Abstract: A micromechanical pressure sensor system, including: a substrate; a pressure sensor component connected to the substrate; and an essentially hollow frustum-shaped sleeve structure, which is connected to the substrate, which surrounds the pressure sensor component at least laterally and which has an opening at a side of the sleeve structure facing away from the substrate.

Abstract: A method for manufacturing a MEMS sensor. The method includes: providing a substrate, applying a support layer onto a back side of the substrate, forming at least one cavity in the substrate in such a way that an access to the back side from the front side is formed, introducing a MEMS structure into the at least one cavity, and fixing the MEMS structure on the support layer.

Abstract: A device is described for protecting components, housings and the like against liquids and for ventilating the same, including at least one first layer, the first layer being configured as a diaphragm and this has a first area in such a way that the first area is configured as gas-permeable and liquid-tight below a first liquid pressure, and at least one second layer, the second layer being connected pressure-tight at least in part to the first layer, and having a second area that is configured in such a way that the first area and the second area interact for sealing against a liquid at a liquid pressure greater than or equal to the first liquid pressure.

Abstract: A method for producing a plurality of sensor devices. The method includes: furnishing a substrate having contact points in a plurality of predetermined regions for sensor chips; disposing the sensor chips in the predetermined regions on the substrate, and electrically contacting the sensor chips to the contact points; attaching a frame structure with an adhesive material on the substrate and between the sensor chips, the frame structure proceeding laterally around the sensor chips, the frame structure extending, after attachment, vertically beyond the sensor chips and forming a respective cavity for at least one of the sensor chips, and a membrane spanning at least one of the cavities for the sensor chips so as to cover it; and singulating the substrate, or the frame structure and the substrate, around the respective cavities into several sensor devices.

Abstract: A method for manufacturing a MEMS sensor. The method includes: providing a substrate, applying a support layer onto a back side of the substrate, forming at least one cavity in the substrate in such a way that an access to the back side from the front side is formed, introducing a MEMS structure into the at least one cavity, and fixing the MEMS structure on the support layer.

Abstract: A micromechanical sensor device is described that includes an integrated housing seal, a micromechanical sensor assembly, and a corresponding manufacturing method. The micromechanical sensor device with an integrated housing seal is equipped with a micromechanical sensor chip that includes an upper side and a lower side, a sensor area that may be brought into contact with an environmental medium being provided on or at the upper side, and is equipped with at least one circumferential trench, open toward the upper side, that is provided in the periphery of the sensor area and that is at least partly filled with a sealing medium for sealing a corresponding area of a housing to be mounted thereon.

Abstract: A micromechanical pressure sensor system, including: a substrate; a pressure sensor component connected to the substrate; and an essentially hollow frustum-shaped sleeve structure, which is connected to the substrate, which surrounds the pressure sensor component at least laterally and which has an opening at a side of the sleeve structure facing away from the substrate.

Abstract: A sensor and/or sound detection device having a sensing device having a sensitive surface, an access channel being designed in such a way that air and/or a gas is transferable through the open access channel between a spatial surroundings of the sensor/detection device and the sensitive surface, and an at least partially water-impermeable membrane having respectively an inner side of the membrane facing the associated access channel being designed in such a way that a contact surface on the respective inner side of the respective membrane is pressed against an associated membrane contact surface on the associated access channel in such a way that the associated access channel is sealed in a liquid-tight manner when an outer side of the respective membrane or a covering layer on the respective outer side of the membrane is wetted with at least a minimum quantity of liquid and the respective membrane is deformed.

Abstract: A device is described for protecting components, housings and the like against liquids and for ventilating the same, including at least one first layer, the first layer being configured as a diaphragm and this has a first area in such a way that the first area is configured as gas-permeable and liquid-tight below a first liquid pressure, and at least one second layer, the second layer being connected pressure-tight at least in part to the first layer, and having a second area that is configured in such a way that the first area and the second area interact for sealing against a liquid at a liquid pressure greater than or equal to the first liquid pressure.

Abstract: A micromechanical sensor device is described that includes an integrated housing seal, a micromechanical sensor assembly, and a corresponding manufacturing method. The micromechanical sensor device with an integrated housing seal is equipped with a micromechanical sensor chip that includes an upper side and a lower side, a sensor area that may be brought into contact with an environmental medium being provided on or at the upper side, and is equipped with at least one circumferential trench, open toward the upper side, that is provided in the periphery of the sensor area and that is at least partly filled with a sealing medium for sealing a corresponding area of a housing to be mounted thereon.

Abstract: A sensor and/or sound detection device having a sensing device having a sensitive surface, an access channel being designed in such a way that air and/or a gas is transferable through the open access channel between a spatial surroundings of the sensor/detection device and the sensitive surface, and an at least partially water-impermeable membrane having respectively an inner side of the membrane facing the associated access channel being designed in such a way that a contact surface on the respective inner side of the respective membrane is pressed against an associated membrane contact surface on the associated access channel in such a way that the associated access channel is sealed in a liquid-tight manner when an outer side of the respective membrane or a covering layer on the respective outer side of the membrane is wetted with at least a minimum quantity of liquid and the respective membrane is deformed.

Abstract: A method for manufacturing a micromechanical component and a micromechanical component. The micromechanical component includes a sensor substrate and a cap situated thereon. For creating the cap, a plurality of openings is introduced into a cap substrate in a delimited area on the surface of the front side in the form of microperforations. The openings end in the cap substrate, i.e. they do not go all the way through the cap substrate and are therefore shallow. The cap substrate is then placed on the sensor substrate, whereby the front side of the cap substrate including the plurality of openings is directed toward the sensor substrate. A portion of the cap substrate is removed from its back side by back-thinning using a grinding process or another semiconductor process. The removal of the cap substrate material from the back side creates access to the openings.