Abstract: A method is provided that includes forming a word line above a substrate, the word line disposed in a first direction, forming a bit line above the substrate, the bit line disposed in a second direction perpendicular to the first direction, forming a nonvolatile memory material between the word line and the bit line, and forming a memory cell including the nonvolatile memory material at an intersection of the bit line and the word line. The nonvolatile memory material includes a semiconductor material layer, and a conductive oxide material layer including a first conductive oxide material layer portion and a second conductive oxide material layer portion. The method also includes forming a barrier material layer between the first conductive oxide material layer portion and the second conductive oxide material layer portion.

Abstract: A method is provided that includes forming a word line above a substrate, forming a bit line above the substrate, forming a nonvolatile memory material between the word line and the bit line, and forming a memory cell including the nonvolatile memory material at an intersection of the bit line and the word line. The word line is disposed in a first direction, and includes a first word line portion and a second word line portion. The second word line portion of the word line includes a first conductive oxide material. The bit line is disposed in a second direction perpendicular to the first direction. The nonvolatile memory material includes a barrier oxide material layer and a second conductive oxide material layer, with the barrier oxide material layer disposed adjacent the second word line portion of the word line.

Abstract: A method is provided that includes forming a word line above a substrate, forming a bit line above the substrate, forming a nonvolatile memory material between the word line and the bit line, the nonvolatile memory material including a semiconductor material layer and a conductive oxide material layer, forming a barrier material layer between the semiconductor material layer and the conductive oxide material layer, and forming a memory cell including the nonvolatile memory material at an intersection of the bit line and the word line. The word line is disposed in a first direction, the bit line is disposed in a second direction perpendicular to the first direction. The barrier material layer has an ionic conductivity of greater than about 0.1 Siemens/cm @ 1000° C.

Abstract: A method is provided that includes forming a word line above a substrate, the word line disposed in a first direction, forming a bit line above the substrate, the bit line disposed in a second direction perpendicular to the first direction, forming a nonvolatile memory material between the word line and the bit line, and forming a memory cell including the nonvolatile memory material at an intersection of the bit line and the word line. The nonvolatile memory material includes a semiconductor material layer, a conductive oxide material layer and a semiconductor oxide region. The method also includes forming one or more of a first barrier material layer in the semiconductor material layer, a second barrier material layer between the semiconductor oxide region and the conductive oxide material layer, and a third barrier material layer in the conductive oxide material layer.

Abstract: A memory device is provided that includes a memory controller coupled to a memory cell including a barrier modulated switching structure. The memory controller is adapted to program the memory cell to a first programming state, and program the memory cell to one of a plurality of target programming states from the first programming state.