Abstract: Electrically conductive adhesive composition consisting essentially of polymeric binder, for example, "bouncing putty," conductive particles having at least their surfaces constituted by a noble metal and a normally liquid polyhydric alcohol, for example, glycerol.

Abstract: A diode-forming layered structure comprising a semiconductor body having a layered coating thereon, said semiconductor having a surface region of given conductivity type, said coating being a dispersed metal particle-polymer coating which before electrical activation displays a high electrical resistance but after electrical activation is highly conductive, said electrical activation resulting in the formation of a diode in the zone of contact between the coating and the semiconductor body, a plurality of such layered structures, in a two-dimensional array based on a common semiconductor body, being useful in the formation of a read-only memory (ROM), an alterable read-only memory (AROM) or a random access memory (RAM).

Abstract: Disclosed herein is a method for making an electrically conductive rigid cellular structure which comprises (i) coating the exposed surface of a porous, heat or solvent-removable substrate with a mixture of aluminum powder and titanate ester, (ii) decomposing the titanate ester of the mixture to effect cohesive binding of the coating, (iii) removing the substrate, and (iv) heating the remaining structure to develop electrical conductivity.