Patents by Inventor Sean T. Hansen

Sean T. Hansen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7923893
    Abstract: A capacitive membrane ultrasound transducer is provided. Membranes or other microelectromechanical devices are provided in a 3-1 geometry, allowing application of an electric field substantially perpendicular to a range dimension. The membranes are on a plurality of different respective planes more parallel than perpendicular with each other, and the planes are more perpendicular than parallel with the faces of the elements or transducer.
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: April 12, 2011
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: Nelson H. Oliver, Sean T. Hansen
  • Patent number: 7732992
    Abstract: CMUT elements are formed on a substrate. Electrical conductors are formed to interconnect between different portions of the substrate. The substrate is then separated into pieces while maintaining the electrical connections across the separation. Since the conductors are flexible, the separated substrate slabs may be positioned on a curved surface while maintaining the electrical interconnection between the slabs. Large curvatures may be provided, such as associated with forming a multidimensional transducer array for use in a catheter. The electrical interconnections between the different slabs and elements may allow for a walking aperture arrangement for three dimensional imaging.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: June 8, 2010
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: Walter T. Wilser, Sean T. Hansen, Grazyna M. Palczewska, Stephen R. Barnes
  • Publication number: 20090160289
    Abstract: CMUT elements are formed on a substrate. Electrical conductors are formed to interconnect between different portions of the substrate. The substrate is then separated into pieces while maintaining the electrical connections across the separation. Since the conductors are flexible, the separated substrate slabs may be positioned on a curved surface while maintaining the electrical interconnection between the slabs. Large curvatures may be provided, such as associated with forming a multidimensional transducer array for use in a catheter. The electrical interconnections between the different slabs and elements may allow for a walking aperture arrangement for three dimensional imaging.
    Type: Application
    Filed: March 2, 2009
    Publication date: June 25, 2009
    Inventors: Walter T. Wilser, Sean T. Hansen, Grazyna M. Palczewska, Stephen R. Barnes
  • Patent number: 7514851
    Abstract: CMUT elements are formed on a substrate. Electrical conductors are formed to interconnect between different portions of the substrate. The substrate is then separated into pieces while maintaining the electrical connections across the separation. Since the conductors are flexible, the separated substrate slabs may be positioned on a curved surface while maintaining the electrical interconnection between the slabs. Large curvatures may be provided, such as associated with forming a multidimensional transducer array for use in a catheter. The electrical interconnections between the different slabs and elements may allow for a walking aperture arrangement for three dimensional imaging.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: April 7, 2009
    Assignee: Siemens Medical Solutions USA, Inc.
    Inventors: Walter T. Wilser, Sean T. Hansen, Grazyna M. Palczewska, Stephen R. Barnes