Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: The present invention relates to a feedback device and a thermal feedback provision method using the same. The thermal feedback provision method may include checking first operating power applied to a first thermoelectric couple group for a first thermoelectric operation and second operating power applied to a second thermoelectric couple group for a second thermoelectric operation when the first thermoelectric operation is initiated in the first thermoelectric couple group to initiate the output of the first thermal feedback after the second thermoelectric operation is initiated in the second thermoelectric couple group to initiate the output of the second thermal feedback and include applying cognitive enhancement power for enhancing a user's cognition to the first thermoelectric couple group from a time point at which the output of the first thermal feedback is initiated up to a first time point so that the user's cognition of the first thermal feedback is enhanced.

Abstract: The present invention relates to a feedback device and a thermal feedback provision method using the same. The thermal feedback provision method may include checking first operating power applied to a first thermoelectric couple group for a first thermoelectric operation and second operating power applied to a second thermoelectric couple group for a second thermoelectric operation when the first thermoelectric operation is initiated in the first thermoelectric couple group to initiate the output of the first thermal feedback after the second thermoelectric operation is initiated in the second thermoelectric couple group to initiate the output of the second thermal feedback and include applying cognitive enhancement power for enhancing a user's cognition to the first thermoelectric couple group from a time point at which the output of the first thermal feedback is initiated up to a first time point so that the user's cognition of the first thermal feedback is enhanced.

Abstract: The present invention relates to a feedback device and a thermal feedback provision method using the same. The thermal feedback provision method may include checking first operating power applied to a first thermoelectric couple group for a first thermoelectric operation and second operating power applied to a second thermoelectric couple group for a second thermoelectric operation when the first thermoelectric operation is initiated in the first thermoelectric couple group to initiate the output of the first thermal feedback after the second thermoelectric operation is initiated in the second thermoelectric couple group to initiate the output of the second thermal feedback and include applying cognitive enhancement power for enhancing a user's cognition to the first thermoelectric couple group from a time point at which the output of the first thermal feedback is initiated up to a first time point so that the user's cognition of the first thermal feedback is enhanced.

Abstract: The present invention relates to a feedback device and a thermal feedback provision method using the same. The thermal feedback provision method may include checking first operating power applied to a first thermoelectric couple group for a first thermoelectric operation and second operating power applied to a second thermoelectric couple group for a second thermoelectric operation when the first thermoelectric operation is initiated in the first thermoelectric couple group to initiate the output of the first thermal feedback after the second thermoelectric operation is initiated in the second thermoelectric couple group to initiate the output of the second thermal feedback and include applying cognitive enhancement power for enhancing a user's cognition to the first thermoelectric couple group from a time point at which the output of the first thermal feedback is initiated up to a first time point so that the user's cognition of the first thermal feedback is enhanced.

Abstract: The present invention relates to a feedback device and a thermal feedback provision method using the same. The thermal feedback provision method may include checking first operating power applied to a first thermoelectric couple group for a first thermoelectric operation and second operating power applied to a second thermoelectric couple group for a second thermoelectric operation when the first thermoelectric operation is initiated in the first thermoelectric couple group to initiate the output of the first thermal feedback after the second thermoelectric operation is initiated in the second thermoelectric couple group to initiate the output of the second thermal feedback and include applying cognitive enhancement power for enhancing a user's cognition to the first thermoelectric couple group from a time point at which the output of the first thermal feedback is initiated up to a first time point so that the user's cognition of the first thermal feedback is enhanced.

Abstract: Disclosed herein are a feedback device and a method of providing thermal feedback using the same. The feedback device according to an embodiment of the present disclosure includes a thermoelectric module including a substrate having flexibility, a thermoelement disposed on the substrate and configured to perform a thermoelectric operation for thermal feedback, and a contact surface disposed on the substrate, and configured to transfer heat generated through the thermoelectric operation to a user through the substrate and the contact surface to output the thermal feedback; and a feedback controller configured to control the thermoelectric module, and wherein the feedback controller controls the thermoelectric module so that, after a temperature of the contact surface reaches a maximum temperature, the temperature of the contact surface is maintained within a predetermined temperature range during an entire thermoelectric operation time interval.

Abstract: The present invention relates to a feedback device and a thermal feedback provision method using the same. The thermal feedback provision method may include checking first operating power applied to a first thermoelectric couple group for a first thermoelectric operation and second operating power applied to a second thermoelectric couple group for a second thermoelectric operation when the first thermoelectric operation is initiated in the first thermoelectric couple group to initiate the output of the first thermal feedback after the second thermoelectric operation is initiated in the second thermoelectric couple group to initiate the output of the second thermal feedback and include applying cognitive enhancement power for enhancing a user's cognition to the first thermoelectric couple group from a time point at which the output of the first thermal feedback is initiated up to a first time point so that the user's cognition of the first thermal feedback is enhanced.

Abstract: The present invention includes a foam composition including a foam precursor and an ortho-phthalate-based compound, wherein a volume ratio of the foam precursor to the ortho-phthalate-based compound is 100:10 to 50, and a flexible thermoelectric device including the foam manufactured thereby.

Abstract: Disclosed herein are a feedback device and a method of providing thermal feedback using the same. The feedback device according to an embodiment of the present disclosure includes a thermoelectric module including a substrate having flexibility, a thermoelement disposed on the substrate and configured to perform a thermoelectric operation for thermal feedback, and a contact surface disposed on the substrate, and configured to transfer heat generated through the thermoelectric operation to a user through the substrate and the contact surface to output the thermal feedback; and a feedback controller configured to control the thermoelectric module, and wherein the feedback controller controls the thermoelectric module so that, after a temperature of the contact surface reaches a maximum temperature, the temperature of the contact surface is maintained within a predetermined temperature range during an entire thermoelectric operation time interval.