Patents by Inventor Sebastian PAHLKE

Sebastian PAHLKE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip carrier laminate with high frequency dielectric and thermomechanical buffer
    Patent number: 10607911
    Abstract: A chip carrier for carrying an encapsulated electronic chip, wherein the chip carrier comprises a laminate structure formed as a stack of a plurality of electrically insulating structures and a plurality of electrically conductive structures, and a chip coupling area at an exposed surface of the laminate structure being configured for electrically and mechanically coupling the encapsulated electronic chip, wherein one of the electrically insulating structures is configured as high frequency dielectric made of a material being compatible with low-loss transmission of a high-frequency signal, and wherein at least one of another one of the electrically insulating structures and one of the electrically conductive structures is configured as a thermomechanical buffer for buffering thermally induced mechanical load.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: March 31, 2020
    Assignee: Infineon Technologies AG
    Inventors: Martin Richard Niessner, Walter Hartner, Gerhard Haubner, Sebastian Pahlke
  • Chip carrier laminate with high frequency dielectric and thermomechanical buffer
    Publication number: 20160211189
    Abstract: A chip carrier for carrying an encapsulated electronic chip, wherein the chip carrier comprises a laminate structure formed as a stack of a plurality of electrically insulating structures and a plurality of electrically conductive structures, and a chip coupling area at an exposed surface of the laminate structure being configured for electrically and mechanically coupling the encapsulated electronic chip, wherein one of the electrically insulating structures is configured as high frequency dielectric made of a material being compatible with low-loss transmission of a high-frequency signal, and wherein at least one of another one of the electrically insulating structures and one of the electrically conductive structures is configured as a thermomechanical buffer for buffering thermally induced mechanical load.
    Type: Application
    Filed: January 18, 2016
    Publication date: July 21, 2016
    Inventors: Martin Richard NIESSNER, Walter HARTNER, Gerhard HAUBNER, Sebastian PAHLKE