Patents by Inventor Seigi Aoyama

Seigi Aoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080047747
    Abstract: An electromagnetic shielding filter has two transparent boards and a conductive mesh with plural wires, where the conductive mesh is sandwiched between the two transparent boards. The plural wires are formed of a Cu—Sn—In alloy or a Cu—Ag alloy.
    Type: Application
    Filed: July 30, 2007
    Publication date: February 28, 2008
    Applicant: HITACHI CABLE, LTD.
    Inventors: Seigi Aoyama, Toshiyuki Horikoshi, Hiromitsu Kuroda, Yuzo Ito, Hiroshi Komuro, Hiroshi Okikawa
  • Publication number: 20080011347
    Abstract: A connecting lead wire is used for a solar battery module in which a plurality of solar battery cells connected in series by an inter-connector are arranged. The connecting lead wire is provided with a trunk portion and one or more branch portions. In the trunk portion, an enamel coating layer is provided on a conductor. In each of the branch portions, a solder plating layer is provided on a conductor. The branch portion protrudes from the trunk portion in a lateral direction, and connected to an electrode of each of the solar battery cells. The branch portion connects the solar battery cells with each other.
    Type: Application
    Filed: July 12, 2007
    Publication date: January 17, 2008
    Inventors: Seigi Aoyama, Takayuki Tsuji, Hiroshi Okikawa, Hajime Nishi
  • Publication number: 20070235207
    Abstract: A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn and the oxidation control element is diffused to form an alloy.
    Type: Application
    Filed: April 6, 2007
    Publication date: October 11, 2007
    Applicant: HITACHI CABLE, LTD.
    Inventors: Takayuki Tsuji, Hiroshi Yamanobe, Hajime Nishi, Takeshi Usami, Seigi Aoyama, Masato Ito, Hiroshi Okikawa
  • Patent number: 7247795
    Abstract: A shield wire has a wire main body that has a conductor and an insulation covering the conductor. The conductor has a single wire or a stranded wire. A shield member is disposed on an outer circumference of the wire main body. The shield member has a tubular body having an inner sleeve, a braided shield and an outer sleeve, and a metal pipe is disposed on the outer circumference of the wire main body. The tubular body is electrically connected to the metal pipe at an end thereof. The shield wire further has a first connector member with a flange, wherein the first connector member is electrically connected to the tubular body at an other end of the tubular body where the tubular body is not connected to the metal pipe.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: July 24, 2007
    Assignee: Hitachi Cable. Ltd.
    Inventors: Toru Sumi, Seigi Aoyama, Nobuyuki Yamashita, Michiaki Shimizu, Hiroshi Okikawa
  • Publication number: 20070069971
    Abstract: An antenna having an antenna element bent in a predetermined shape. The antenna element has a plurality of line conductors that are arranged in parallel and are sandwiched by two insulation films. A method of making an antenna has the steps of: arranging in parallel a plurality of line conductors, each of which having a width of 0.04 mm or less, at intervals of 10 times or more the width of each of the line conductors; discharging continuously the plurality of line conductors such that visibility of the line conductors is reduced; and sandwiching continuously the discharged line conductors by planar transparent insulation films with a sticking or adhesion layer to have an antenna element.
    Type: Application
    Filed: September 20, 2006
    Publication date: March 29, 2007
    Applicant: HITACHI CABLE, LTD.
    Inventors: Toshiyuki Horikoshi, Masahiko Kobayashi, Seigi Aoyama, Hiroshi Yamanobe, Shinsuke Murano
  • Patent number: 7173188
    Abstract: A straight angle conductor 10 is provided with a cladding material including a core-sheet metal 11 and conductor-sheet metals 12a, 12b that sandwich both surfaces of the core-sheet metal 11. The conductor-sheet metals 12a, 12b having a volume resistivity equal to or less than 5.0 (??·cm) wraps both sides of the core-sheet metal 11 having a thermal expansion coefficient equal to or less than 10 (×10?6/C. °) to prevent the core-sheet metal 11 from being exposed to an outside of the conductor-sheet metals 12a, 12b. As a result, it prevents occurrence of an electrical potential difference in a boundary side face between the core-sheet metal 11 and the conductor-sheet metals 12a, 12b to improve corrosion resistance. Especially even when the straight angle conductor 10 is used on a silicon crystal wafer for a solar cell, damage of the silicon crystal wafer caused by heat occurring in soldering process of the conductor 10 or a change in temperature on use thereof for a solar cell is avoided.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: February 6, 2007
    Assignee: Hitachi Cable, Ltd.
