Patents by Inventor Sean Xin Wu

Sean Xin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for reworkable direct chip attachment
    Patent number: 6156408
    Abstract: The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.
    Type: Grant
    Filed: August 29, 1997
    Date of Patent: December 5, 2000
    Assignee: Motorola, Inc.
    Inventors: Wen Xu Zhou, Daniel Roman Gamota, Sean Xin Wu, Chao-pin Yeh, Karl W. Wyatt, Chowdary Ramesh Koripella
  • Method, device and optical package with enhanced temperature stability
    Patent number: 6108109
    Abstract: The present invention provides a method, device and optical package (10,22) for enhancing a temperature stability by controlling a variable characteristic of an optical package and optical interconnect system.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: August 22, 2000
    Assignee: Motorola, Inc.
    Inventors: Alan Gengsheng Chen, Jang-Hun (James) Yeh, Sean Xin Wu
  • Method, article of manufacture, and optical package for eliminating tilt angle between a header and an optical emitter mounted thereon
    Patent number: 6031856
    Abstract: The present invention provides a method, article of manufacture, and optical package (24) for eliminating tilt angle (40) between an optical emitter (26) mounted on a carrier (28). The method, article of manufacture, and optical package (24) include a carrier (28) having a top surface (42) with a cavity (46) formed therein, an adhesive material (38) inserted into the cavity (46), and an optical emitter (26) placed on the top surface (42) of the carrier (28) and at least partially covering the cavity (46), thereby providing at least one egress point for overflowing said adhesive material therefrom.
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: February 29, 2000
    Assignee: Motorola, Inc.
    Inventors: Sean Xin Wu, Gary Mui, Chao-Pin Yeh, Karl W. Wyatt
  • Microelectronic assembly with collar surrounding integrated circuit component on a substrate
    Patent number: 5844319
    Abstract: A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar (18) is affixed to the polymeric substrate (12) about the integrated circuit component (14) and is formed of an inorganic material having a coefficient of thermal expansion less than that of the substrate (12). The collar (18) constrains thermal expansion of the polymeric substrate (12) in the die attach region (22), thereby lessening any deleterious effects caused by a mismatch in the thermal expansion of the polymeric substrate (12) and the integrated circuit component (14).
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: December 1, 1998
    Assignee: Motorola Corporation
    Inventors: Danniel Roman Gamota, George Amos Carson, Sean Xin Wu, Brian J. Bullock