Abstract: An improved performance and cost-effective control for an automatic motor vehicle HVAC system in which the system variables are controlled without regard to a measured in-car temperature during steady-state conditions, and in which the steady-state control is modified during transient conditions by a time-dependent open-loop compensation term, INCAR. The initial value of INCAR, a target value and a time rate of change are initialized as a function of environmental and system conditions at the onset of the transient condition. At ignition key-on, INCAR is initialized in accordance with an estimate of the in-car temperature, and exponentially adjusted toward a predetermined reference temperature (target), such as 75°, at a rate determined by the initial temperature, preferably with adjustments being made for door opening and closing.

Abstract: An improved interconnect apparatus for high power circuits that is low in cost and amenable for integration with low power circuits in a single electronic package. The interconnect apparatus includes serially connected surface mount bus bars bridging two or more metal pads or traces formed on a standard circuit board of the type used to package low power circuitry. The surface mount bus bars operate not only to conduct the higher currents, but also to draw heat out of the metal pads or intervening portions of the metal traces. This keeps the temperature within the capabilities of low power circuit board technology, and allows very narrow high power interconnects for reduced package size. Manufacturing cost advantages are achieved because the surface mount bus bars are assembled by automated pick-and-place equipment of the same type used for other surface mount components used in the package.

Abstract: An automotive circuit package combines electronic control functions and power function on a single circuit board substrate. Electronic components including signal level terminals are in one section of the substrate and an array of power terminals are in a second section of the substrate but sharing some common circuit paths carrying control signals. Supplemental conductors in the second section are selectively connected to power terminals to carry high current levels. Each terminal is a through access terminal for directly connecting conductors on the substrate, wiring harness connectors on one side of the substrate and fuses and relays on the other side of the substrate. In one embodiment the terminals have a male portion extending from one side of the substrate and a female portion on the other side. In another embodiment male and female portions are on the same side of the substrate and apertures in the substrate allow plugging into the female portions from the other side.

Abstract: An integrated BEDC and PCB provided through a low cost, highly reliable interconnect system. The upper and/or lower half of the main insulation assembly of a BEDC is provided with a recess for accommodating at least an edge portion of the substrate of a PCB. The PCB is provided with apertures such as holes for receiving therethrough a buss wire and/or terminal slots through which terminals having wire slots are fixedly staked. The apertures on the PCB are arranged in a predetermined pattern so as to align with corresponding respective apertures in the form of corresponding holes and/or terminal slots on the BEDC at the recess thereof. Accordingly, with the PCB seated in the recess, as the buss wires are laid, they will pass through the holes in the PCB and/or pass through the wire slot of the terminals and thereby provide interconnection therebetween when the two halves of the main insulation assembly are united and the PCB is sandwiched therebetween.