    Inventors: Yuju Endo, Hakaru Matsui, Seigi Aoyama, Takaaki Ichikawa
  • Publication number: 20060292029
    Abstract: A soft copper alloy contains 10 mass ppm or less of oxygen, and more than 0.005 mass % and less than 0.6 mass % of indium. A soft copper alloy wire or plate material is manufactured by processing the soft copper alloy, wherein an average crystal grain size after annealing is 2 to 20 um.
    Type: Application
    Filed: June 23, 2005
    Publication date: December 28, 2006
    Applicant: Hitachi Cable, Ltd.
    Inventors: Seigi Aoyama, Yuju Endo, Hiroyoshi Hiruta
  • Patent number: 7148426
    Abstract: In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip conductor; and the plating provided on at least one side of the strip constructor, the plating having a shape such that the plating in the widthwise direction of the strip conductor has a bulge as viewed in section with the apex being located at a proper position in the widthwise direction of the strip conductor. By virtue of this constitution, the lead-free solder on its surface is less likely to be oxidized, and the connection lead has excellent bond strength owing to the property of the lead-free solder and, in addition, has the function of breaking the formed oxide layer and the function of removing included gas bubbles and can eliminate the need to form the plating in very large thickness.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: December 12, 2006
    Assignee: Hitachi Cable, Ltd.
    Inventors: Seigi Aoyama, Takaaki Ichikawa, Hiromitsu Kuroda, Takashi Nemoto, Atsushi Ohtake, Hiroyoshi Hiruta
  • Publication number: 20060157167
    Abstract: A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt.ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 ?m or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 ?m or less.
    Type: Application
    Filed: January 10, 2006
    Publication date: July 20, 2006
    Applicant: Hitachi Cable, Ltd.
    Inventors: Hiromitsu Kuroda, Kazuma Kuroki, Seigi Aoyama, Hiroyoshi Hiruta
  • Publication number: 20060137893
    Abstract: A shield wire has: a wire main body that has a conductor and an insulation covering the conductor, the conductor having a single wire or a stranded wire; and a shield member that is disposed on an outer circumference of the wire main body. The shield member has a tubular body having an inner sleeve, an braided shield and an outer sleeve, and a metal pipe is disposed on the outer circumference of the wire main body. The tubular body is electrically connected to the metal pipe at an end thereof. The shield wire further has a first connector member with a flange, wherein the first connector member is electrically connected to the tubular body at an other end of the tubular body where the tubular body is not connected to the metal pipe.
    Type: Application
    Filed: December 5, 2005
    Publication date: June 29, 2006
    Inventors: Toru Sumi, Seigi Aoyama, Nobuyuki Yamashita, Michiaki Shimizu, Hiroshi Okikawa
  • Publication number: 20050161129
    Abstract: A method of manufacturing a Cu alloy conductor comprises the steps of: adding and dissolving In of 0.1-0.7 weight % to a Cu matrix containing oxygen of 0.001-0.1 weight % (10-1000 weight ppm) to form a molten Cu alloy, performing a continuous casting with the molten Cu alloy, rapidly quenching a casting material to a temperature by at least 15° C. or more lower than a melting point of molten Cu alloy, controlling the casting material at a temperature equal to or lower than 900° C., and performing a plurality of hot rolling processes to the casting material such that a temperature of a final hot rolling is within a range of from 500 to 600° C. to form the rolled material.
