Abstract: A method for manufacturing a polarizer utilizes a support, which is coated with a photoresist. A carbon nanotube film is located over the photoresist, and one portion of the carbon nanotube film is submerged in the photoresist. Metal or semi-metallic particles are deposited over the carbon nanotube film and the photoresist, which is removed. The carbon nanotube film with the metal particles or semi-metallic particles is adhered to a substrate to obtain the polarizer.

Abstract: A planar illuminating device includes a number of light sources and an optical sheet positioned at a side of the light sources. The optical sheet includes an incident surface facing the light sources and an emergent surface opposite to the incident surface. The incident surface includes a number of protruding prism structures. The emergent surface includes a number of concave diffusing micro-structures.

Abstract: A method for press molding a lens array is provided. First, a mold core is provided. The mold core has a first surface having a first alignment formed thereon using a lithography method, and a lens molding surface array and a second alignment formed thereon using an ultra-precision machining method. Then, a substrate is provided. The substrate has a second surface having a third alignment mark formed thereon using the lithography method. The substrate is first aligned with the mold core by aligning the third alignment mark with the first alignment mark, then is further aligned by offsetting the substrate the spacing between the first and second alignment marks to align the center of the substrate with the center of the lens molding surface array. Finally, a molding material is applied on the substrate, then the mold core is applied on the molding material to press mold the lens array.

Abstract: Manufacturing spherical Fresnel lens includes providing a first optical element with a regular hexagonal first Fresnel micro-lens in the center of the first optical element and six regular hexagonal second Fresnel micro-lens arrayed around the first Fresnel micro-lens. One edge of the second Fresnel micro-lens is connected to one edge of the first Fresnel micro-lens. The first optical element is stressed to yield a spherical cap configuration of the first optical element, and a second optical element is provided matched to the first optical element, and including a plurality of Fresnel micro-lens. The second optical element is bent into a curve shaped configuration having a curvature as the bent first optical element, and a number of bent second optical elements are assembled around the bent first optical element in sequence to form a hemispherical-shaped configuration.

Abstract: A method for manufacturing a light emitting diode package, includes: providing a light emitting chip structure comprising a substrate and a light emitting layer; treating the light emitting layer to form at least two spaced light emitting chips on the substrate, the light emitting chips each comprising a first surface away from the substrate and a second surface; forming a first carbon nanotube layer covering the first surfaces of the at least two spaced light emitting chips; removing the substrate; forming a second carbon nanotube layer on the second surfaces of the light emitting chips, thus obtaining a first carbon nanotube layer and a second carbon nanotube layer on opposite sides of the at least two spaced light emitting chips; and packaging the light emitting chip structure to obtain the light emitting diode package.

Abstract: The present application provides a method and semiconductor packaging structure comprising a conductive substrate having a first surface, a first lateral surface and a second lateral surface adjacent to the first surface. A first electrode line with two ends are provided on the first surface and the first lateral surface, and a second electrode line with two ends are provided on the first surface and a second lateral surface respectively. A semiconductor device is provided on the first surface of the conductive substrate which electrically connected to the first electrode line and the second electrode line, a protective plate with through holes covers the first surface, and a sheathing overlays the semiconductor device.

Abstract: An illumination device includes a lampshade, a heat dissipation module, a light module and a lamp cap. The lampshade includes a shell and an optical lens fixed on the shell. The heat dissipation module includes a plurality of heat sinks, a bottom plate coupled to the heat sinks, and a cavity defined in the center of the heat dissipation module. The light module is received in the cavity and toward the optical lens, including a substrate and a light source mounted on the substrate. The lamp cap is coupled to the heat dissipation module and away from the optical lens.

Abstract: A first lens having a first bottom surface and a first top surface at opposite sides thereof; and a first supporter having a first supporting surface and a second supporting surface at opposite sides thereof, the first supporting surface being flat, the second supporting surface being in contact with the first bottom surface, the first supporter being made of transparent material, and a refraction index of the first supporter being different from a refraction index of the first lens. A lens assembly array and method of making the lens assembly array are also provided.

Abstract: An optical fiber connector includes a housing, a plurality of lenses fixed to the housing, a plurality of optical fibers, and a glue. The housing defines a plurality of blind holes and receiving cavities. Each blind hole includes a first receiving hole portion. Each receiving cavity is in communication with the corresponding first receiving hole portion. Each optical fiber is received in the corresponding blind hole and includes a core portion. The glue is applied in each receiving cavity and fixes the optical fibers in the housing. Along a lengthwise direction of each blind hole, a projection of each receiving cavity on a plane perpendicular to the lengthwise direction covers that of the core portion. The glue surrounds the core portion, and a distal end of the core portion contacts an inner surface of the housing in the corresponding receiving cavity facing the respective blind hole.

Abstract: The present application provides a method and semiconductor packaging structure comprising a conductive substrate having a first surface, a first lateral surface and a second lateral surface adjacent to the first surface. A first electrode line with two ends are provided on the first surface and the first lateral surface, and a second electrode line with two ends are provided on the first surface and a second lateral surface respectively. A semiconductor device is provided on the first surface of the conductive substrate which electrically connected to the first electrode line and the second electrode line, a protective plate with through holes covers the first surface, and a sheathing overlays the semiconductor device.

