Abstract: A method for manufacturing a build-up multi-layer printed circuit board is disclosed which is used in the mother board of a computer, camera-incorporated VTRs, MCMs (multi chip module), CSPs (chip size package) or portable phones. In the build-up multi-layer printed circuit board of the present invention, an inner-layer connecting state is improved. The multi-layer printed circuit board is manufactured by sequentially stacking insulating resin layers and circuit conductor layers based on a build-up method. That is, a first insulating resin layer is necessarily made to undergo an exposure and a development so as to form a first via hole 122. Then a second via hole 124 which is larger than the first via hole 122 is formed on a second insulating resin layer, thereby forming a final V shaped photo via hole 120. Thus build-up multi-layer printed circuit board is manufactured.