    Type: Application
    Filed: October 22, 2004
    Publication date: July 28, 2005
    Inventors: Seigi Aoyama, Takaaki Ichikawa, Hiroyoshi Hiruta, Hiromitsu Kuroda
  • Publication number: 20050039943
    Abstract: A straight angle conductor 10 is provided with a cladding material including a core-sheet metal 11 and conductor-sheet metals 12a, 12b that sandwich both surfaces of the core-sheet metal 11. The conductor-sheet metals 12a, 12b having a volume resistivity equal to or less than 5.0 (??·cm) wraps both sides of the core-sheet metal 11 having a thermal expansion coefficient equal to or less than 10 (×106/C°) to prevent the core-sheet metal 11 from being exposed to an outside of the conductor-sheet metals 12a, 12b. As a result, it prevents occurrence of an electrical potential difference in a boundary side face between the core-sheet metal 11 and the conductor-sheet metals 12a, 12b to improve corrosion resistance. Especially even when the straight angle conductor 10 is used on a silicon crystal wafer for a solar cell, damage of the silicon crystal wafer caused by heat occurring in soldering process of the conductor 10 or a change in temperature on use thereof for a solar cell is avoided.
    Type: Application
    Filed: July 15, 2004
    Publication date: February 24, 2005
    Inventors: Yuju Endo, Hakaru Matsui, Seigi Aoyama, Takaaki Ichikawa
  • Publication number: 20040187977
    Abstract: A wire rod comprising high-purity copper having a total unavoidable impurity content of not more than 1 ppm by mass and, added to the high-purity copper, 1.0 to 5.0% by mass of silver having a purity of not less than 99.99% by mass is drawn to an ultrafine copper alloy wire with a diameter of not more than 0.08 mm. According to this constitution, since the content of foreign matter, causative of breaking of wires, in a base material has been minimized, excellent wire drawability and bending properties can be realized. Further, since silver is used as an additive element, the ultrafine copper alloy wire possesses excellent tensile strength. This constitution can further realize a stranded copper alloy wire conductor, and an extrafine coaxial cable possessing excellent tensile strength, wire drawability, and bending properties.
    Type: Application
    Filed: April 8, 2004
    Publication date: September 30, 2004
    Applicant: HITACHI CABLE, LTD.
    Inventors: Hakaru Matsui, Takaaki Ichikawa, Seigi Aoyama, Ryohei Okada, Osamu Seya
  • Patent number: 6751855
    Abstract: A process for forming an ultrafine copper alloy wire is provided. The alloy includes a copper matrix of high purity copper having a total unavoidable impurity content of not more than 10 mass ppm. The matrix contains 0.05 to 0.9 mass % of at least one metallic element of the group of tin, indium, silver, antimony, magnesium, aluminum, and boron. The alloy is melted in a carbon crucible. The molten alloy is cast into a wire rod utilizing a carbon mold. The wire rod is then subjected to a primary wire drawing, an annealing, and a secondary wire drawing. The produced ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: June 22, 2004
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hakaru Matsui, Takaaki Ichikawa, Koichi Tamura, Seigi Aoyama, Osamu Seya, Ryohei Okada
  • Patent number: 6649843
    Abstract: This invention provides a composite conductor having excellent strength, flexing resistance and corrosion resistance, a production method thereof and a cable employing the same composite conductor. A corrosion resistant layer is formed of Au, Ag, Sn, Ni, solder, Zn, Pd, Sn—Ni alloy, Ni—Co alloy, Ni—P alloy, Ni—Co—P alloy, Cu—Zn alloy, Sn—Bi alloy, Sn—Ag—cu alloy, Sn—Cu alloy or Sn—Zn alloy in the thickness of 0.5 &mgr;m or more on an external periphery of a core made of copper-metal fiber conductor. A wire material made of the copper-metal fiber conductor is subjected to area reduction processing. In the middle of the area reduction processing or after the area reduction processing is completed, corrosion resistant layer is formed on the periphery of the wire material in the thickness of 0.
    Type: Grant
    Filed: April 16, 2001
    Date of Patent: November 18, 2003
    Assignee: Hitachi Cable, Ltd.
