Patents by Inventor Se Yeong Jang

Se Yeong Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230169950
    Abstract: A method of canceling road noise includes: receiving a first signal from an acceleration sensor disposed at a vehicle and a second signal from a microphone disposed at the vehicle; monitoring, based on the first and second signals, whether an abnormal event has occurred; determining, based on a result from monitoring whether the abnormal event has occurred, a plurality of parameter values for performing adaptive filtering; and performing, based on the determined parameter values, adaptive filtering to generating an output signal for noise canceling.
    Type: Application
    Filed: September 30, 2022
    Publication date: June 1, 2023
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventors: Se Yeong JANG, Joo Won PARK, Dong Hwan KIM
  • Patent number: 9631413
    Abstract: Disclosed is a method of effectively controlling a vehicle power trunk/tailgate in a vehicle power trunk/tailgate control system by performing a synchronization procedure between the left and right spindles in a vehicle having a power trunk/tailgate. Since a speed difference is not generated between the left and right spindle motors, the power trunk/tailgate can be driven more stably.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: April 25, 2017
    Assignee: MOTOTECH, CO. LTD
    Inventors: Se Yeong Jang, Jae Young Park, Sang Il Lee
  • Publication number: 20160222713
    Abstract: Disclosed is a method of effectively controlling a vehicle power trunk/tailgate in a vehicle power trunk/tailgate control system by performing a synchronization procedure between the left and right spindles in a vehicle having a power trunk/tailgate. Since a speed difference is not generated between the left and right spindle motors, the power trunk/tailgate can be driven more stably.
    Type: Application
    Filed: March 6, 2015
    Publication date: August 4, 2016
    Inventors: Se Yeong Jang, Jae Young Park, Sang Il Lee
  • Publication number: 20150019046
    Abstract: Disclosed is a system for controlling a power trunk or a power tailgate provided in a vehicle. The system includes: a rear sensing device that senses an object approaching a vehicle from a rear side of the vehicle within a predetermined distance; a smart key module (SKM) that recognizes a FOB key in a wireless manner and authenticates whether or not the FOB key is valid for the vehicle; and a power trunk/tailgate control device that receives an object sense signal from the rear sensing device, analyzes the object sense signal to determine whether or not the object makes a predetermined motion, and performs control such that the power trunk or the power tailgate is opened or closed when it is determined that the object makes the predetermined motion, and the smart key module authenticates that the FOB key is valid. Since it is possible to control the open/close operation of the power trunk or the power tailgate using a rear parking sensor, it is possible to improve user's convenience.
    Type: Application
    Filed: July 9, 2014
    Publication date: January 15, 2015
    Inventors: Se Yeong JANG, Jae Young PARK, Jae Hyoung AN, Sang Il LEE
  • Patent number: 7755181
    Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: July 13, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun Joo Han, Tae Sang Park, Se Yeong Jang, Young Jun Moon, Jung Hyeon Kim, Sung Wook Kang
  • Publication number: 20080157326
    Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.
    Type: Application
    Filed: October 16, 2007
    Publication date: July 3, 2008
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Hyun Joo HAN, Tao Sang Park, Se Yeong Jang, Young Jun Moon, Jung Hyeon Kim, Sung Wook Kang