Patents by Inventor Sean J. Hearne

Sean J. Hearne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Active mechanical-environmental-thermal MEMS device for nanoscale characterization
    Patent number: 10641733
    Abstract: A microelectromechanical system (MEMS) device can be used for quantitative mechanical testing of materials within a controlled (chemical and temperature) environment, with the ability for electrochemical control to the specimen, that is coupled with a complimentary in-situ characterization technique.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: May 5, 2020
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Katherine L. Jungjohann, William Mook, Claire Chisholm, Michael Shaw, Khalid M. Hattar, Paul C. Galambos, Andrew Jay Leenheer, Sean J. Hearne
  • Active Mechanical-Environmental-Thermal MEMS Device for Nanoscale Characterization
    Publication number: 20180266989
    Abstract: A microelectromechanical system (MEMS) device can be used for quantitative mechanical testing of materials within a controlled (chemical and temperature) environment, with the ability for electrochemical control to the specimen, that is coupled with a complimentary in-situ characterization technique.
    Type: Application
    Filed: March 19, 2018
    Publication date: September 20, 2018
    Inventors: Katherine L. Jungjohann, William Mook, Claire Chisholm, Michael Shaw, Khalid M. Hattar, Paul C. Galambos, Andrew Jay Leenheer, Sean J. Hearne
  • Photovoltaic system
    Patent number: 8736108
    Abstract: A photovoltaic system described herein includes a first group of photovoltaic modules that comprises a first plurality of microsystem enabled photovoltaic modules. A second group of photovoltaic modules comprises a second plurality of microsystem enabled photovoltaic modules, wherein the first group of photovoltaic modules are electrically connected in parallel to the second group of photovoltaic modules.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: May 27, 2014
    Assignee: Sandia Corporation
    Inventors: Gregory N. Nielson, Murat Okandan, Anthony L. Lentine, William C. Sweatt, Paul Gilbert Clem, Sean J. Hearne, Paul Davids, Dale L. Huber, Jeffrey S. Nelson, Christopher Alan Apblett
  • Lateral electrodeposition of compositionally modulated metal layers
    Patent number: 8679860
    Abstract: A method for making a laterally modulated metallic structure that is compositionally modulated in the lateral direction with respect to a substrate.
    Type: Grant
    Filed: August 12, 2010
    Date of Patent: March 25, 2014
    Assignee: Sandia Corporation
    Inventor: Sean J. Hearne
  • Method for alloy-electroplating group IB metals with refractory metals for interconnections
    Patent number: 6930391
    Abstract: An electroplated metal alloy including at least three elements. A multilayer interconnection structure that includes a substrate that is an interior of the interconnection structure, a conductive seed layer exterior to the substrate, and an electroplated metal alloy layer including at least three elements exterior to the conductive seed layer. A multilayer interconnection structure formed on a substrate, that includes a barrier layer, and a conductive seed layer, wherein the improvement includes an electroplated metal alloy layer including at least three elements. A method for forming a multilayer interconnection structure that includes providing a substrate, depositing a conductive seed layer, and electroplating a metal alloy layer including at least three elements exterior to the conductive seed layer.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: August 16, 2005
    Assignee: Intel Corporation
    Inventors: Grant M. Kloster, Sean J. Hearne
  • Method for alloy-electroplating group IB metals with refractory metals for interconnections
    Publication number: 20040041264
    Abstract: An electroplated metal alloy including at least three elements. A multilayer interconnection structure that includes a substrate that is an interior of the interconnection structure, a conductive seed layer exterior to the substrate, and an electroplated metal alloy layer including at least three elements exterior to the conductive seed layer. A multilayer interconnection structure formed on a substrate, that includes a barrier layer, and a conductive seed layer, wherein the improvement includes an electroplated metal alloy layer including at least three elements. A method for forming a multilayer interconnection structure that includes providing a substrate, depositing a conductive seed layer, and electroplating a metal alloy layer including at least three elements exterior to the conductive seed layer.
    Type: Application
    Filed: August 27, 2002
    Publication date: March 4, 2004
    Inventors: Grant M. Kloster, Sean J. Hearne