Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.

Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.

Abstract: Technologies are described herein for scanning machine images using a scanning service to identify potential risks. The scanning service may be associated with a service provider network. A scan request is received at the scanning service that requests machine images to be scanned. One or more scans may be performed on each of the machine images. An execution environment may host a machine image during a scan of the machine image. Scan result data associated with the scans is stored. The scan result data may be used to provide scan results to the requestor.

Abstract: Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

Abstract: A haptic feedback device configured to provide tactile or haptic feedback for an electronic device. The haptic device includes a platform operably secured to the electronic device to allow rotation about a center axis. An activating member is operably associated with the platform and configured to selectively cause the platform to rotate in a first direction. Also, the haptic feedback device includes a restoring member operably associated with the platform and configured to selectively return the platform to a first position after it has rotated for at least one of a select period of time or a select distance.

Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.

Abstract: Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.

Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.

Abstract: This is directed to self-shielded components and methods for making the same. A self-shielded component can include an electromagnetic interference (EMI) shield that contains circuitry within a shielded space defined by the EMI shield. Self-shielding can be achieved by interfacing a conformal shield layer to a ground layer disposed on or within a substrate of the self-shielded component. The combination of the conformal shield layer and the around layer can form a boundary of the shielded space that envelops circuitry requiring shielding. This enables the self-shielded component to be mounted to a circuit board without requiring a shield can or other processing to impart EMI shielding. In addition, the self-shielded components include the benefits of EMI shielding while simultaneously decreasing space requirements.

Abstract: There are provided systems and methods for conducting secure wireless financial transactions using portable electronic devices. For example, a method of conducting a wireless transaction is provided that includes taking a picture of a first QR code displayed on a transaction terminal using a camera of a portable electronic device. The method also includes sending data from the portable electronic device to the transaction terminal to conduct the financial transaction with the transaction terminal using a near field communication channel or another wireless communication channel, or both. This data is derived from the first QR code to enable the transaction terminal to verify that the portable electronic device is physically located near the transaction terminal.

Abstract: Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.

Abstract: Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.

Abstract: This is directed to self-shielded components and methods for making the same. A self-shielded component can include an electromagnetic interference (EMI) shield that contains circuitry within a shielded space defined by the EMI shield. Self-shielding can be achieved by interfacing a conformal shield layer to a ground layer disposed on or within a substrate of the self-shielded component. The combination of the conformal shield layer and the around layer can form a boundary of the shielded space that envelops circuitry requiring shielding. This enables the self-shielded component to be mounted to a circuit board without requiring a shield can or other processing to impart EMI shielding. In addition, the self-shielded components include the benefits of EMI shielding while simultaneously decreasing space requirements.

Abstract: Disclosed herein are methods for operating a computing device including determining an amount of pressure exerted on a touch-sensitive surface of the computing device. According to the various embodiments, a touch input is received by the touch-sensitive surface. The amount of pressure exerted by the touch input on the touch-sensitive surface is then determined. The computing device operates in a first manner when a first amount of pressure is received and operates in a second manner when a second amount of pressure is received.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.

Abstract: A portable device includes: an enclosure, one or more processors for executing one or more programs; one or more actuators in or on the enclosure for generating mechanical vibrations; one or more sensors in or on the enclosure for detecting mechanical vibrations; and memory storing one or more programs for execution by the one or more processors. The device analyzes one or more signals produced by the one or more sensors with respect to mechanical vibrations to determine a holding state of the portable device, and conditionally modifies operation of at least one application executed by the one or more processors in accordance with the determined holding state.

Abstract: An integrated structure for interconnection of electrical components is provided. In one embodiment, the integrated structure includes a through mold via (TMV) module having a substrate and at least one component coupled to the substrate. A flexible printed circuit board (flex-PCB) is integrated with the substrate of the TMV module. A TMV is provided through a body of the module to allow the flex-PCB to couple with a logic board.

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.