Abstract: A pouch-type battery case according to an embodiment of the invention may accommodate an electrode assembly, in which electrodes and separators are alternately stacked. The pouch-type battery case may include: a pair of recess parts, each of which has a recessed shape; a pair of terraces that are disposed around the pair of recess parts and are inclined downward in a direction closer to each other in a state; in which the battery case is unfolded; and a bridge disposed between the pair of recess parts, configured to connect the pair of recess parts to each other, having a pair of connection surfaces formed to be inclined upward from a bottom surface of each of the pair of recess parts in a direction closer to each other. In the state in which the battery case is unfolded, an angle formed by the pair of terraces may be an obtuse angle.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall between the cavity ceiling and the cavity base.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a substrate comprising a dielectric layer and a wiring pattern embedded in and exposed from the dielectric layer.

Abstract: Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.

Abstract: A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device, and a method of manufacturing thereof, that comprises a substrate including a dielectric layer, at least one conductive trace and conductive bump pad formed on one surface of the dielectric layer, and a protection layer covering the at least one conductive trace and conductive bump pad, the at least one conductive bump pad having one end exposed through the protection layer, and a semiconductor die electrically connected to the conductive bump pad of the substrate.

Abstract: Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.

Abstract: There is provided an automatic emergency lifting or lowering system for an operational deployment facility with a long hoisting distance, wherein the operational deployment facility has a platform and a trace-tracking device hidden in the platform, wherein the trace-tracking device is configured to track a trace of a moving object including a missile and a bomb, wherein the automatic emergency lifting or lowering system comprises; at least one hoist apparatus configured to lower or lift the trace-tracking device; and at least one hydraulic motor coupled to the hoist apparatus to drive the hoist apparatus in a lifting or lowering mode.

Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a substrate comprising a dielectric layer and a wiring pattern embedded in and exposed from the dielectric layer.

Abstract: A semiconductor package and a method for manufacturing a semiconductor package that comprises a unit substrate, for example to which a semiconductor chip is attached, embedded in a base substrate on which a semiconductor device may be mounted. The base substrate may, for example, comprise vias between top and bottom surfaces thereof and/or vias between the top surface of the base substrate and a top surface of the unit substrate embedded within the base substrate.

Abstract: A method for dealing with attacks of malicious BOTs in a network security system includes detecting and analyzing a domain name receiving excessive DNS queries to judge the infection of a malicious BOT, registering the corresponding domain name as normal or abnormal management target, and redirecting an abnormal DNS query for the abnormal management target to a redirection processing & response system. Thereby, the automatic detection of malicious BOT attacks and the mechanism which performs the measures and the analysis simultaneously can protect the DNS servers and prevent the security accidents by malicious BOT attacks previously.

Abstract: A method for dealing with attacks of malicious BOTs in a network security system includes detecting and analyzing a domain name receiving excessive DNS queries to judge the infection of a malicious BOT, registering the corresponding domain name as normal or abnormal management target, and redirecting an abnormal DNS query for the abnormal management target to a redirection processing & response system. Thereby, the automatic detection of malicious BOT attacks and the mechanism which performs the measures and the analysis simultaneously can protect the DNS servers and prevent the security accidents by malicious BOT attacks previously.