Abstract: A computer-readable storage medium may include executable instructions stored thereon that, when executed by a processor, may be configured to establish a connection to a node of a distributed ledger network that maintains a distributed ledger. The processor may obtain a first dataset from a first user, perform pre-processing on the first dataset to obtain a first data asset based on the first dataset, and store the first data asset. The processor may calculate a first value for the first data asset and generate a first data proposition based on the first data asset. The processor may obtain acceptance data from a second user, which may include data indicating acceptance by the second user of the first data proposition. The processor may transmit a first distributed ledger record to the node of the distributed ledger network.

Abstract: A computer-readable storage medium may include executable instructions stored thereon that, when executed by a processor, may be configured to establish a connection to a node of a distributed ledger network that maintains a distributed ledger. The processor may obtain a first dataset from a first user, perform pre-processing on the first dataset to obtain a first data asset based on the first dataset, and store the first data asset. The processor may calculate a first value for the first data asset and generate a first data proposition based on the first data asset. The processor may obtain acceptance data from a second user, which may include data indicating acceptance by the second user of the first data proposition. The processor may transmit a first distributed ledger record to the node of the distributed ledger network.

Abstract: In an example, a method of manufacturing a MEMS device includes forming a via. The method also includes depositing metal in the via and depositing a first layer of a non-photoactive organic polymer on the metal. The method includes baking the first layer of the non-photoactive organic polymer. The method also includes depositing a second layer of the non-photoactive organic polymer on the first layer of the non-photoactive organic polymer after baking the first layer of the non-photoactive organic polymer. The method includes baking the second layer of the non-photoactive organic polymer. The method also includes etching the first layer and the second layer of the non-photoactive organic polymer.

Abstract: A computer-readable storage medium may include executable instructions stored thereon that, when executed by a processor, may be configured to establish a connection to a node of a distributed ledger network that maintains a distributed ledger. The processor may obtain a first dataset from a first user, perform pre-processing on the first dataset to obtain a first data asset based on the first dataset, and store the first data asset. The processor may calculate a first value for the first data asset and generate a first data proposition based on the first data asset. The processor may obtain acceptance data from a second user, which may include data indicating acceptance by the second user of the first data proposition. The processor may transmit a first distributed ledger record to the node of the distributed ledger network.

Abstract: In described examples, an image-generating panel is arranged for modulating a projection beam to include a modulated optical image. A cooling device is arranged to transfer heat received from the image-generating panel to a heat sink. The cooling device is arranged to receive the projection beam on a first side and to transmit the projection beam from a second side. The heat received from the image-generating panel can include heat generated by the image-generating panel in response to incidental sunlight.

Abstract: In described examples, an image-generating panel is arranged for modulating a projection beam to include a modulated optical image. A cooling device is arranged to transfer heat received from the image-generating panel to a heat sink. The cooling device is arranged to receive the projection beam on a first side and to transmit the projection beam from a second side. The heat received from the image-generating panel can include heat generated by the image-generating panel in response to incidental sunlight.

Abstract: A method of fabricating a MEMS device. A first spacer is formed above a CMOS substrate containing circuitry. Vias are formed within the first spacer. A first metal is formed above the first spacer and vias and patterned to form a MEMS element. A second spacer is formed above the MEMS element and first spacer. A via is formed within the second spacer. A second metal is formed above the second spacer and the via. A capping layer is formed above the second metal. The second metal is patterned to form a second MEMS element. The device is cleaned using a developer solution while the capping layer protects the second MEMS element. The first and second spacers are removed to release the first and second MEMS elements.

Abstract: A microelectromechanical system (MEMS) is comprised of a micromirror device attached to a semiconductor device. A first spacer layer is formed and patterned to form hinge via openings. A hinge metal is deposited above the first spacer layer to form the hinge and the hinge vias. A capping layer is formed above the hinge metal and hinge vias. A second spacer layer is formed above the capping layer and patterned to form a mirror via. The capping layer protects the hinge metal from the developer solution used in the patterning step. The capping layer is removed from within the mirror via opening. Another metal layer is deposited above the second spacer layer to form the mirror and the mirror via.

Abstract: A microelectromechanical system (MEMS) is comprised of a micromirror device attached to a semiconductor device. A first spacer layer is formed and patterned to form hinge via openings. A hinge metal is deposited above the first spacer layer to form the hinge and the hinge vias. A capping layer is formed above the hinge metal and hinge vias. A second spacer layer is formed above the capping layer and patterned to form a mirror via. The capping layer protects the hinge metal from the developer solution used in the patterning step. The capping layer is removed from within the mirror via opening. Another metal layer is deposited above the second spacer layer to form the mirror and the mirror via.

Abstract: A microelectromechanical (MEMS) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers. A first member forming layer forms a lower part of the member and supporting structure for the via support. First and second fill layers are deposited and patterned to form a plug that fills an inner cavity opening in the via structure. The plug is planarized to a planar part of the first member forming layer, and a second member forming layer is deposited over the first member forming layer and the planarized plug to form an upper part of the member. The via support may have a cavity filled by BARC layers.

Abstract: A microelectromechanical (MEMS) device has a movable member supported above a substrate on a via support. The member and via support are fabricated integrally from first and second member forming layers. A first member forming layer forms a lower part of the member and supporting structure for the via support. First and second fill layers are deposited and patterned to form a plug that fills an inner cavity opening in the via structure. The plug is planarized to a planar part of the first member forming layer, and a second member forming layer is deposited over the first member forming layer and the planarized plug to form an upper part of the member. In an example micromirror device, metal layers define a movable mirror member supported on a via support which has a cavity filled by BARC layers. The BARC layers are planarized to a planar portion of a first metal layer and a second metal layer is formed over the first metal layer planar portion and planarized BARC layer plug.