    Inventors: Seigi Aoyama, Koichi Tamura, Takaaki Ichikawa, Hakaru Matsui, Osamu Seya, Fumitaka Nakahigashi
  • Patent number: 6627009
    Abstract: In an extrafine or ultrafine copper alloy wire having an outer diameter of not more than 0.1 mm, the copper alloy wire is formed of a heat treated copper alloy comprising 0.05 to 0.9% by weight in total of at least one metallic element selected from the group consisting of tin, indium, silver, antimony, magnesium, aluminum, and boron and not more than 50 ppm of oxygen with the balance consisting of copper. By virtue of this constitution, the extrafine or ultrafine copper alloy wire has a combination of excellent bending fatigue lifetime based on high tensile strength and excellent torsional strength based on high elongation or a combination of excellent tensile strength, electrical conductivity, and drawability and good elongation. The invention has been described in detail with particular reference to preferred embodiments, but it will be understood that variations and modifications can be effected within the scope of the invention as set forth in the appended claims.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: September 30, 2003
    Assignee: Hitachi Cable Ltd.
    Inventors: Hakaru Matsui, Takaaki Ichikawa, Seigi Aoyama, Koichi Tamura, Osamu Seya, Hiroshi Komuro, Ryohei Okada, Shigetoshi Goto
  • Publication number: 20030089518
    Abstract: An ultrafine copper alloy wire drawn to a diameter of not more than 0.08 mm is provided which is formed of an alloy comprising a copper matrix of high purity copper with a total unavoidable impurity content of not more than 10 mass ppm and, contained in the matrix, 0.05 to 0.9 mass % of at least one metallic element selected from the group consisting of tin, indium, silver, antimony, magnesium, aluminum, and boron. By virtue of this constitution, the ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.
    Type: Application
    Filed: December 4, 2002
    Publication date: May 15, 2003
    Applicant: Hitachi Cable, Ltd.
    Inventors: Hakaru Matsui, Takaaki Ichikawa, Koichi Tamura, Seigi Aoyama, Osamu Seya, Ryohei Okada
  • Patent number: 6521838
    Abstract: A flexible flat cable has a single conductor or a plurality of conductors, juxtaposed to each other or one another, which are sandwiched between a pair of plastic films with an adhesive to form an integral structure. The plastic films with an adhesive have a modulus of longitudinal elasticity of not less than 300 kg/mm2 and an elongation of not less than 20%. The plastic films are formed of a polyimide. The adhesive is formed of an epoxy having a glass transition temperature Tg of 80° C. or above, and the 180° peel strength between the adhesive and the single conductor or the plurality of conductors is not less than 0.5 kg/cm.
    Type: Grant
    Filed: July 24, 2001
    Date of Patent: February 18, 2003
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hiroshi Yamanobe, Takaaki Ichikawa, Seigi Aoyama, Tsutomu Komori, Masato Ito, Katsuo Endo, Noboru Nakakuki
  • Patent number: 6518505
    Abstract: An ultrafine copper alloy wire drawn to a diameter of not more than 0.08 mm is provided which is formed of an alloy having a copper matrix of high purity copper with a total unavoidable impurity content of not more than 10 mass ppm. Contained in the matrix is 0.05 to 0.9 mass % of at least one metallic element selected from the group including tin, indium, silver, antimony, magnesium, aluminum, and boron. By virtue of this constitution, the ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: February 11, 2003
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hakaru Matsui, Takaaki Ichikawa, Koichi Tamura, Seigi Aoyama, Osamu Seya, Ryohei Okada
  • Patent number: 6518503
    Abstract: In FFC1 integrated by sandwiching flat type conductors 2 between plastic films 3 with adhesives, wherein the conductors are formed of pure copper or a copper alloy having a wiredrawing draught of at least 95% and an elongation of at least 5%, and the plastic films with adhesives are formed of one having a modulus of longitudinal elasticity of at least 280 kg/mm2 and an elongation of at least 80%, and the 180° peel strength between the adhesives and the conductors 2 is made to be at least 0.8 kg/cm. As a result, even if the number of conductors 2 is increased than the conventional FFC, bending-resistant characteristic equal to or higher than the conventional FFC can be exhibited.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: February 11, 2003
    Assignee: Hitachi Cable, Ltd.
    Inventors: Hiroshi Yamanobe, Takaaki Ichikawa, Seigi Aoyama, Tsutomu Komori, Hidenori Kobayashi, Masato Ito, Katsuo Endo