Abstract: Today, energy requiring equipment commonly relies on batteries for power. The excessive weight and size of batteries severely limits their performance. Described herein is a lightweight portable energy system which includes an ultra-high capacity hydrolysable hydride gel cartridge for use in supplying hydrogen gas to hydrogen based energy generators. Hydrolysable hydride reactivity is controlled by tuning the amounts of hydrophilic and hydrophobic content in a polymer gel encapsulant of the cartridge.

Abstract: One embodiment of the present invention provides an energy-asset control system for utilizing an energy asset to provide one of more modes of operation services. The system includes an economic optimizer configured to identify at least one mode of operation opportunity based on current and/or future market conditions; a prognostics module configured to perform a prognostic analysis associated with the mode of operation opportunity for the energy asset using an existing model, and determine a confidence level associated with the prognostic analysis; and an operation controller. The economic optimizer is further to configured to, in response to the prognostics module determining the confidence level exceeding a predetermined threshold, determine an expected profit of the mode of operation opportunity based on outcomes of the prognostic analysis; and optimize, over a predetermined time period, a usage of the energy asset based on the expected profit of the mode of operation opportunity.

Abstract: Today, energy requiring equipment commonly relies on batteries for power. The excessive weight and size of batteries severely limits their performance. Described herein is a lightweight portable energy system which includes an ultra-high capacity hydrolysable hydride gel cartridge for use in supplying hydrogen gas to hydrogen based energy generators. Hydrolysable hydride reactivity is controlled by tuning the amounts of hydrophilic and hydrophobic content in a polymer gel encapsulant of the cartridge.

Abstract: A thermally tempered glass substrate for transient electronic systems (i.e., including electronic devices that visually disappear when triggered to do so) including two or more fused-together glass structures having different coefficient of thermal expansion (CTE) values disposed in an intermixed arrangement manner that generates and stores potential energy in the form of residual, self-equilibrating internal stresses. In alternative embodiments the substrate includes laminated glass sheets, or glass elements (e.g., beads or cylinders) disposed in a glass layer. A trigger device causes an initial fracture in the thermally tempered glass substrate, whereby the fracture energy nearly instantaneously travels throughout the thermally tempered glass substrate, causing the thermally tempered glass substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. Patterned fracture features are optionally provided to control the final fractured particle size.

Abstract: A thermally tempered glass substrate for transient electronic systems (i.e., including electronic devices that visually disappear when triggered to do so) including two or more fused-together glass structures having different coefficient of thermal expansion (CTE) values disposed in an intermixed arrangement manner that generates and stores potential energy in the form of residual, self-equilibrating internal stresses. In alternative embodiments the substrate includes laminated glass sheets, or glass elements (e.g., beads or cylinders) disposed in a glass layer. A trigger device causes an initial fracture in the thermally tempered glass substrate, whereby the fracture energy nearly instantaneously travels throughout the thermally tempered glass substrate, causing the thermally tempered glass substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. Patterned fracture features are optionally provided to control the final fractured particle size.

Abstract: A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.

Abstract: One embodiment of the present invention provides an energy-asset control system for utilizing an energy asset to provide one of more modes of operation services. The system includes an economic optimizer configured to identify at least one mode of operation opportunity based on current and/or future market conditions; a prognostics module configured to perform a prognostic analysis associated with the mode of operation opportunity for the energy asset using an existing model, and determine a confidence level associated with the prognostic analysis; and an operation controller. The economic optimizer is further to configured to, in response to the prognostics module determining the confidence level exceeding a predetermined threshold, determine an expected profit of the mode of operation opportunity based on outcomes of the prognostic analysis; and optimize, over a predetermined time period, a usage of the energy asset based on the expected profit of the mode of operation opportunity.

Abstract: A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.

Abstract: A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.

Abstract: A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.