Patents by Inventor Seamus O'Brien

Seamus O'Brien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Monitoring slot formation in substrates
    Patent number: 7479617
    Abstract: A light beam is used to cut a slot in a first side of substrate. An optical sensor monitors a surface of a second side of the substrate that is opposite the first side while cutting the slot. If the light beam breaks through the surface of the second side, the sensor detects the light beam.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: January 20, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Graeme Scott, Seamus O'Brien, Iain Campbell-Brown
  • Wafer processing apparatus and method
    Publication number: 20040075717
    Abstract: A method of dicing a wafer into a plurality of dies is disclosed. The wafer comprises a substrate having a surface on which at least one thin film layer is formed. The method comprises the steps of laser cutting a plurality of lines in the wafer to at least the depth of the at least one thin film layer; and saw cutting along the plurality of lines in the wafer to dice the wafer.
    Type: Application
    Filed: October 16, 2002
    Publication date: April 22, 2004
    Inventors: Seamus O'Brien, Aidan Corcoran