Patents by Inventor Se Hwa Hong

Se Hwa Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Patent number: 9828104
    Abstract: Disclosed is a motor bracket of a multicopter flying robot. The motor bracket for the multicopter flying robot disclosed in the present invention includes: a body 110 receiving a rotary motor 500 therein which is used in the multicopter flying robot, a connection portion 120 which is formed on the outer surface of the body and receives two power supply lines 510 and 520 connected to a power terminal of the rotary motor 500, and a power supply member 300 which is pushed into the connection portion 120 and electrically contacts the at least two power supply lines 510 and 520. The connection portion 120 includes a spatial separation portion 122 which performs a function of forming separated spaces of which the number is the same as the number of the at least two power supply lines 510 and 520.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: November 28, 2017
    Assignee: BY ROBOT CO., LTD.
    Inventors: Sang Ki Ji, Se Hwa Hong
  • Publication number: 20160137306
    Abstract: Disclosed is a motor bracket of a multicopter flying robot. The motor bracket for the multicopter flying robot disclosed in the present invention includes: a body 110 receiving a rotary motor 500 therein which is used in the multicopter flying robot, a connection portion 120 which is formed on the outer surface of the body and receives two power supply lines 510 and 520 connected to a power terminal of the rotary motor 500, and a power supply member 300 which is pushed into the connection portion 120 and electrically contacts the at least two power supply lines 510 and 520. The connection portion 120 includes a spatial separation portion 122 which performs a function of forming separated spaces of which the number is the same as the number of the at least two power supply lines 510 and 520.
    Type: Application
    Filed: May 13, 2014
    Publication date: May 19, 2016
    Inventors: Sang Ki JI, Se Hwa HONG
  • Patent number: D708571
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: July 8, 2014
    Assignee: BY Robot Co., Ltd.
    Inventors: Sang Ki Ji, Se Hwa Hong