Abstract: An exemplary light emitting diode package includes a housing, and a light emitting unit received in the housing. The light emitting unit includes a first carbon nanotube layer, a plurality of spaced light emitting chips, and a second carbon nanotube layer. The light emitting chips are formed on the first carbon nanotube layer. The second carbon nanotube layer covers the light emitting chips.

Abstract: A first lens having a first bottom surface and a first top surface at opposite sides thereof; and a first supporter having a first supporting surface and a second supporting surface at opposite sides thereof, the first supporting surface being flat, the second supporting surface being in contact with the first bottom surface, the first supporter being made of transparent material, and a refraction index of the first supporter being different from a refraction index of the first lens. A lens assembly array and method of making the lens assembly array are also provided.

Abstract: A light guide body includes a first solidified colloid layer, a second solidified colloid layer and a third solidified colloid layer. The first solidified colloid layer has a number of light-scattering microstructures at an upper portion thereof. The second solidified colloid layer is formed on and coming into contact with the upper portion of the first colloid layer, and the second colloid layer covers the microstructures. The third solidified colloid layer is formed on the second colloid layer, and the third colloid layer has a plurality of light condensing prisms at an opposite side thereof to the second colloid layer. The light guide body has an integral structure with a number of optical functions. A method for making the light guide body is also provided.

Abstract: A method for manufacturing a light emitting diode package, includes: providing a light emitting chip structure comprising a substrate and a light emitting layer; treating the light emitting layer to form at least two spaced light emitting chips on the substrate, the light emitting chips each comprising a first surface away from the substrate and a second surface; forming a first carbon nanotube layer covering the first surfaces of the at least two spaced light emitting chips; removing the substrate; forming a second carbon nanotube layer on the second surfaces of the light emitting chips, thus obtaining a first carbon nanotube layer and a second carbon nanotube layer on opposite sides of the at least two spaced light emitting chips; and packaging the light emitting chip structure to obtain the light emitting diode package.

Abstract: A film producing system for producing optical film includes a glue dispenser, a conveyor including a flexible base, a compression molding device, and a light curing device. The glue dispenser is configured for receiving glue therein and dispensing the glue onto the flexible base. The flexible base is configured for carrying the glue dispensed thereon from the glue dispenser to the compression molding device. The compression molding apparatus configured for press molding the glue dispensed on the flexible base to a predetermined shape. The flexible base is configured for carrying the shaped glue from the compression molding device to the light curing device. The light curing device is configured for curing the glue shaped by the compression molding device. The compression molding device includes a rotating pressing roller and a fixed pressing blocking configured for shaping the glue on the flexible base to the predetermined shape.

Abstract: A guide light plate structure includes a light guide plate and a fluorescent layer. The light guide plate includes a light incident surface, a bottom surface, and a light emitting surface opposite to the bottom surface. The fluorescent layer is formed on the bottom surface. The fluorescent layer is conFIGUREd for being excited by the incident light to emit white light toward the light emitting surface.

Abstract: An exemplary method for making an alignment mark on a substrate includes the following steps. First, a substrate with a recess is provided. Second, a photoresist layer is formed on a surface of the substrate including in the recess. Third, the photoresist layer is exposed and developed to leave a body of remaining photoresist in the recess, with the body of remaining photoresist protruding above the surface of the substrate. Fourth, a metal layer is formed in an unfilled area of the recess and on the surface of the substrate, with the metal layer substantially surrounding the remaining photoresist. Finally, the remaining photoresist is removed to form an alignment mark in the metal layer on the substrate.

Abstract: An exemplary method for making a lens array having many lenses includes the follow steps. A light pervious substrate including a supporting surface is firstly provided. Secondly, a molten molding material is applied on the supporting surface. Thirdly, a pressing mold including many molding parts is provided, each molding part including a molding cavity for molding the lens. Fourthly, the pressing mold is pressed on the molten molding material. Fifthly, the molten molding material is half-cured, thereby forming a half-cured molding material. Sixthly, the half-cured molding material is pressed by the pressing mold. Seventhly, the half-cured molding material is fully cured to form each lens in each molding cavity. Finally, the pressing mold is removed from the light pervious substrate to form the lens array.

Abstract: A method for measuring illuminance of a lamp utilizes at least one illuminance meter and a rotary apparatus. The lamp is installed on the rotary apparatus. The lamp emits light and projects onto an irradiation area. A measurement area is defined from within the irradiation area. The measurement area is evenly divided into n sub-measurement areas, wherein n is a natural number. The n sub-measurement areas are centrosymmetric. At least one illuminance meter measuring illuminance of the lamp is disposed on one of the n sub-measurement areas. The rotary apparatus drives the lamp to rotate 360/n° in turn. The single illuminance meter measures illuminance of the lamp in other (n?1) sub-measurement areas.

Abstract: An apparatus for manufacturing optical elements at wafer level includes a lower mold core, an upper mold core, an aligning plate and an image pick-up device. The lower mold core has a lower alignment mark. The upper mold core has an upper alignment mark. The aligning plate has a first middle alignment mark corresponding to the lower alignment mark and a second middle alignment mark corresponding to the upper alignment mark. The image pick-up device is configured for capturing and analyzing images of the alignment marks to align the lower mold core, the aligning plate and the upper mold core.