa is disposed on a partial region of the first conductivity type semiconductor layer to expose an upper surface of the first conductivity type semiconductor layer along an edge of the first conductivity type semiconductor layer. The side coating layer(s) covers a side surface of the mesa. The reflection structure is spaced apart from the side coating layer(s) and disposed on the exposed first conductivity type semiconductor layer.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: November 29, 2022
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Se Hee Oh, Jae Kwon Kim, Jong Kyu Kim, Hyun A Kim, Joon Sup Lee
  • Publication number: 20220208851
    Abstract: A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.
    Type: Application
    Filed: March 17, 2022
    Publication date: June 30, 2022
    Inventors: Jong Kyu KIM, So Ra LEE, Yeo Jin YOON, Jae Kwon KIM, Joon Sup LEE, Min Woo KANG, Se Hee OH, Hyun A. KIM, Hyoung Jin LIM
  • Patent number: D1021767
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: April 9, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Hyun Beom Kim, Jeong Min Ha, Gi Man Kim, Dae Hong Kim, Sin Woong Kim, Se Young Oh, Geun Hee Kim, Hyung Ho Kwon